Patents by Inventor Judith A. Schmidt

Judith A. Schmidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-aqueous dispersion of polymer particles in reactive diluent
    Patent number: 8883882
    Abstract: The invention relates to a non-aqueous dispersion of organic polymer particles in a reactive diluent. Said non-aqueous dispersion can be obtained in that at least one monomer is polymerized in the reactive diluent, forming the organic polymer particles, wherein the reactive diluent does not participate in said polymerization due to the orthogonal reactivity thereof relative to the monomers, but comprises a functionality allowing later targeted polymerization. Depending on the organic polymer particles or reactive diluents used, the non-aqueous dispersion can be used in multifaceted applications having a wide range of application profiles. In order to produce said non-aqueous dispersion, polymerization of at least one monomer in a stirred tank reactor in the presence of a reactive diluent is particularly suitable, wherein the conversion is performed at a stirring speed of at least 2 m/s, wherein the ratio of the stirrer diameter to the vessel diameter is set to 0.3-0.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: November 11, 2014
    Assignee: Dritte Patentportfolio Beteiligungygesellschaft MbH & Co. KG
    Inventors: Nicolas Boge, Torsten Stachelhaus, Andreas Kreipl, Dalibor Vukadlnovic-Tenter, Klaus-Uwe Koch, Daniel Junghans, Angela Kaufmann, Nicole Jagielski, Judith Schmidt
  • Methods for etching the edge of a silicon wafer
    Patent number: 8309464
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: November 13, 2012
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
  • NON-AQUEOUS DISPERSION OF POLYMER PARTICLES IN REACTIVE DILUENT
    Publication number: 20120149832
    Abstract: The invention relates to a non-aqueous dispersion of organic polymer particles in a reactive diluent. Said non-aqueous dispersion can be obtained in that at least one monomer is polymerized in the reactive diluent, forming the organic polymer particles, wherein the reactive diluent does not participate in said polymerization due to the orthogonal reactivity thereof relative to the monomers, but comprises a functionality allowing later targeted polymerization. Depending on the organic polymer particles or reactive diluents used, the non-aqueous dispersion can be used in multifaceted applications having a wide range of application profiles. In order to produce said non-aqueous dispersion, polymerization of at least one monomer in a stirred tank reactor in the presence of a reactive diluent is particularly suitable, wherein the conversion is performed at a stirring speed of at least 2 m/s, wherein the ratio of the stirrer diameter to the vessel diameter is set to 0.3-0.
    Type: Application
    Filed: March 31, 2010
    Publication date: June 14, 2012
    Applicant: Drite Patentportfolio Betelligungsgesellschagt mbH
    Inventors: Nicolas Boge, Torsten Stachelhaus, Andreas Kreipl, Dalibor Vukadlnovic-Tenter, Klaus-Uwe Koch, Daniel Junghans, Angela Kaufmann, Nicole Jagielski, Judith Schmidt
  • Edge etched silicon wafers
    Patent number: 8192822
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: June 5, 2012
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
  • EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER
    Publication number: 20090242126
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 1, 2009
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland Vandamme, Guoqiang (David) Zhang
  • EDGE ETCHED SILICON WAFERS
    Publication number: 20090246444
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 1, 2009
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
  • METHODS FOR ETCHING THE EDGE OF A SILICON WAFER
    Publication number: 20090247055
    Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 1, 2009
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
  • Silicon wafer etching process and composition
    Patent number: 7323421
    Abstract: A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: January 29, 2008
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Henry F. Erk, Guoqiang (David) Zhang, Mick Bjelopavlic, Alexis Grabbe, Jozef G. Vermeire, Judith A. Schmidt, Thomas E. Doane, James R. Capstick
  • Silicon wafer etching process and composition
    Publication number: 20060011588
    Abstract: A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.
    Type: Application
    Filed: June 14, 2005
    Publication date: January 19, 2006
    Inventors: Mark Stinson, Henry Erk, Guoqiang Zhang, Mick Bjelopavlic, Alexis Grabbe, Jozef Vermeire, Judith Schmidt, Thomas Doane, James Capstick
  • Process for etching silicon wafers
    Publication number: 20040108297
    Abstract: A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water and a source of hydroxide ions and generally characterized by a lower concentration of water and/or higher concentration of source of hydroxide ions. In accordance with another embodiment, the caustic etchant includes a salt additive. The process produces silicon wafers with improved surface characteristics such as flatness and nanotopography.
    Type: Application
    Filed: September 18, 2003
    Publication date: June 10, 2004
    Applicant: MEMC Electronic Materials, Inc.
    Inventors: Henry F. Erk, James R. Capstick, Thomas E. Doane, Alexis Grabbe, Judith A. Schmidt, Annlie Sing, Mark G. Stinson, Guoqiang (David) Zhang
  • Process for etching silicon wafers
    Publication number: 20020034881
    Abstract: The present invention relates to an aqueous etching solution, a method for tailoring the composition of the solution to provide a desired surface quality for a given quantity of stock to be removed, a process for etching a silicon wafer using said solution.
    Type: Application
    Filed: June 29, 2001
    Publication date: March 21, 2002
    Inventors: Milind S. Kulkarni, Henry F. Erk, Judith Schmidt