Patents by Inventor Judith Grünauer
Judith Grünauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240117223Abstract: The invention relates to polyvinal aromate-polydiene-block copolymer-based adhesive compounds that contain at least one type of a cationically curable reactive resin and that result, when cured, in improved thermal shear strength. The invention further relates to adhesive strips that contain at least one layer of such an adhesive compound, and a method of production.Type: ApplicationFiled: February 7, 2022Publication date: April 11, 2024Applicant: tesa SEInventors: Judith GRUENAUER, Thilo DOLLASE, Bernd LUEHMANN, Jessika GARGIULO
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Patent number: 10633559Abstract: A method comprising bonding an element to one or more bonding substrates by inductive heating using a magnetic field whose frequency is situated in a frequency range from 100 Hz to 200 kHz. The element comprises at least one electrically conducting layer having an electrical conductivity of more than 40 MS/m for 300K and at least one heat-activatable adhesive layer coated onto at least one side of the electrically conducting layer, and the heat-activatable adhesive layer comprises at least one thermally conductive filler. The material of the thermally conductive filler has a thermal conductivity of at least 0.5 W/(m*K) and is electrically nonconducting such that the element provides, in a direction perpendicular to the areal extent of the element, an electrical breakdown resistance, as determined in accordance with VDE 0100.Type: GrantFiled: January 27, 2017Date of Patent: April 28, 2020Assignee: TESA SEInventors: Hans Karl Engeldinger, Judith Grünauer, Klaus Keite-Telgenbüscher
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Patent number: 10323163Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.Type: GrantFiled: December 5, 2013Date of Patent: June 18, 2019Assignee: TESA SEInventors: Klaus Keite-Telgenbüscher, Jan Ellinger, Judith Grünauer, Anika Petersen
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Publication number: 20170145260Abstract: A method comprising bonding an element to one or more bonding substrates by inductive heating using a magnetic field whose frequency is situated in a frequency range from 100 Hz to 200 kHz. The element comprises at least one electrically conducting layer having an electrical conductivity of more than 40 MS/m for 300K and at least one heat-activatable adhesive layer coated onto at least one side of the electrically conducting layer, and the heat-activatable adhesive layer comprises at least one thermally conductive filler. The material of the thermally conductive filler has a thermal conductivity of at least 0.5 W/(m*K) and is electrically nonconducting such that the element provides, in a direction perpendicular to the areal extent of the element, an electrical breakdown resistance, as determined in accordance with VDE 0100.Type: ApplicationFiled: January 27, 2017Publication date: May 25, 2017Applicant: tesa SEInventors: Hans Karl Engeldinger, Judith Grünauer, Klaus Keite-Telgenbüscher
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Patent number: 9543549Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.Type: GrantFiled: May 27, 2013Date of Patent: January 10, 2017Assignee: TESA SEInventors: Minyoung Bai, Jan Ellinger, Judith Grünauer, Klaus Keite-Telgenbüscher, Anika Petersen
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Patent number: 9487684Abstract: Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of the coupling reagent, n is a whole number between 2 and 10, A is a polymer made of a vinyl aromatic compound and B is a polymer block made of an alkene or diene, wherein this polymer block can also be hydrated, with the condition that at least part of the A blocks is sulfonated, optionally with two-block copolymers in the form of A-B as an admixture component, and (ii) at least one tackifier resin.Type: GrantFiled: March 25, 2013Date of Patent: November 8, 2016Assignee: tesa SEInventors: Thorsten Krawinkel, Klaus Keite-Telgenbüsher, Judith Grünauer, Jan Ellinger
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Patent number: 9422466Abstract: Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and (ii) at least one tackifier resin, and (iii) at least one metal complex with a substitutable complexing agent.Type: GrantFiled: March 25, 2013Date of Patent: August 23, 2016Assignee: TESA SEInventors: Klaus Keite-Telgenbüsher, Jan Ellinger, Judith Grünauer, Thorsten Krawinkel
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Patent number: 9230829Abstract: The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.Type: GrantFiled: November 3, 2011Date of Patent: January 5, 2016Assignee: TESA SEInventors: Klaus Telgenbüscher, Judith Grünauer, Jan Ellinger
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Publication number: 20150337174Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.Type: ApplicationFiled: December 5, 2013Publication date: November 26, 2015Inventors: Klaus Keite-Telgenbüscher, Jan Ellinger, Judith Grünauer, Anika Petersen
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Publication number: 20150162568Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.Type: ApplicationFiled: May 27, 2013Publication date: June 11, 2015Applicant: TESA SEInventors: Minyoung Bai, Jan Ellinger, Judith Grünauer, Klaus Keite-Telgenbüscher, Anika Petersen
