Abstract: An integrated circuit (IC) comprises a resistive switching section (1) with an active layer (14) arranged between a first electrode (11) and a second electrode (12), wherein the resistive switching section (1) is configured: —to provide an electrical resistance between the first and second electrode (11, 12) which is switchable between different resistance values (LR, HR) depending on an electrical signal (U, I) applied to the first and the second electrode (11, 12), and—to emit photons (15) during or associated with switching between the resistance values (LR, HR).

Abstract: The invention relates to an integrated circuit (1), comprising: a substrate (10) which supports an electrooptic or optoelectric transducer (11) and a capacitor (12), wherein at least one electrically conductive element of the transducer (11) and at least one electrically conductive element of the capacitor (12) are arranged at the same level with respect to the substrate (10). The invention further relates to a method for fabricating the same.

Abstract: A push-pull device (10) comprises: a first waveguide (W1) arranged between its first and second electrode (S11, S12) and a second waveguide (W2) arranged between its first and a second electrode (S21, S22). Electrically conductive structures (T11, T12, T21, T22) extend away from one or more of the electrodes (S11, S12, S21, S22) for electrically connecting at least two of the electrodes (S11, S12, S21, S22). The waveguides (W1, W2) and the electrodes (S11, S12, S21, S22) originate from a pre-fabrication process. The waveguides (W1, W2) are poled by a poling (P) originating from a poling process.

Abstract: An optoelectronic device (20) includes thin film structures (56) disposed on a semiconductor substrate (54) and patterned to define components of an integrated drive circuit, which is configured to generate a drive signal. A back end of line (BEOL) stack (42) of alternating metal layers (44, 46) and dielectric layers (50) is disposed over the thin film structures. The metal layers include a modulator layer (48), which contains a plasmonic waveguide (36, 99, 105) and a plurality of electrodes (30, 32, 34, 96, 98, 106), which apply a modulation to surface plasmons polaritons (SPPs) propagating in the plasmonic waveguide in response to the drive signal. A plurality of interconnect layers are patterned to connect the thin film structures to the electrodes.

Abstract: Disclosed is an electronic device (1) for converting a wireless signal (2) in the mm-wave or sub-THz range into at least one modulated optical signal (16). The electronic device (1) comprises an antenna element (11) for converting the wireless signal (2) into a guided electrical signal (12), wherein the antenna element (11) is arranged on a printed circuit board (10b?) or on a first integrated chip (10?). The electronic device (1) comprises an electrical signal converter (13) for converting the at least one guided electrical signal (12) into a conditioned electrical signal (14), wherein the electrical signal converter (13) is arranged on a second integrated chip (10?).

Abstract: A push-pull device (10) comprises: a first waveguide (W1) arranged between its first and second electrode (S11, S12) and a second waveguide (W2) arranged between its first and a second electrode (S21, S22). Electrically conductive structures (T11, T12, T21, T22) extend away from one or more of the electrodes (S11, S12, S21, S22) for electrically connecting at least two of the electrodes (S11, S12, S21, S22). The waveguides (W1, W2) and the electrodes (S11, S12, S21, S22) originate from a pre-fabrication process. The waveguides (W1, W2) are poled by a poling (P) originating from a poling process.

Abstract: Disclosed is a plasmonic device (10), comprising: a substrate (11); and a dielectric layer (13) arranged between a base metal layer (12) and a structured metal layer (14) which form with respect to the substrate (11) a vertical stack of layers, wherein the structured metal layer (14) includes arranged in a horizontal direction an input structure (141) for enabling an input section (21), a waveguide structure (142) for enabling a plasmonic waveguide (22), and an output structure (143) for enabling an output section (23), wherein the input section (21) is configured to receive an optical input signal (31) and transmit input power (41) to the plasmonic waveguide (22), wherein the plasmonic waveguide (22) is configured to receive input power (41) from the input section (21) and transmit output power (43) to the output section (23), and wherein the output section (23) is configured to receive output power (43) from the plasmonic waveguide (22) and transmit an optical output signal (33).

Abstract: An optoelectronic device (20) includes thin film structures (56) disposed on a semiconductor substrate (54) and patterned to define components of an integrated drive circuit, which is configured to generate a drive signal. A back end of line (BEOL) stack (42) of alternating metal layers (44, 46) and dielectric layers (50) is disposed over the thin film structures. The metal layers include a modulator layer (48), which contains a plasmonic waveguide (36, 99, 105) and a plurality of electrodes (30, 32, 34, 96, 98, 106), which apply a modulation to surface plasmons polaritons (SPPs) propagating in the plasmonic waveguide in response to the drive signal. A plurality of interconnect layers are patterned to connect the thin film structures to the electrodes.

Abstract: Disclosed is an electronic device (1) for converting a wireless signal (2) in the mm-wave or sub-THz range into at least one modulated optical signal (16). The electronic device (1) comprises an antenna element (11) for converting the wireless signal (2) into a guided electrical signal (12), wherein the antenna element (11) is arranged on a printed circuit board (10b?) or on a first integrated chip (10?)? The electronic device (1) comprises an electrical signal converter (13) for converting the at least one guided electrical signal (12) into a conditioned electrical signal (14), wherein the electrical signal converter (13) is arranged on a second integrated chip (10?).

