Abstract: A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.

Abstract: A duplexer is described herein. The duplexer includes a transmission branch configured to allow passage of signals in a transmission band. The duplexer also includes a reception branch configured to allow passage of signals in a reception band. The duplexer also includes a band rejection filter in the transmission branch configured to produce a short circuit to an electrical ground in a stopband. The stopband at least partially overlaps the reception band.

Abstract: A component operating with acoustic waves is described herein. The component includes a substrate having an underside subdivided into a center area and an edge area surrounding die center area on all sides. The component also includes a plurality of outer terminals in the edge area, and a plurality of inner terminals in the center area comprising at least a first inner terminal configured as a signal terminal.

Abstract: A component includes a first filter configured to work with acoustic waves. The first filter includes a first sub-filter on a first chip and a second sub-filter on a second chip separate from the first chip. The first filter if a different type of filter, has a different layer structure, or has a different layer thicknesses for at least one layer in comparison to the second filter.

Abstract: An electrical component is described with a first signal path (TX, RX1) and a second signal path (RX, RX2) that are connected to a common signal path (ANT, RX12). In the first signal path a first filter (F1) is arranged, and in the second signal path a second filter (F2) is arranged. The component comprises a first matching circuit (MA1) that comprises a shunt arm to ground. In the shunt arm, an inductor (L) is arranged, which is connected to the first signal path, the second signal path, and the common signal path. The component comprises a carrier substrate (SU) on which the filters (F1, F2), which are preferably implemented as chips, are mounted. The inductor (L) is integrated in the carrier substrate (SU).