Patents by Inventor Jue Peng

Jue Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanically rotating intravascular ultrasound probe
    Patent number: 10499877
    Abstract: A mechanically rotating intravascular ultrasound probe relates to the technical field of medical devices, and aims to provide a forward-looking mechanically rotating intravascular ultrasound probe having a small volume, a high image resolution and good imaging stability. The intravascular ultrasound probe includes a catheter, an ultrasonic transducer disposed at a front end of a cavity of the catheter and a driving apparatus that drives the ultrasonic transducer to rotate mechanically. The driving apparatus is a micro motor disposed in the cavity of the catheter, including a rotor and a stator.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: December 10, 2019
    Assignee: SHENZHEN UNIVERSITY
    Inventors: Jue Peng, Siping Chen, Tianfu Wang
  • MECHANICALLY ROTATING INTRAVASCULAR ULTRASOUND PROBE
    Publication number: 20150297182
    Abstract: A mechanically rotating intravascular ultrasound probe relates to the technical field of medical devices, and aims to provide a forward-looking mechanically rotating intravascular ultrasound probe having a small volume, a high image resolution and good imaging stability. The intravascular ultrasound probe includes a catheter, an ultrasonic transducer disposed at a front end of a cavity of the catheter and a driving apparatus that drives the ultrasonic transducer to rotate mechanically. The driving apparatus is a micro motor disposed in the cavity of the catheter, including a rotor and a stator.
    Type: Application
    Filed: April 17, 2015
    Publication date: October 22, 2015
    Inventors: Jue PENG, Siping CHEN, Tianfu WANG
  • Fabrication of piezoelectric single crystalline thin layer on silicon wafer
    Patent number: 8536665
    Abstract: The present invention relates a method of fabricating a piezoelectric device through micromachining piezoelectric-on-silicon wafer. The wafers are constructed so that piezoelectric layer is a single wafer having a thin layer from 5 to 50 ?m.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: September 17, 2013
    Assignee: The Hong Kong Polytechnic University
    Inventors: Jue Peng, Chen Chao, Ji-yan Dai, Helen L. W. Chan
  • Fabrication of piezoelectric single crystalline thin layer on silicon wafer
    Publication number: 20090050987
    Abstract: The present invention relates a method of fabricating a piezoelectric device through micromachining piezoelectric-on-silicon wafer. The wafers are constructed so that piezoelectric layer is a single wafer having a thin layer from 5 to 50 ?m.
    Type: Application
    Filed: August 22, 2007
    Publication date: February 26, 2009
    Applicant: The Hong Kong Polytechnic University
    Inventors: Jue Peng, Chen Chao, Ji Yan Dai, Helen L.W. Chan