Patents by Inventor Judson D. Ryckman
Judson D. Ryckman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11320584Abstract: Accelerating photonic and opto-electronic technologies requires breaking current limits of modern chip-scale photonic devices. While electronics and computer technologies have benefited from “Moore's Law” scaling, photonic technologies are conventionally limited in scale by the wavelength of light. Recent sub-wavelength optical devices use nanostructures and plasmonic devices but still face fundamental performance limitations arising from metal-induced optical losses and resonance-induced narrow optical bandwidths. The present disclosure instead confines and guides light at deeply sub-wavelength dimensions while preserving low-loss and broadband operation. The wave nature of light is used while employing metal-free (all-dielectric) nanostructure geometries which effectively “pinch” light into ultra-small active volumes, for potentially about 100-1000× reduction in energy consumption of active photonic components such as phase-shifters.Type: GrantFiled: May 8, 2020Date of Patent: May 3, 2022Assignee: Clemson UniversityInventors: Judson D. Ryckman, Nazmus Sakib
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Publication number: 20220069990Abstract: Systems and methods of producing unclonable devices are disclosed. Robust optical physical unclonable function devices use disordered photonic integrated circuits. Optical physical unclonable functions based on speckle patterns, chaos, or ‘strong’ disorder are so far notoriously sensitive to probing and/or environmental variations. A presently disclosed optical physical unclonable function is designed for robustness against fluctuations in optical angular/spatial alignment, polarization, and temperature using an integrated quasicrystal interferometer which sensitively probes disorder. All modes are engineered to exhibit approximately the same confinement factor in the predominant thermo-optic medium (e.g., silicon) and for constraining the transverse spatial-mode and polarization degrees of freedom. Silicon photonic quasicrystal interferometry is used for secure hardware applications.Type: ApplicationFiled: June 22, 2021Publication date: March 3, 2022Inventors: JUDSON D. RYCKMAN, YINGJIE LAO, FARHAN BIN-TARIK, AZADEH GHOLAMREZAZADEH-FAMILI
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Publication number: 20200355868Abstract: Accelerating photonic and opto-electronic technologies requires breaking current limits of modern chip-scale photonic devices. While electronics and computer technologies have benefited from “Moore's Law” scaling, photonic technologies are conventionally limited in scale by the wavelength of light. Recent sub-wavelength optical devices use nanostructures and plasmonic devices but still face fundamental performance limitations arising from metal-induced optical losses and resonance-induced narrow optical bandwidths. The present disclosure instead confines and guides light at deeply sub-wavelength dimensions while preserving low-loss and broadband operation. The wave nature of light is used while employing metal-free (all-dielectric) nanostructure geometries which effectively “pinch” light into ultra-small active volumes, for potentially about 100-1000× reduction in energy consumption of active photonic components such as phase-shifters.Type: ApplicationFiled: May 8, 2020Publication date: November 12, 2020Inventors: JUDSON D. RYCKMAN, NAZMUS SAKIB
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Patent number: 10564353Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.Type: GrantFiled: July 16, 2018Date of Patent: February 18, 2020Assignee: Intel CorporationInventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
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Publication number: 20190025512Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.Type: ApplicationFiled: July 16, 2018Publication date: January 24, 2019Inventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
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Patent number: 10054740Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.Type: GrantFiled: December 29, 2016Date of Patent: August 21, 2018Assignee: INTEL CORPORATIONInventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
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Publication number: 20180188453Abstract: Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.Type: ApplicationFiled: December 29, 2016Publication date: July 5, 2018Inventors: Yoel Chetrit, Judson D. Ryckman, Jeffrey B. Driscoll, Harel Frish, Ling Liao
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Patent number: 9889504Abstract: Provided are methods for imprinting a porous material, the methods including applying a first stamp to a porous material having an average pore size of less than about 100 ?m, the first stamp having at least a first portion having a first height, a second portion having a second height and a third portion having a third height, wherein the first height, second height and third height are different.Type: GrantFiled: December 11, 2013Date of Patent: February 13, 2018Assignee: Vanderbilt UniversityInventors: Sharon M. Weiss, Judson D. Ryckman, Yang Jiao
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Publication number: 20170336565Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a single mode optical coupler device. In some embodiments, the device may include a multi-stage optical taper to convert light from a first mode field diameter to a second mode field diameter larger than the first mode field diameter, and a mirror formed in a dielectric layer under an approximately 45 degree angle with respect to a plane of the dielectric layer to reflect light from the multi-stage optical taper substantially perpendicularly to propagate the light in a single mode fashion. Other embodiments may be described and/or claimed.Type: ApplicationFiled: September 30, 2016Publication date: November 23, 2017Inventors: Judson D. Ryckman, Harel Frish, George A. Ghiurcan, Ansheng Liu, Haisheng Rong, Pradeep Srinivasan, Carsten Brandt, Isako Hoshino, Michael A. Creighton
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Patent number: 9715066Abstract: Embodiments herein relate to orthogonally coupling light transmitted from a photonic transmitter chip. An optical apparatus may include a splitter to split light from a light source into a first path and a second path, and a grating to receive light from the first path at a first side and light from the second path at a second side opposite the first side to transmit diffracted light from the first path and the second path in a direction orthogonal to the photonic transmitter chip. Other embodiments may be described and/or claimed.Type: GrantFiled: December 24, 2015Date of Patent: July 25, 2017Assignee: Intel CorporationInventor: Judson D. Ryckman
