Abstract: Embodiments relate to viscosifiers that are terminated polymers that have functional terminal groups. The polymers being pre-extended by polyepoxides and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions and considerably reduce or even exclude the formation of high-molecular addition products so that the products obtained have low viscosity and good storage stability.

Abstract: The invention relates to viscosifiers, especially terminated polymers that have functional terminal groups, said polymers being pre-extended by polyamines, polymercaptans, (poly)aminoalcohols, (poly)mercaptoalcohols or (poly)aminomercaptans and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. They are also charaterized in that the formation of high-molecular addition products is considerably reduced or even excluded so that products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred.

Abstract: The invention relates to compounds embodying amino group-terminal viscosifiers, the resultant products thereof, and the uses thereof. The inventive viscosifiers are provided with formula (I), wherein R1 represents a divalent radical of a carboxyl group-terminal butadiene/acrylonitrile copolymer after removing the terminal carboxyl groups. The disclosed compounds increase the viscosity of the compositions formulated therewith. Compounds containing glycidyl groups are particularly important as resultant products thereof which can be used in thermosetting single-component epoxy resin adhesives.

Abstract: The invention relates to a fixing element for fixing to a base body, in particular to building surfaces comprising a support and an reactive adhesive.

Abstract: Activators for heat-curing epoxy resin compositions, as well as use thereof in heat-curing epoxy resin compositions. These activators are distinguished by a good activation effect as well as good storage stability.

Abstract: Hot-curing epoxy resin compositions are disclosed which firstly are solid in a hardened state at room temperature and secondly form an adhesion-free surface and are impact-resistant and can have high glass transition temperatures, above, for example, 110° C. An exemplary hot-curing epoxy resin composition can form separate phases on hardening, a continuous phase being formed by epoxy resins. If the compositions include a blowing agent, they can have excellent suitability for production of foams, such as structural foams.

Abstract: Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly suitable as one-component heat-curable adhesives, and as structural foams which have a high impact resistance and high mechanical stability.

Abstract: A structural reinforcement material (20) is provided that includes a base material selected from the group consisting of thermosets, low viscosity thermoplastics with short transition phases and low viscosities, low melting point metallic alloys, and combinations thereof. At STP, the structural reinforcement material (20) is a solid or a formable dough or a mixture thereof. When heated to an activation temperature, the structural reinforcement material (20) becomes flowable into a cavity (10). Following cooling, the structural reinforcement material (20) is a solid or a thermoset with a strength sufficient to reinforce the cavity (10). A structural reinforcement insert (111) comprising the structural reinforcement material (20) is also provided, as is a reinforced cavity (10) of an automobile (2) and a method of reinforcing a cavity (10).

Abstract: Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin with, on average, more than one epoxide group per molecule, at least one curing agent for epoxy resins, which is activated by an increased temperature and at least one terminally blocked polyurethane prepolymer. Said epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.

Abstract: Described are heat hardening compounds which contain at least one epoxy resin, A, with on average more than one epoxy group per molecule, at least one impact-strength modifier, B, at least one crack promoter, C, as well as at least one hardener, D, for epoxy resin, which is activated by raised temperature. Silicate layers such as mica or talc and graphite are particularly suitable as crack promoters, C.

Abstract: Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.

Abstract: The invention relates to compounds embodying amino group-terminal viscosifiers, the resultant products thereof, and the uses thereof. The inventive viscosifiers are provided with formula (I), wherein R1 represents a divalent radical of a carboxyl group-terminal butadiene/acrylonitrile copolymer after removing the terminal carboxyl groups. The disclosed compounds increase the viscosity of the compositions formulated therewith. Compounds containing glycidyl groups are particularly important as resultant products thereof which can be used in thermosetting single-component epoxy resin adhesives.

Abstract: A solid thermally expansible material is provided. The material includes a solid epoxy resin that is substantially free of liquid epoxy resin and semi-solid epoxy resin. The material also includes an impact modifier, a curing agent and a heat-activated foaming agent. The impact modifier includes rubber in one embodiment and is substantially free of rubber in another embodiment. Following heat activation, the material expands and can adhere to a substrate. A cured expanded reinforcement material is also provided, as is a method of reinforcing a substrate.

Abstract: A filler mixture comprising an organophilic layer silicate obtainable by treatment of a natural or synthetic layer silicate with a swelling agent selected from sulfonium, phosphonium and ammonium compounds (salts of melamine compounds and cyclic amidine compounds being excluded as ammonium compounds) and a mineral filler different therefrom, yields, in combination with thermosetting resins, nanocomposites having improved mechanical properties.

Abstract: An epoxy resin mixture is prepared by a) the reaction of (i) a diglycidyl compound, (ii) a bisphenol compound and (iii) at least one monophenol at temperatures of from 160 to 170° C. in the presence of an advancement catalyst that can be thermally deactivated, (b) upon completion of the reaction, the catalyst is deactivated by heating to a temperature of approximately 180° C. wherein (A1) one or more epoxy resins having an epoxy functionality of greater than two is added, and c) the resulting epoxy resin mixture is homogenized at that temperature.

Abstract: Organophilic phyllosilicates which have been prepared by treating a naturally occurring or synthetic phyllosilicate, or a mixture of such silicates, with a salt of a quaternary or other cyclic amidine compound, or with a mixture of such salts; polymeric systems, in particular thermoplastic polymers and thermosetting polymer systems, preferably epoxy resins, polyurethanes and rubbers, which comprise novel organophilic phyllosilicates, and also shapable moulding materials and finished mouldings in the form of composite materials, in particular in the form of nanocomposites.