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Publication number: 20150099081Abstract: An adhesive strip, with improved barrier effect, encapsulates electronic arrangements against permeates, whereby the composite system comprises at least (a) an adhesive strip containing at least one pressure-sensitive adhesive substance for direct application on a substrate; and (b) at least one release liner which lies directly upon the pressure-sensitive adhesive substance, wherein the surface of the release liner, that faces the pressure-sensitive adhesive substance, has a surface roughness of less that 100 nm, measured as an arithmetic mean Sa as per ISO/FDIS 25178-2:2011 of the amounts of at least 10,000 height values of the profile of a partial surface of at least 200 ?m×200 ?m. A method produces a release liner with a smooth surface for equipping barrier adhesive strips by removing the liner in order to encapsulate electronic arrangements with the adhesive strip.Type: ApplicationFiled: February 7, 2013Publication date: April 9, 2015Inventors: Minyoung Bai, Thilo Dollase, Jan Ellinger, Judith Grünauer
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Publication number: 20150079389Abstract: Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of the coupling reagent, n is a whole number between 2 and 10, A is a polymer made of a vinyl aromatic compound and B is a polymer block made of an alkene or diene, wherein this polymer block can also be hydrated, with the condition that at least part of the A blocks is sulfonated, optionally with two-block copolymers in the form of A-B as an admixture component, and (ii) at least one tackifier resin.Type: ApplicationFiled: March 25, 2013Publication date: March 19, 2015Inventors: Thorsten Krawinkel, Klaus Keite-Telgenbüsher, Judith Grünauer, Jan Ellinger
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Publication number: 20150064462Abstract: Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and (ii) at least one tackifier resin, and (iii) at least one metal complex with a substitutable complexing agent.Type: ApplicationFiled: March 25, 2013Publication date: March 5, 2015Inventors: Klaus Keite-Telgenbüsher, Jan Ellinger, Judith Grünauer, Thorsten Krawinkel
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Patent number: 8840748Abstract: A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.Type: GrantFiled: October 8, 2010Date of Patent: September 23, 2014Assignee: tesa SEInventors: Anja Staiger, Klaus Keite-Telgenbüscher, Judith Grünauer, Hans Karl Engeldinger
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Publication number: 20130264724Abstract: The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.Type: ApplicationFiled: November 3, 2011Publication date: October 10, 2013Applicant: Tesa SEInventors: Klaus Telgenbüscher, Judith Grünauer, Jan Ellinger
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Publication number: 20130020022Abstract: A heat-activatedly bondable sheetlike element having at least one electrically conductive sheetlike structure and at least two layers of different heat-activable adhesives. A first heat-activatable adhesive layer is located substantially on a first side of the electrically conductive sheetlike structure and the second heat-activatable adhesive layer is located substantially on a second side of the electrically conductive sheetlike structure. Activation temperatures for achieving the adhesive properties of the heat-activatable adhesive layers differ from one another less than the melting temperatures of the two heat-activatable adhesive layers.Type: ApplicationFiled: December 7, 2010Publication date: January 24, 2013Inventors: Klaus Keite-Telgenbüscher, Hans Karl Engeldinger, Judith Grünauer
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Publication number: 20130000811Abstract: A heat-activated, glueable sheetlike element having at least one heat-activatable adhesive, at least one inductively heatable material, and at least one thermally conductive filler, wherein material of the thermally conductive filler has a thermal conductivity of at least 0.Type: ApplicationFiled: December 7, 2010Publication date: January 3, 2013Applicant: Tesa SEInventors: Hans Karl Engeldinger, Judith Grünauer, Klaus Keite-Telgenbüscher
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Publication number: 20120279647Abstract: A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.Type: ApplicationFiled: October 8, 2010Publication date: November 8, 2012Inventors: Anja Staiger, Klaus Keite-Telgenbüscher, Judith Grünauer, Karl Hans Engeldinger
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Publication number: 20120064318Abstract: A novel, transparent, non-substrate-based permeation barrier film for encapsulating electronic, more particularly optoelectronic, assemblies consists of a first polymer layer (10), a first inorganic barrier layer (20), at least one at least partially organic compensation layer (30), at least one further inorganic barrier layer (21) and also at least one further polymer layer (11), wherein the polymer layers and the inorganic barrier layers, respectively, can be made of the same or different material, wherein the inorganic barrier layers have a thickness of between 2 and 1000 nm, and wherein the polymer layers and the at least partially organic compensation layer have a thickness of less than 5 [mu]m, preferably between 0.5 and 4 [mu]m. The film can have, on one or both sides, an auxiliary carrier attached by means of a re-releasable adhesive. It is also possible for a plurality of films to be laminated to one another by means of a further at least partially organic compensation layer.Type: ApplicationFiled: April 8, 2010Publication date: March 15, 2012Applicant: TESA SEInventors: Klaus Keite-Telgenbüscher, Judith Grünauer, Jan Ellinger