Patents by Inventor Judith Sultenfuss Archer

Judith Sultenfuss Archer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6069026
    Abstract: This invention relates to the fabrication and assembly of semiconductor chips, substrates, and modules, and more particularly to methods and apparatus for achieving flexible, low-cost manufacturing. Commercial and military systems today are placing increasing demands on flexible application and reliable operation, as well as on simplified manufacturing.
    Type: Grant
    Filed: August 18, 1997
    Date of Patent: May 30, 2000
    Assignee: Texas Instruments Incorporated
    Inventors: Robert E. Terrill, Judith Sultenfuss Archer
  • Patent number: 6033931
    Abstract: A three-dimensional microchip circuit assembly process, wherein a three-layer dry adhesive film sandwich is used to prepare a stacked circuit cube.
    Type: Grant
    Filed: January 18, 1999
    Date of Patent: March 7, 2000
    Assignee: Texas Instruments Incorporated
    Inventors: Emily Ellen Hoffman, Judith Sultenfuss Archer
  • Patent number: 5892287
    Abstract: A three-dimensional semiconductor circuit assembly wherein each of several circuit chips is provided with patterned metal layers that extend from the circuit surface onto an edge side of the chip, then the chips are adhesively bonded to opposite surfaces of one or more dielectric spacers, respectively, whereby the edge sides of the resulting multiple-chip stack are readily connected to metal patterns on a substrate.
    Type: Grant
    Filed: August 18, 1997
    Date of Patent: April 6, 1999
    Assignee: Texas Instruments
    Inventors: Emily Ellen Hoffman, Judith Sultenfuss Archer