Abstract: The invention relates to a method and a corresponding apparatus for measuring distance and optionally speed, in particular for multiscale distance measurement.

Abstract: In an integrated optical circuit, light from a light source is polarized and coupled to a first and second strip waveguide. A waveguide coupling element couples the two optical signals from the two strip waveguides to different polarization modes of an optical fiber line. The optical fiber line is connected to a measuring head, which reflects the optical signal and in which a phase difference between the two optical partial signals is modulated in a magnetic field. In the waveguide coupling element, the reflected signal is split into two optical partial signals having the same polarization and the phase difference between the two partial signals is determined. A phase modulator device provides for closed-loop operation. Compared to fiber-optical concepts, the number of splices is reduced.

Abstract: The invention lies in the field of optical metrology and related to optical coherence tomography (OCT). In particular, the invention relates to an apparatus and a method for the depth-dependent adaptation of the dynamic range of an OCT system to the profile of the backscattered power to be measured. The dynamic range of the measuring method can therefore be decoupled from the dynamic range of the analog/digital converter used. The invention is used, in particular, in the characterization of strongly scattering or strongly absorbing biological or technical samples.

Abstract: An optical detector for detecting an optical signal beam (OSB) modulated in a way that it includes an in-phase and/or a quadrature component, includes: a polarization beam splitter arranged to split the OSB into two polarized OSBs; a non-polarization beam splitter arranged to further split each of the two polarized OSBs into two split polarized OSBs; at least one birefringent element providing a phase shift, the birefringent element being arranged in a path of at least one polarized OSB and/or in a path of at least one split polarized OSB so that an in-phase and quadrature phase offset between two split polarized OSBs originating from the same polarized OSB is formed in output signal beams; and at least two detection means arranged to receive at least one output signal beam that includes a in-phase and/or quadrature component of the OSB.

Abstract: A method for making optical connections with optical waveguides includes mounting the optical waveguides or a device comprising the optical waveguides, on a component carrier. A partial region of the optical waveguides is embedded in a volume of resist material. Positions of the optical waveguides to be connected are detected with reference to a coordinate system using a measuring system. Favorable, three-dimensional geometries are determined for optical waveguide structures for connecting the optical waveguides to each other at predetermined connecting locations and the optical waveguide structure geometries are converted to a machine-readable dataset. The optical waveguide geometries in the volume of the resist material are three-dimensionally structured using a direct-writing lithography device operating on the basis of the machine-readable dataset.

Abstract: The invention relates to a method and a corresponding apparatus for measuring distance and optionally speed, in particular for multiscale distance measurement.

Abstract: The invention lies in the field of optical metrology and relates to optical coherence tomography (OCT). In particular, the invention relates to an apparatus and a method for the depth-dependent adaptation of the dynamic range of an OCT system to the profile of the backscattered power to be measured. The dynamic range of the measuring method can therefore be decoupled from the dynamic range of the analogue/digital converter used. The invention is used, in particular, in the characterization of strongly scattering or strongly absorbing biological or technical samples.

Abstract: An optical arrangement includes a plurality of planar substrates with at least one planar integrated optical waveguide on each planar substrate. At least one optical waveguide structure has at least one end connected via an optical connecting structure to one of the planar integrated optical waveguides. The optical waveguide structure is positioned at least partly outside the integration plane for the planar integrated optical waveguide and a refractive index contrast between a core region and a cladding region of the optical waveguide structure is at least 0.01.

Abstract: In an integrated optical circuit, light from a light source is polarized and coupled to a first and second strip waveguide. A waveguide coupling element couples the two optical signals from the two strip waveguides to different polarization modes of an optical fiber line. The optical fiber line is connected to a measuring head, which reflects the optical signal and in which a phase difference between the two optical partial signals is modulated in a magnetic field. In the waveguide coupling element, the reflected signal is split into two optical partial signals having the same polarization and the phase difference between the two partial signals is determined. A phase modulator device provides for closed-loop operation. Compared to fiber-optical concepts, the number of splices is reduced.

Abstract: A method for making optical connections with optical waveguides includes mounting the optical waveguides or a device comprising the optical waveguides, on a component carrier. A partial region of the optical waveguides is embedded in a volume of resist material. Positions of the optical waveguides to be connected are detected with reference to a coordinate system using a measuring system. Favorable, three-dimensional geometries are determined for optical waveguide structures for connecting the optical waveguides to each other at predetermined connecting locations and the optical waveguide structure geometries are converted to a machine-readable dataset. The optical waveguide geometries in the volume of the resist material are three-dimensionally structured using a direct-writing lithography device operating on the basis of the machine-readable dataset.

Abstract: An optical arrangement includes a plurality of planar substrates with at least one planar integrated optical waveguide on each planar substrate. At least one optical waveguide structure has at least one end connected via an optical connecting structure to one of the planar integrated optical waveguides. The optical waveguide structure is positioned at least partly outside the integration plane for the planar integrated optical waveguide and a refractive index contrast between a core region and a cladding region of the optical waveguide structure is at least 0.01.