Abstract: An AC LED module having surge protection function includes: an insulation seat, formed with a first surface and a second surface, wherein a concave area is formed on the first surface, and an opening is formed at a substantially central portion of the concave area; an annular fasten member, fastened in the concave area of the insulation seat, and formed with at least one buckle structure for being combined with a reflection cup; a circuit board, installed with a LED light source, wherein the circuit board is fastened on the second surface of the insulation seat, and the LED light source is aligned with the opening; and a surge absorbing member, disposed at the exterior of the insulation seat and electrically coupled to an AC power input port of the circuit board, thereby preventing the circuit board from being damaged by an AC surge.

Abstract: A compact LED module includes: a circuit substrate, formed with an opening, a pair of combination holes and at least one through via area formed with a plurality of through vias; a reflection cup, formed with a light inlet, a light outlet and a pair of combination posts, wherein the pair of combination posts are combined with the pair of combination holes for allowing the reflection cup to be fastened on a first surface of the circuit substrate, and the light inlet is aligned with the opening; and a LED unit, installed with a LED light source and formed with at least one soldering area, wherein each of the soldering areas is connected to each of the through via areas by utilizing solder, thereby allowing the LED unit to be fastened on a second surface of the circuit substrate, and the LED light source is aligned with the opening.

Abstract: An illumination device includes a light-emitting module and a lampshade module. The light-emitting module includes a circuit substrate and a light-emitting unit. The lampshade module includes a casing structure disposed on the circuit substrate, a carrying structure detachably disposed on the casing structure, and a replaceable lampshade structure detachably disposed on the carrying structure. The casing structure has at least two first positioning portions, the carrying structure has at least two second positioning portions, and the carrying structure is detachably positioned on the casing structure by matching the two first positioning portions and the two second positioning portions. The carrying structure has at least two first retaining portions, the replaceable lampshade structure has at least two second retaining portions, and the replaceable lampshade structure is detachably positioned on the carrying structure by matching the two first retaining portions and the two second retaining portions.

Abstract: A light emitting module includes a base unit, a substrate unit, a light emitting unit and a driving unit. The base unit includes a base body having a horizontal carrying surface and at least one inclined carrying surface. The inclined carrying surface is inclined by a predetermined angle relative to the horizontal carrying surface. The substrate unit includes a bendable substrate disposed on the base body. The bendable substrate has a horizontal portion disposed on the horizontal carrying surface, at least one inclined portion disposed on the inclined carrying surface, and at least one bending portion disposed between the horizontal and the inclined portions. The inclined portion is inclined by a predetermined angle relative to the horizontal portion. The light emitting unit includes at least one light emitting group disposed on the horizontal portion. The driving unit includes a plurality of electronic components disposed on the inclined portion.

Abstract: The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.

Abstract: An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.

Abstract: This invention discloses a vapor chamber and a method for manufacturing the same. The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.

Abstract: This invention discloses a vapor chamber and a manufacturing method thereof. The vapor chamber includes a casing, a working fluid, a waterproof layer, and a wick structure layer. The working fluid is filled into the casing. The waterproof layer is formed on inner walls of the casing. The wick structure layer is formed on the waterproof layer.

Abstract: An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.

Abstract: A heat pipe includes an elongated casing (10), a wick (13), at least one artery mesh (12), and working medium filling in the casing. The casing has an evaporating section (101) and a condensing section (102). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion (121) and a small portion (122) with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.

Abstract: A vapor chamber includes a chamber, a working fluid, a lower wick structure, and a plurality of supporting elements. The chamber includes an upper cover and a bottom plate and contains the working fluid. The lower wick structure is located at the bottom plate. The supporting elements are disposed in the chamber and connect the upper cover and the bottom plate to support the upper cover. Each of the supporting elements and the upper cover form a first inclined angle. The working fluid in the vapor phase flows from the upper cover back to the bottom plate through the supporting elements after condensed.

Abstract: A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.

Abstract: An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.

Abstract: A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.

Abstract: A heat pipe includes an elongated casing (10), a wick (13), at least one artery mesh (12), and working medium filling in the casing. The casing has an evaporating section (101) and a condensing section (102). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion (121) and a small portion (122) with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.

Abstract: A heat pipe (10) includes a casing (11) and a composite wick structure (14). The casing includes an evaporator section (15) and a condenser section (16). The wick structure includes a plurality of grooves (142, 143) and an artery mesh (145). The grooves at the evaporator section each have a smaller groove width and a smaller apex angle (A1) than those of each of the grooves at the condenser section. A method for manufacturing the heat pipe includes: providing a casing with a plurality of grooves axially defined therein; shrinking a diameter of one portion of the casing to obtain an evaporator section of the heat pipe; placing an artery mesh to contact with an inner wall of the casing; vacuuming the casing and placing a working fluid in the casing; sealing the casing to obtain the heat pipe.

Abstract: A heat pipe (10) includes a metal casing (12) having an evaporator section (121) and a condenser section (122). A major wick structure (14) is disposed on an inner wall of the casing. At least one assistant wick structure (16) is disposed in and contacts with the major wick structure, and working medium fills in the casing and saturates the major wick structure and the at least one assistant wick structure. An average pore size of the major wick structure corresponding to the evaporator section is smaller than that of the major wick structure corresponding to the condenser section. A diameter of a cross section of the at least one assistant wick structure is smaller than a diameter of a cross section of the major wick structure, and thus the at least one assistant wick structure has a linear contact with the major wick structure.

Abstract: A heat dissipation apparatus includes a heat sink (30) and a heat spreader (10). The heat spreader includes a heating area (11) and a cooling area (13), and defines a vapor chamber (16) therein. A plurality of artery meshes (151) are arranged in the vapor chamber and extend from the heating area towards the cooling area. A working medium is contained in the artery meshes. The artery meshes are located between wick structures (15a, 15b) attached to a top cover (14) and a base plate (12) of the heat spreader, respectively, and contact therewith.

Abstract: A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.

Abstract: A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.