Abstract: Methods of electrodeposition and electroless deposition are disclosed which afford super-filling of high-aspect ratio features on wafers by exposing wafers and electrolytic solutions in which they are immersed to conditions effective to induce reduction of metal ions in the electrolytic solution, preferably by a multiple step reduction, whereby electrodeposition of metal occurs at a bottom of each of the features until the features are substantially super-filled. Systems for performing such methods are described as are the resulting wafers produced thereby.