Abstract: Highly conductive electrical traces formed over mechanical steps or on non-planar surfaces with linewidths of 10 to 100 ?m and a method for forming such electrical traces are disclosed. The method employs two steps, with the first step using an aerosol jet printing (AJP) process to form thin electrical traces that serve as the seed layers for the second step. The first step preferably employs multiple passes with the AJP to create multiple seed sub-layers with improved continuity and conductivity. In the second step, the seed layers are subjected to an electrodeposition process that forms the bulk of the thickness of the electrical traces. The electrodeposition process may include one, two, or three phases at corresponding low or high biases, with low biases providing denser, more highly conductive plating sub-layers, while high biases provide plating sub-layers having better gap bridging properties.

Abstract: Hybrid additive featured plates used to form an overall microchannel heat exchanger and corresponding method of manufacture are disclosed. Various additive manufacturing (AM) techniques may be used to form walls defining microchannel features on a plate substrate. The manufacturing method is a hybrid process in that leverages both additive and conventional manufacturing techniques to minimize both cost and fabrication time.

Abstract: An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

Abstract: A method, system and apparatus, the method including positioning a microelectronic device on a carrier substrate; coupling the microelectronic device to a roller assembly; and rotating the roller assembly to transport the microelectronic device from the carrier substrate to a receiving substrate. The system including a carrier substrate configured to support a microelectronic device; a roller assembly configured to receive and transport the microelectronic device; and a receiving substrate dimensioned to receive the microelectronic device from the roller assembly. An apparatus for parallel assembly of microelectronic devices on a module including a laterally translatable carrier substrate configured to move a plurality of microelectronic devices in a first direction; a rotatable cylindrical body having a plurality of device openings dimensioned to receive the microelectronic devices; and a laterally translatable receiving substrate configured to move in a second direction.