Abstract: A structural unit includes a cylindrical component and a metal-plate element having a through-neck, and the cylindrical component extends though the through-neck and is attached to the cylindrical component. The through-neck substantially determines a position of the metal-plate element relative to the cylindrical component with respect to a radial direction of the cylindrical component. Also an oil mist separator including the structural unit.

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: A bearing carrier or a housing part includes a base body, a first component and at least one second component mounted in the base body, and a belt or a cable or a roving connected to the base body and to the first component and the second component such that the belt or the cable or the roving at least partially transmits forces that act on the first component to the second component. The first and second components may each be formed as rings having a cylindrical inner surface and an outer surface having a groove, and the element may pass through the grooves of the first and second components and be embedded in the base body.

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: A lead-frame structure having two faces and exposing a treated silver surface on at least one of said two faces, the treated silver surface(s) serving the wire bonding, which lead-frame structure has a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a surface mount electronic device comprising a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces thereof, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, and which surface mount electronic device has excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

Abstract: A method of producing a lead-frame structure having two faces and exposing a treated silver surface on at least one of the two faces, the treated silver surface(s) serving the wire bonding, which yields a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a method of producing a surface mount electronic device including a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, which method yields excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

Abstract: A retaining element configured to retain an outer ring of a bearing in a housing, the retaining element having a body having a first side and a second side and a substantially circular through-hole extending from the first side to the second side and an axial thickness from the first side to the second side. A boundary of the through-hole includes two or fewer recesses. The retaining element is configured to hold an attachment element in the two or fewer recesses, the attachment element being configured to engage a groove in a bearing to hold the bearing in the retaining element.

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: To achieve tin deposits being largely free of pressure induced whiskers, a method of depositing a tin layer on a metal substrate is devised, wherein said method comprises: (a) providing said metal substrate; (b) depositing a nickel/phosphorous alloy underlayer on at least one surface of said metal substrate; and (c) depositing said tin layer on said nickel/phosphorous alloy underlayer by depositing said tin layer comprising using a pulse plating method.

Abstract: A structural unit includes a cylindrical component and a metal-plate element having a through-neck, and the cylindrical component extends though the through-neck and is attached to the cylindrical component. The through-neck substantially determines a position of the metal-plate element relative to the cylindrical component with respect to a radial direction of the cylindrical component. Also an oil mist separator including the structural unit.

Abstract: A lead-frame structure having two faces and exposing a treated silver surface on at least one of said two faces, the treated silver surface(s) serving the wire bonding, which lead-frame structure has a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a surface mount electronic device comprising a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces thereof, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, and which surface mount electronic device has excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

Abstract: A method of producing a lead-frame structure having two faces and exposing a treated silver surface on at least one of the two faces, the treated silver surface(s) serving the wire bonding, which yields a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a method of producing a surface mount electronic device including a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, which method yields excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

Abstract: A bearing carrier or a housing part includes a base body, a first component and at least one second component mounted in the base body, and a belt or a cable or a roving connected to the base body and to the first component and the second component such that the belt or the cable or the roving at least partially transmits forces that act on the first component to the second component. The first and second components may each be formed as rings having a cylindrical inner surface and an outer surface having a groove, and the element may pass through the grooves of the first and second components and be embedded in the base body.

Abstract: A device includes a first bearing, at least one second bearing, a first bearing-attachment element configured to exert a first force on an outer ring of the first bearing, and at least one second bearing-attachment element configured to exert a second force on an outer ring of the second bearing. The first bearing-attachment element is configured also to exert a third force on the outer ring of the second bearing.

Abstract: A bearing assembly includes a thermosetting plastic bearing carrier having a receptacle for holding a bearing ring of the bearing and an injection molded connector between an inner circumference of the receptacle and an outer circumference of the bearing ring made from a thermoplastic plastic. The connector may include axial end portions that radially overlap portions of the bearing carrier. Also a method for forming a bearing assembly.

Abstract: A bearing assembly includes a roller bearing connected with a plate-shaped bearing support. The bearing support has a receiving bore for an outer ring of the roller bearing, and the outer ring of the roller bearing is affixed to the bearing support with two affixing plates that are fixed to first and second end sides of the bearing support. The two affixing plates clamp the outer ring at two clamping surfaces. An axial spacing of the first and second end sides of the bearing support is smaller than an axial spacing of the clamping surfaces of the outer ring, and a spring element configured to act in the axial direction is disposed between one of the two affixing plates and the bearing support.

Abstract: A retaining element configured to retain an outer ring of a bearing in a housing, the retaining element having a body having a first side and a second side and a substantially circular through-hole extending from the first side to the second side and an axial thickness from the first side to the second side. A boundary of the through-hole includes two or fewer recesses. The retaining element is configured to hold an attachment element in the two or fewer recesses, the attachment element being configured to engage a groove in a bearing to hold the bearing in the retaining element.

Abstract: A bearing assembly includes a roller bearing connected with a bearing support having a plate-shaped section. The bearing support has a receiving bore for an outer ring of the roller bearing, and the outer ring of the roller bearing is affixed to the bearing support with two affixing plates that are fixed to first and second end sides of the bearing support and that clamp the outer ring at two clamping surfaces. An axial spacing of the first and second end sides of the bearing support is smaller than an axial spacing of the clamping surfaces of the outer ring, and the two affixing plates have a different mechanical strength.

Abstract: A bearing arrangement is disclosed having a bearing and a bearing support. The bearing is coupled to the bearing support at an axial side. The bearing provides first and second bearing rings that define a bearing interior there between. A first groove is formed at the first bearing ring's radial side facing the second bearing ring. A coupling element is arranged at the bearing's axial side facing the bearing support. The coupling element includes a first, preferably nose-shaped, radial protrusion that is in engagement with the first groove, and a second radial protrusion, which at least partially encompasses the bearing support at a side facing away from the bearing, so that the coupling element fastens the bearing to the bearing support. A coupling element for such a bearing arrangement is also provided.

Abstract: A bearing arrangement is disclosed having a bearing and a bearing support. The bearing is coupled to the bearing support at an axial side. The bearing provides first and second bearing rings that define a bearing interior there between. A first groove is formed at the first bearing ring's radial side facing the second bearing ring. A coupling element is arranged at the bearing's axial side facing the bearing support. The coupling element includes a first, preferably nose-shaped, radial protrusion that is in engagement with the first groove, and a second radial protrusion, which at least partially encompasses the bearing support at a side facing away from the bearing, so that the coupling element fastens the bearing to the bearing support. A coupling element for such a bearing arrangement is also provided.