Patents by Inventor Jue TAN

Jue TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240002596
    Abstract: A resin composition includes the following components or a prepolymer thereof: (A) 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1), having a pH value of 10 or less. In Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time. The prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B). An article is made from the resin composition.
    Type: Application
    Filed: June 24, 2022
    Publication date: January 4, 2024
    Inventors: Rongtao WANG, Chenyu SHEN, Jue TAN
  • Patent number: 11827786
    Abstract: A resin composition includes: (A) a polyphenylene ether resin of Formula (1) and (B) a compound of Formula (3), and/or a compound of Formula (4), and/or a compound of Formula (5). An article is made from the resin composition. The article made from the resin composition may include a prepreg, a resin film, a laminate or a printed circuit board, and one or more properties including resin filling void, glass transition temperature, Z-axis ratio of thermal expansion, dielectric constant, dissipation factor, and warpage may be improved.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: November 28, 2023
    Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
    Inventors: Chenyu Shen, Jue Tan
  • Publication number: 20230151213
    Abstract: A resin composition includes: (A) a polyphenylene ether resin of Formula (1) and (B) a compound of Formula (3), and/or a compound of Formula (4), and/or a compound of Formula (5). An article is made from the resin composition. The article made from the resin composition may include a prepreg, a resin film, a laminate or a printed circuit board, and one or more properties including resin filling void, glass transition temperature, Z-axis ratio of thermal expansion, dielectric constant, dissipation factor, and warpage may be improved.
    Type: Application
    Filed: December 22, 2021
    Publication date: May 18, 2023
    Inventors: Chenyu SHEN, Jue TAN
  • Patent number: 11566127
    Abstract: A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: January 31, 2023
    Assignee: Elite Material Co., Ltd.
    Inventors: Yan Zhang, Jue Tan, Rongtao Wang
  • Publication number: 20220112318
    Abstract: A resin composition includes: (A) a polybutadiene having a content of 1,2-vinyl group of greater than or equal to 85%; and (B) a styrene-butadiene-styrene triblock copolymer of Formula (1) comprising a butadiene block having a content of 1,2-vinyl group of greater than or equal to 80%. Moreover, an article may be made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board. The resin composition or the article made therefrom may achieve improvement in one or more properties including Z-axis ratio of thermal expansion, thermal resistance after moisture absorption, dissipation factor, and dissipation factor aging variation under moisture and heat.
    Type: Application
    Filed: November 24, 2020
    Publication date: April 14, 2022
    Inventors: Zhenfang SHANG, Jue TAN, Chenyu SHEN, Yan ZHANG
  • Patent number: 11180653
    Abstract: A resin composition includes a vinyl-containing polyphenylene ether resin and a prepolymer, wherein the prepolymer is prepared by prepolymerization of a mixture which at least includes a divinylbenzene, a triallyl compound and a diallyl isophthalate. An article made from the resin composition is also provided, which includes a prepreg, a resin film, a laminate or a printed circuit board. The article achieves improvements in at least one properties of glass transition temperature, copper foil peeling strength, dissipation factor, inner resin flow, melt viscosity, minimum dynamic viscosity, resin filling property in open area, and water resistance.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: November 23, 2021
    Assignee: Elite Electronic Material (Kunshan) Co., Ltd.
    Inventors: Yan Zhang, Jue Tan, Rongtao Wang, Shu-Hao Chang
  • Patent number: 11174385
    Abstract: A resin composition comprises: an unsaturated bond-containing polyphenylene ether resin; a maleimide resin of Formula (1); and a compound of Formula (2) or Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength and dissipation factor.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: November 16, 2021
    Assignee: Elite Material Co., Ltd.
