Abstract: An approach for methodology, and an associated system, enabling a prioritizing of devices, circuits, and modules of interest is disclosed. Embodiments include: determining a first electrical layout indicating an electrical performance of a physical layout of an IC design, the first electrical layout indicating a plurality of devices of the physical layout; selecting a subset of the plurality of the devices based on one or more connections of the devices; and generating a second electrical layout indicating the electrical performance of the physical layout, the second electrical layout indicating the selected devices without at least one of the plurality of devices.

Abstract: Methods for forming a semiconductor device include forming self-aligned trenches, in which a first set of trenches is used to align a second set of trenches. Methods taught herein can be used as a pitch doubling technique, and may therefore enhance device integration. Further, employing a very thin CMP stop layer, and recessing surrounding materials by about an equal amount to the thickness of the CMP stop layer, provides improved planarity at the surface of the device.

Abstract: Methods for forming a semiconductor device include forming self-aligned trenches, in which a first set of trenches is used to align a second set of trenches. Methods taught herein can be used as a pitch doubling technique, and may therefore enhance device integration. Further, employing a very thin CMP stop layer, and recessing surrounding materials by about an equal amount to the thickness of the CMP stop layer, provides improved planarity at the surface of the device.