Patents by Inventor Juergen Hackert

Juergen Hackert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for preparing a heatsink system and heatsink system obtainable by said process
    Patent number: 8296942
    Abstract: The invention provides a process for preparing a heatsink system for a heat generating electronic device, comprising the steps of: (a) providing a heat conducting substrate; (b) applying an insulating layer on the heat conducting substrate; and (c) applying a printed circuit on the isolating layer by means of a hot embossing system. The invention further provides a heatsink system obtainable by said process, comprising a heat conducting substrate, an insulating layer that is applied on the heat conducting substrate, and a printed circuit that is applied on the insulating layer, wherein the thickness of the part of the insulating layer which is arranged between the heat conducting substrate and the printed circuit is between 1 and 100 micron.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: October 30, 2012
    Assignee: Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
    Inventors: Frits Kornelis Feenstra, Jürgen Hackert
  • PROCESS FOR PREPARING A HEATSINK SYSTEM AND HEATSINK SYSTEM OBTAINABLE BY SAID PROCESS
    Publication number: 20090242239
    Abstract: The invention provides a process for preparing a heatsink system for a heat generating electronic device, comprising the steps of: (a) providing a heat conducting substrate; (b) applying an insulating layer on the heat conducting substrate; and (c) applying a printed circuit on the isolating layer by means of a hot embossing system. The invention further provides a heatsink system obtainable by said process, comprising a heat conducting substrate, an insulating layer that is applied on the heat conducting substrate, and a printed circuit that is applied on the insulating layer, wherein the thickness of the part of the insulating layer which is arranged between the heat conducting substrate and the printed circuit is between 1 and 100 micron.
    Type: Application
    Filed: May 10, 2007
    Publication date: October 1, 2009
    Applicant: Schoemakerstraat 97
    Inventors: Frits Kornelis Feenstra, Juergen Hackert
  • Apparatus for making plastic articles having an embossed pattern
    Patent number: 7048533
    Abstract: In a method of making plastic articles with embossed pattern, a plastic material is injection-molded in a cavity of a clamping unit of an injection molding machine to form an injection-molded plastic article. A pattern is embossed from a foil strip onto a previously injection-molded plastic article to form a finished plastic product with embossed pattern, whereby the embossing step is decoupled from the injection molding step and carried out separately from a clamping step of the clamping unit.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: May 23, 2006
    Assignees: Krauss-Maffei Kunststofftechnik GmbH, Bolta-Werke GmbH
    Inventors: Peter Ils, Peter Lichtinger, Günter Prautzsch, Timo Günzel, Wilhelm Pfister, Jürgen Schreyer, Jürgen Hackert