Abstract: A semiconductor package assembly and molding resin case is provided. The package includes a lead frame having a first and a second lead frame side opposite to the first; a semiconductor die structure having a first and a second die side opposite to the first, the die structure being mounted with its second die side on the first lead frame side, resulting in a first connection; a bond element connected to the first die of the die structure, resulting in another connection; with the molding resin case encapsulating at least the die structure, the lead frame and a first part of at least one bond element connected to the die structure, leaving the second lead frame side and the at least one bond element partly exposed; and at least one bond element is provided with electric field modulation structures configured to alter an electric field created between the connections.

Abstract: A method of manufacturing a semiconductor package is provided, with an integrated heatsink and electrical connection feature. The semiconductor die can be attached to the terminal using eutectic bonding, preferably CuSn eutectic, Ag containing adhesives or Ag sintering material. These bondings are lead (Pb) free connection methods, which make the finished semiconductor package RoHS compliant (restriction of hazardous materials).

Abstract: A semiconductor device is provided, including: a lead frame, a semiconductor chip, a mold, and an adhesion promoter. The lead frame includes a first surface and a second frame surface opposite the first surface, and the chip includes a first and a second surface opposite the first surface, the first frame surface is an outer surface of the device, with the second frame surface attached to the first chip surface so that the second frame surface is partially covered by the first chip surface. An uncovered surface part of the second frame surface and the second chip side are in contact with the mold by the adhesion promoter, that is on the uncovered surface part of the second frame surface and/or on the second chip surface. The adhesion promoter enhances adhesion between the mold, and either the second frame surface or the second chip surface of the chip.

Abstract: The present disclosure relates to a method of improving semiconductor package creepage. The package includes a semiconductor device, and a plurality of electrically conductive contacts at a surface of the package, the package includes insulating material for electrically insulating the package between the plurality of electrically conductive contacts and an initial creepage distance is defined by the shortest distance over the surface of the package between two of the plurality of contacts, and the method includes the steps of: applying a layer of insulating material over at least part of at least one of the two contacts, the insulating material is applied in a thin layer and selected to obtain a package thermal resistance increase less than a factor 3 as compared to an uncoated semiconductor package, to increase the initial creepage distance and improve package creepage of the semiconductor package.

Abstract: A semiconductor device such as a chip-scale package is provided. Aspects of the present disclosure further relate to a method for manufacturing such a device. According to an aspect of the present disclosure, a semiconductor device is provided that includes a conformal coating arranged on its sidewalls and on the perimeter part of the semiconductor die of the semiconductor device. To prevent the conformal coating from covering unwanted areas, such as electrical terminals, a sacrificial layer is arranged prior to arranging the conformal coating. By removing the sacrificial layer, the conformal coating can be removed locally. The conformal coating covers the perimeter part of the semiconductor die by the semiconductor device, in which part a remainder of a sawing line or dicing street is provided.

Abstract: A semiconductor device is provided that includes a substrate, a pocket within the substrate, a solderable/glueable re-distribution layer arranged in the pocket and a die. The die is arranged downwards, so that a base contact and an emitter contact of the die face the bottom of the device, and a collector contact of the die faces the top of the device. The solderable/glueable re-distribution layer includes a first and second re-distribution layer part and the first re-distribution layer part and the second re-distribution layer part are isolated from each other by an isolating material. The emitter contact is connected to the first re-distribution layer part and the base contact is connected to the second re-distribution layer part. The emitter contacts via the first re-distribution layer part, the base contacts via the second re-distribution layer part, and the collector contact are fan out to the top surface of the semiconductor device.

Abstract: A semiconductor device is provided that includes a frontside and a backside, four sidewalls, a first solder/glue connection on the frontside and a second solder/glue connection on the backside. The semiconductor device is either connected as a chip scale package to a printed circuit board or inside a semiconductor package via one of the four sidewalls, so that the first solder/glue connection and the second solder/glue connection are visible for a visual solder/glue inspection.

Abstract: This disclosure relates to a flank wettable semiconductor device, having: a lead frame including a plurality of leads with a lead end portion and a semiconductor die mounted on the lead frame. The lead end portion comprises a recess portion having a height that corresponds to a thickness of the lead end portion, and a plate member mounted on the leadframe at the lead end portion.

Abstract: This disclosure relates to a flank wettable semiconductor device, having: a lead frame including a plurality of leads with a lead end portion and a semiconductor die mounted on the lead frame. The lead end portion comprises a recess portion having a height that corresponds to a thickness of the lead end portion, and a plate member mounted on the leadframe at the lead end portion.

Abstract: A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also includes a semiconductor substrate. The device further includes a first contact located on a first surface of the substrate. The device also includes a second contact located on a second surface of the substrate. The first surface of the substrate is mounted on the first surface of the heat sink for electrical and thermal conduction between the heat sink and the substrate via the first contact. The second surface of the substrate is mountable on a surface of a carrier.

