Patents by Inventor Judy Hermann

Judy Hermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10436647
    Abstract: The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: October 8, 2019
    Assignee: MAXIM INTEGRATED PRODUCTS, INC.
    Inventors: Jerome C. Bhat, Kuolung Lei, Craig A. Easson, Arvin Emadi, Judy Hermann
  • Publication number: 20190101454
    Abstract: The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.
    Type: Application
    Filed: October 2, 2018
    Publication date: April 4, 2019
    Inventors: Jerome C. Bhat, Kuolung Lei, Craig A. Easson, Arvin Emadi, Judy Hermann
  • Patent number: 10113915
    Abstract: The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: October 30, 2018
    Assignee: MAXIM INTEGRATED PRODUCTS, INC.
    Inventors: Jerome C. Bhat, Kuolung Lei, Craig A. Easson, Arvin Emadi, Judy Hermann