Abstract: A substrate manufacturing method, an embedded substrate and a semiconductor are disclosed. The method includes: manufacturing a first semi-finished substrate including first circuit layers and a first dielectric layer arranged in staggered and laminated manner; arranging a viscous material layer on the first circuit layer to form a device adhering area; adhering an embedded device on the device adhering area, a pin face of the embedded device facing away from the viscous material layer; laminating a second dielectric layer on the first circuit layer, which covers the viscous material layer and the embedded device; manufacturing a first conductive pillar, a second conductive pillar and a second circuit layer, the first conductive pillar extending through the second dielectric layer and configured for connecting the second circuit layer with the first circuit layer, the second conductive pillar being configured for connecting the embedded device with the second circuit layer.

Abstract: A semiconductor package structure and a manufacturing method therefor are disclosed. The semiconductor package structure includes a package layer, a first device layer, a first insulation layer, a conductive copper pillar, and a second device layer. The package layer covers the first device layer. The first device layer, the first insulation layer, and the second device layer are sequentially stacked. The conductive copper pillar extends through the first insulation layer. The first device layer and the second device layer are electrically connected through the conductive copper pillar. The first device layer includes a first circuit layer, a trench, and an embedded device. The embedded device is connected to the first circuit layer. The trench is arranged below the embedded device. The trench is partially or completely overlapped with a projection of the embedded device in a mounting direction of the embedded device.

Abstract: A method for manufacturing a high-heat-dissipation mixed substrate includes: preparing a mother substrate, the mother substrate including an insulating layer and a temporary carrier plate which are laminated; arranging a plurality of first grooves and a plurality of first cavities on the mother substrate; filling the first groove with a thermally-conductive material to form a first thermally-conductive block, and adhering an embedded device in the first cavity and filling the first cavity with the thermally-conductive material to form a second thermally-conductive block; removing the temporary carrier plate to obtain a semi-finished substrate; manufacturing circuit layers on two opposite side surfaces of the semi-finished substrate to obtain a target mother substrate; and cutting the target mother substrate along region dividing lines to obtain a mixed substrate with a side surface being a thermally-conductive surface.

Abstract: A liquid circulating cooling package substrate includes a circulating cooling structure including a cooling chamber in a first dielectric layer to expose a heat dissipation face, a metal heat dissipation layer on the inner surface of the cooling chamber, an upright support column formed on a metal heat dissipation layer, and a cooling cover supported on the support column to close the cooling chamber along the periphery of the cooling chamber. The metal heat dissipation layer completely covers the heat dissipation face and the inner side surface of the cooling chamber, and a liquid inlet and a liquid outlet are formed on the cooling cover. A circulating cooling structure is provided in the first dielectric layer, and the circulating cooling structure is formed during the processing of an embedded package substrate such that the processing flow is simple and the cost is low.

Abstract: A manufacturing method for a substrate embedded with integrated inductor includes: providing a bearing plate; manufacturing a first conduction copper column on the bearing plate; arranging a first dielectric layer on the bearing plate which covers the first conduction copper column; opening the first dielectric layer to form a first opening; filling a magnetic material at the first opening; grinding the first dielectric layer so that surfaces of the first conduction copper column and the magnetic material are flush with a surface of the first dielectric layer; removing the bearing plate, etching a metal layer on the surface of the first dielectric layer to form a package substrate; arranging a first circuit layer and a solder mask layer on an upper surface and a lower surface of the package substrate; and forming a window in the solder mask layer corresponding to the first circuit layer.

Abstract: A carrier plate for preparing a package substrate according to an embodiment includes a dielectric layer, a seed layer in the dielectric layer, and a copper pillar layer on the seed layer. A bottom end of the seed layer is higher than a lower surface of the dielectric layer. A top end of the copper pillar layer is lower than an upper surface of the dielectric layer. The upper and lower surfaces of the dielectric layer are respectively provided with a first metal layer and a second metal layer.