    Inventors: Chenyu Shen, Yan Zhang, Jue Tan, Rongtao Wang
  • Patent number: 11174386
    Abstract: A resin composition includes: (A) a vinyl-containing polyphenylene ether resin; (B) a resin of Formula (1); and (C) an inorganic filler. Moreover, also provided is an article made from the resin composition described above, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dissipation factor, comparative tracking index, X-axis thermal expansion coefficient, and temperature coefficient of dielectric constant.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: November 16, 2021
    Assignee: Elite Electronic Material (Kunshan) Co., Ltd.
    Inventors: Chenyu Shen, Yan Zhang, Jue Tan, Rongtao Wang, Chen-Yu Hsieh
  • Publication number: 20210189120
    Abstract: A resin composition includes a vinyl-containing polyphenylene ether resin and a prepolymer, wherein the prepolymer is prepared by prepolymerization of a mixture which at least includes a divinylbenzene, a triallyl compound and a diallyl isophthalate. An article made from the resin composition is also provided, which includes a prepreg, a resin film, a laminate or a printed circuit board. The article achieves improvements in at least one properties of glass transition temperature, copper foil peeling strength, dissipation factor, inner resin flow, melt viscosity, minimum dynamic viscosity, resin filling property in open area, and water resistance.
    Type: Application
    Filed: April 17, 2020
    Publication date: June 24, 2021
    Inventors: Yan ZHANG, Jue TAN, Rongtao WANG, Shu-Hao CHANG
  • Publication number: 20210139691
    Abstract: A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.
    Type: Application
    Filed: December 17, 2019
    Publication date: May 13, 2021
    Inventors: Yan ZHANG, Jue TAN, Rongtao WANG
  • Publication number: 20210108076
    Abstract: A resin composition includes: (A) a vinyl-containing polyphenylene ether resin; (B) a resin of Formula (1); and (C) an inorganic filler. Moreover, also provided is an article made from the resin composition described above, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dissipation factor, comparative tracking index, X-axis thermal expansion coefficient, and temperature coefficient of dielectric constant.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 15, 2021
    Inventors: Chenyu SHEN, Yan ZHANG, Jue TAN, Rongtao WANG, Chen-Yu HSIEH
  • Publication number: 20210032463
    Abstract: A resin composition comprises: an unsaturated bond-containing polyphenylene ether resin; a maleimide resin of Formula (1); and a compound of Formula (2) or Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength and dissipation factor.
    Type: Application
    Filed: August 26, 2019
    Publication date: February 4, 2021
    Inventors: Chenyu SHEN, Yan ZHANG, Jue TAN, Rongtao WANG
  • Patent number: 10889672
    Abstract: A prepolymerized resin and a method of preparing the prepolymerized resin are provided, the method comprising a step of prepolymerizing t-butyl styrene and unsaturated bond-containing polyphenylene oxide. The unsaturated bond-containing polyphenylene oxide comprises: methacrylate-terminated polyphenylene oxide, vinylbenzyl-terminated polyphenylene oxide, vinylbenzyl-modified bisphenol A polyphenylene oxide resin, vinyl-containing chain-extended polyphenylene oxide resin or a combination thereof. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: January 12, 2021
    Assignee: Elite Electronic Material (Kunshan) Co., Ltd.
    Inventors: Yan Zhang, Rongtao Wang, Mingsheng Yuan, Jue Tan
  • Publication number: 20200087432
    Abstract: A prepolymerized resin and a method of preparing the prepolymerized resin are provided, the method comprising a step of prepolymerizing t-butyl styrene and unsaturated bond-containing polyphenylene oxide. The unsaturated bond-containing polyphenylene oxide comprises: methacrylate-terminated polyphenylene oxide, vinylbenzyl-terminated polyphenylene oxide, vinylbenzyl-modified bisphenol A polyphenylene oxide resin, vinyl-containing chain-extended polyphenylene oxide resin or a combination thereof. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.
    Type: Application
    Filed: December 6, 2018
    Publication date: March 19, 2020
    Inventors: Yan ZHANG, Rongtao WANG, Mingsheng YUAN, Jue TAN