Abstract: An integrated circuit comprises a control unit, a plurality of control inputs for the provision of control signals to said control unit and a deactivation circuit for disabling the provision of at least one of said control signals. After reception of a first coded message by said integrated circuit the provision of at least one of said control signals to the control unit can be disabled by said deactivation circuit.

Abstract: A nonvolatile semiconductor memory device includes transistor-based memory cells. Each memory cell has a first and a second source/drain region, a channel region separating the first and the second source/drain region, a storage layer and a control gate. The control gates of the memory cells are connected to word lines. The first and second source/drain regions are connected to bit lines respectively. Each memory cell may be programmed by injecting first charge carriers of a first polarity and may be erased by injecting second charge carriers having the opposite polarity into the storage layer respectively. By applying a high stress voltage between bit line and word line, weak insulator structures may break through such that they become detectable as short-circuits by a low voltage leakage test. By applying the stress voltage contemporaneously on both sides of the memory cells, an early overerase/overprogram, resulting from hot carrier injection, is avoided.

Abstract: An integrated circuit comprises a control unit, a plurality of control inputs for the provision of control signals to said control unit and a deactivation circuit for disabling the provision of at least one of said control signals. After reception of a first coded message by said integrated circuit the provision of at least one of said control signals to the control unit can be disabled by said deactivation circuit.

Abstract: A method for fabricating a drain/source path is provided, in which essentially firstly a nitride layer is applied, on which a TEOS layer is then patterned. The patterning is effected in a simplified manner by virtue of the fact that the nitride layer acts as an etching stop layer during the etching away of the TEOS layer.

Abstract: Word lines of a semiconductor component are provided with an encapsulation of dielectric material, Spacers of oxide extend alongside at the sidewalls of the word lines. The spacers are subsequently covered together with the word lines with a nitride layer. Borophosporosilicate glass is introduced between those portions of the nitride layer which respectively belong to a word line and is removed selectively with respect to the nitride using a mask. Contact hole fillings for the electrical connection of the buried bit lines are introduced into the contact holes thus formed.

Abstract: Word lines of a semiconductor component are provided with an encapsulation of dielectric material, Spacers of oxide extend alongside at the sidewalls of the word lines. The spacers are subsequently covered together with the word lines with a nitride layer. Borophosporosilicate glass is introduced between those portions of the nitride layer which respectively belong to a word line and is removed selectively with respect to the nitride using a mask. Contact hole fillings for the electrical connection of the buried bit lines are introduced into the contact holes thus formed.