Abstract: A portable electronic device can include a housing at least partially defining an internal volume, a set of temperature sensors disposed in the internal volume, a display assembly, and a processor or main logic board. The set of temperature sensors can be positioned adjacent to or affixed to components of the portable electronic device. The processor can determine a temperature of an environment based on an adjustment factor and weighted temperature measurements taken by a subset of the set of temperature sensors.

Abstract: An electronic device that includes a circuit board and a shield designed to cover the circuit board is disclosed. The shield can provide radio frequency shielding, thermal energy dissipation, and desense mitigation. The shield provides added structural benefits. For example, the thermal assembly can be made with a non-metal material, such as graphite. Further, the thermally assembly may include multiple graphite layers secured by adhesive layers. Additionally, the shield can rely upon adhesives/tapes to adhere to a metal wall located on a perimeter of the circuit board. In this manner, the shield can provide a compliant body that conforms to the position and location of the metal wall, account for tolerance variations in the metal wall, and thus prevent bending of the metal wall, as opposed to using rigid metal bodies. Based on the adhesive properties, the shield requires no holes for fasteners.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: An electronic device has a display with a pixel array overlapping an array of temperature sensors. Control circuitry in the device may gather temperature measurements from the temperature sensor array. The control circuitry may apply a global offset to the temperature measurements and may apply a damping factor to the globally offset measurements to produce a two-dimensional temperature profile for the display. A look-up table or other data structure may be used to store information on pixel color correction gain values as a function of temperature. This temperature-gain information and temperature information from the two-dimensional temperature profile may be used by display circuitry in the device to display color-corrected images on the display.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: An electronic device has a display with a pixel array overlapping an array of temperature sensors. Control circuitry in the device may gather temperature measurements from the temperature sensor array. The control circuitry may apply a global offset to the temperature measurements and may apply a damping factor to the globally offset measurements to produce a two-dimensional temperature profile for the display. A look-up table or other data structure may be used to store information on pixel color correction gain values as a function of temperature. This temperature-gain information and temperature information from the two-dimensional temperature profile may be used by display circuitry in the device to display color-corrected images on the display.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.