Abstract: The invention relates to the technical field of cohesive bandages. The invention relates to a bandage comprising a flat web material as a substrate, both main sides of the substrate being coated at least partially with a hot-melt adhesive. The invention also relates to a hot-melt adhesive for producing a bandage, to the use of a hot-melt adhesive for producing bandages, and to a method for producing a bandage. The hot-melt adhesive is based on a first polyolefin having—a proportion of 1-butene-derived monomer units; a proportion of ethylene-derived monomer units; and the hot-melt adhesive further comprises: at least one tackifier consisting of hydrocarbon resin and/or of hydrogenated hydrocarbon resin. The hot-melt adhesive can also contain a second polyolefin, preferably an amorphous polypropylene homo- or copolymer.

Abstract: A hot-melt formulation useful as a wound dressing comprises a chemically crosslinked polymer matrix obtainable from prepolymers crosslinkable by means of photopolymerization. Hydrocolloids are embedded in the chemically crosslinked polymer, matrix. The formulation is obtainable by combining the prepolymers and hydrocolloids, and heating and processing the mixture through a slot die, wherein the mixture has a viscosity of less than 100 Pa*s and a processing temperature of less than 150° C. The prepolymers are crosslinked by means of photopolymerization by irradiation with UV light.

Abstract: The invention relates to a hot-melt composition, especially for using as an absorbent medical or cosmetic article, preferably as a wound dressing, and containing (a) a chemically cross-linked polymer matrix, and (b) hydrocolloids which are embedded in the chemically cross-linked polymer matrix. The inventive composition can be obtained by processing a melt in a hot melt method, said melt having a melting viscosity of less than 100 Pa*s, preferably less than 75 Pa*s, and especially preferably less than 50 Pa*s, at a processing temperature of less than 150° C., preferably less than 140° C., and especially preferably less than 130° C.