Patents by Inventor Juei-Pin Chen

Juei-Pin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR BONDING PLASTIC COMPONENT TO PRINTED CIRCUIT BOARD
    Publication number: 20210212215
    Abstract: A method for bonding aplastic component to a printed circuit board includes the steps of: a) providing the plastic component, the printed circuit board, and at least one positioning member, b) disposing at least one welding layer, c) positioning the plastic component and the printed circuit board relative to each other, d) melting the at least one welding layer while the plastic component is maintained in a positioning position, and e) cooling the at least one welding layer while the plastic component is maintained in the positioning position.
    Type: Application
    Filed: May 8, 2020
    Publication date: July 8, 2021
    Inventors: JUEI-PIN CHEN, HUAI-AN WU, WEI SHEN
  • Method for bonding plastic component to printed circuit board
    Patent number: 11044818
    Abstract: A method for bonding a plastic component to a printed circuit board includes the steps of: a) providing the plastic component, the printed circuit board, and at least one positioning member, b) disposing at least one welding layer, c) positioning the plastic component and the printed circuit board relative to each other, d) melting the at least one welding layer while the plastic component is maintained in a positioning position, and e) cooling the at least one welding layer while the plastic component is maintained in the positioning position.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: June 22, 2021
    Assignee: Forward Optics Co., Ltd.
    Inventors: Juei-Pin Chen, Huai-An Wu, Wei Shen