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Publication number: 20170184796Abstract: Embodiments herein relate to orthogonally coupling light transmitted from a photonic transmitter chip. An optical apparatus may include a splitter to split light from a light source into a first path and a second path, and a grating to receive light from the first path at a first side and light from the second path at a second side opposite the first side to transmit diffracted light from the first path and the second path in a direction orthogonal to the photonic transmitter chip. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 24, 2015Publication date: June 29, 2017Inventor: Judson D. Ryckman
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Patent number: 9593981Abstract: Provided are patterned nanoporous gold (“P-NPG”) films that may act as at least one of an effective and stable surface-enhanced Raman scattering (“SERS”) substrate. Methods of fabricating the P-NPG films using a low-cost stamping technique are also provided. The P-NPG films may provide uniform SERS signal intensity and SERS signal intensity enhancement by a factor of at least about 1×107 relative to the SERS signal intensity from a non-enhancing surface.Type: GrantFiled: September 20, 2011Date of Patent: March 14, 2017Assignee: Vanderbilt UniversityInventors: Sharon M. Weiss, Yang Jiao, Judson D. Ryckman, Peter N. Ciesielski, G. Kane Jennings
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Patent number: 9352543Abstract: Provided are methods of patterning porous materials on the micro- and nanometer scale using a direct imprinting technique. The present methods of direct imprinting of porous substrates (“DIPS”), can utilize reusable stamps that may be directly applied to an underlying porous material to selectively, mechanically deform and/or crush particular regions of the porous material, creating a desired structure. The process can be performed in a matter of seconds, at room temperature or higher temperatures, and eliminates the requirement for intermediate masking materials and etching chemistries.Type: GrantFiled: May 31, 2010Date of Patent: May 31, 2016Assignee: Vanderbilt UniversityInventors: Sharon M. Weiss, Judson D. Ryckman, Marco Liscidini, John E. Sipe
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Publication number: 20140255653Abstract: Provided are methods for imprinting a porous material, the methods including applying a first stamp to a porous material having an average pore size of less than about 100 ?m, the first stamp having at least a first portion having a first height, a second portion having a second height and a third portion having a third height, wherein the first height, second height and third height are different.Type: ApplicationFiled: December 11, 2013Publication date: September 11, 2014Inventors: Sharon M. Weiss, Judson D. Ryckman, Yang Jiao
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Publication number: 20130182249Abstract: Provided are patterned nanoporous gold (“P-NPG”) films that may act as at least one of an effective and stable surface-enhanced Raman scattering (“SERS”) substrate. Methods of fabricating the P-NPG films using a low-cost stamping technique are also provided. The P-NPG films may provide uniform SERS signal intensity and SERS signal intensity enhancement by a factor of at least about 1×107 relative to the SERS signal intensity from a non-enhancing surface.Type: ApplicationFiled: September 20, 2011Publication date: July 18, 2013Applicant: Vanderbilt UniversityInventors: Sharon M. Weiss, Yang Jiao, Judson D. Ryckman, Peter N. Ciesielski, G. Kane Jennings
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Patent number: 8349617Abstract: Diffraction gratings comprising a substrate with protrusions extending therefrom. In one embodiment, the protrusions are made of a porous material, for example porous silicon with a porosity of greater than about 10%. The diffraction grating may also be constructed from multiple layers of porous material, for example porous silicon with a porosity of greater than about 10%, with protrusion of attached thereto. In some embodiments the protrusions may be made from photoresist or another polymeric material. The gratings are the basis for sensitive sensors. In some embodiments, the sensors are functionalized with selective binding species, to produce sensors that specifically bind to target molecules, for example chemical or biological species of interest.Type: GrantFiled: May 31, 2010Date of Patent: January 8, 2013Assignee: Vanderbilt UniversityInventors: Sharon M. Weiss, Judson D. Ryckman, Christopher Kang, Marco Liscidini, John E. Sipe
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Publication number: 20110059538Abstract: Diffraction gratings comprising a substrate with protrusions extending therefrom. In one embodiment, the protrusions are made of a porous material, for example porous silicon with a porosity of greater than about 10%. The diffraction grating may also be constructed from multiple layers of porous material, for example porous silicon with a porosity of greater than about 10%, with protrusion of attached thereto. In some embodiments the protrusions may be made from photoresist or another polymeric material. The gratings are the basis for sensitive sensors. In some embodiments, the sensors are functionalized with selective binding species, to produce sensors that specifically bind to target molecules, for example chemical or biological species of interest.Type: ApplicationFiled: May 31, 2010Publication date: March 10, 2011Inventors: Sharon M. Weiss, Judson D. Ryckman, Christopher Kang, Marco Liscidini, John E. Sipe
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Publication number: 20110056398Abstract: Provided are methods of patterning porous materials on the micro- and nanometer scale using a direct imprinting technique. The present methods of direct imprinting of porous substrates (“DIPS”), can utilize reusable stamps that may be directly applied to an underlying porous material to selectively, mechanically deform and/or crush particular regions of the porous material, creating a desired structure. The process can be performed in a matter of seconds, at room temperature or higher temperatures, and eliminates the requirement for intermediate masking materials and etching chemistries.Type: ApplicationFiled: May 31, 2010Publication date: March 10, 2011Inventors: Sharon M. Weiss, Judson D. Ryckman, Marco Liscidini, John E. Sipe