Patents by Inventor Judson R. Sharples

Judson R. Sharples has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for controlling pH during planarization and cleaning of microelectronic substrates
    Patent number: 7214125
    Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: May 8, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Judson R. Sharples, Kenneth F. Zacharias, Guy F. Hudson
  • Method for controlling pH during planarization and cleaning of microelectronic substrates
    Patent number: 6913523
    Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.
    Type: Grant
    Filed: March 22, 2004
    Date of Patent: July 5, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Judson R. Sharples, Kenneth F. Zacharias, Guy F. Hudson
  • Method for controlling PH during planarization and cleaning of microelectronic substrates
    Publication number: 20040192174
    Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.
    Type: Application
    Filed: March 22, 2004
    Publication date: September 30, 2004
    Inventors: Judson R. Sharples, Kenneth F. Zacharias, Guy F. Hudson
  • Method for controlling pH during planarization and cleaning of microelectronic substrates
    Patent number: 6716089
    Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: April 6, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Judson R. Sharples, Kenneth F. Zacharias, Guy F. Hudson
  • Apparatus for controlling PH during planarization and cleaning of microelectronic substrates
    Patent number: 6368194
    Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: April 9, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Judson R. Sharples, Kenneth F. Zacharias, Guy F. Hudson
  • Method and apparatus for controlling pH during planarization and cleaning of microelectronic substrates
    Publication number: 20020019197
    Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.
    Type: Application
    Filed: April 24, 2001
    Publication date: February 14, 2002
    Inventors: Judson R. Sharples, Kenneth F. Zacharias, Guy F. Hudson
  • Method for controlling pH during planarization and cleaning of microelectronic substrates
    Patent number: 6220934
    Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.
    Type: Grant
    Filed: July 23, 1998
    Date of Patent: April 24, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Judson R. Sharples, Kenneth F. Zacharias, Guy F. Hudson