Abstract: A semiconductor device includes a semiconductor die having a first side having a first terminal and an opposite second side having at least two second terminals. A lead frame has a first part and a second part. The second part of the lead frame is both electrically and mechanically spaced from the first part. The second side of the die is attached to the lead frame such that the first and second lead frame parts are respectively connected to the at least two second terminals. The first and second lead frame parts include respective first and second extensions that project past a side of the die and provide first and second terminal surfaces that are co-planar with the first terminal on the first side of the die. The device makes use of the terminals on the both sides of the die. The device second side is exposed for thermal performance.

Abstract: A spring pad arranged between a terminal winding of a helical spring of a vehicle wheel suspension. The winding defines a rolled spring end. A spring plate supports the helical spring. The spring pad having a layered structure having two layers different in their rigidity. The first layer has a higher rigidity than the second layer. The first layer is an outer layer of the layered structure that may engage the terminal winding of the helical spring.

Abstract: A spring isolator for a wheel suspension may include a first side configured to rest on a spring plate of the suspension. The spring isolator may also include a second side, opposite the first side, configured to receive a last coil of a coil spring of the suspension to support the coil spring on the spring plate. The first side may have at least one cavity extending through a thickness of the isolator toward the second side. An elasticity of the isolator between the first and second sides may prevent the last coil from breaking contact with the second side during operation of the suspension.

Abstract: A semiconductor device includes a semiconductor die having a first side having a first terminal and an opposite second side having at least two second terminals. A lead frame has a first part and a second part. The second part of the lead frame is both electrically and mechanically spaced from the first part. The second side of the die is attached to the lead frame such that the first and second lead frame parts are respectively connected to the at least two second terminals. The first and second lead frame parts include respective first and second extensions that project past a side of the die and provide first and second terminal surfaces that are co-planar with the first terminal on the first side of the die. The device makes use of the terminals on the both sides of the die. The device second side is exposed for thermal performance.

Abstract: A method of protecting sidewalls a plurality of semiconductor devices is disclosed. The method includes fabricating the plurality of semiconductor devices on a semiconductor wafer, etching to form a trench grid network on the backside of the semiconductor wafer. The trench grid network demarcate physical boundaries of each of the plurality of semiconductor devices. The method also includes depositing a protective layer on the backside and etching to remove the protective layer from horizontal surfaces and to singulate each of the plurality of semiconductor devices from the semiconductor wafer.

Abstract: A spring pad arranged between a terminal winding of a helical spring of a vehicle wheel suspension. The winding defines a rolled spring end. A spring plate supports the helical spring. The spring pad having a layered structure having two layers different in their rigidity. The first layer has a higher rigidity than the second layer. The first layer is an outer layer of the layered structure that may engage the terminal winding of the helical spring.

Abstract: A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also includes a semiconductor substrate. The device further includes a first contact located on a first surface of the substrate. The device also includes a second contact located on a second surface of the substrate. The first surface of the substrate is mounted on the first surface of the heat sink for electrical and thermal conduction between the heat sink and the substrate via the first contact. The second surface of the substrate is mountable on a surface of a carrier.

Abstract: A spring isolator for a wheel suspension may include a first side configured to rest on a spring plate of the suspension. The spring isolator may also include a second side, opposite the first side, configured to receive a last coil of a coil spring of the suspension to support the coil spring on the spring plate. The first side may have at least one cavity extending through a thickness of the isolator toward the second side. An elasticity of the isolator between the first and second sides may prevent the last coil from breaking contact with the second side during operation of the suspension.

Abstract: A stabilizer bar system for an automotive vehicle includes a stabilizer bar having a circular cross section and a rigid sleeve applied to a section of the outer circumference of the stabilizer bar. The sleeve has a number of circumferentially extending grooves and lands which mate with corresponding grooves and lands formed in an inner cylindrical surface of an elastomeric bushing which is overlaid upon the sleeve. The elastomeric bushing and sleeve may be mated such that relative rotation is allowed at the interface of the bushing and sleeve. Alternatively, the bushing and sleeve may be locked so that no relative rotation may occur at the interface of the bushing and sleeve.

Abstract: A stabilizer bar system for an automotive vehicle includes a stabilizer bar having a circular cross section and a rigid sleeve applied to a section of the outer circumference of the stabilizer bar. The sleeve has a number of circumferentially extending grooves and lands which mate with corresponding grooves and lands formed in an inner cylindrical surface of an elastomeric bushing which is overlaid upon the sleeve. The elastomeric bushing and sleeve may be mated such that relative rotation is allowed at the interface of the bushing and sleeve. Alternatively, the bushing and sleeve may be locked so that no relative rotation may occur at the interface of the bushing and sleeve.