Abstract: A connecting device for flexible electrical connection of circuit boards using a plurality of flexible electrical conductors positioned adjacent to each other. The flexible electrical conductors are jointly surrounded by an insulation of an flexible electrically non-conductive material. The end areas of the flexible electrical conductors have a first and a second contact area without insulation. The flexible electrical conductors and the insulation are plastically deformable, and are shaped in such a way that the flexible electrical conductors form a loop in the area of the insulation and run out in the form of a shoulder in the direction of the contact areas. The shoulder is shaped in such a way that the flexible electrical conductors and the insulation may be picked up by a tool and the contact areas may be connected to a circuit board by machine.

Abstract: An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board.

Abstract: A connecting device for flexible electrical connection of circuit boards using a plurality of flexible electrical conductors positioned adjacent to each other. The flexible electrical conductors are jointly surrounded by an insulation of an flexible electrically non-conductive material. The end areas of the flexible electrical conductors have a first and a second contact area without insulation. The flexible electrical conductors and the insulation are plastically deformable, and are shaped in such a way that the flexible electrical conductors form a loop in the area of the insulation and run out in the form of a shoulder in the direction of the contact areas. The shoulder is shaped in such a way that the flexible electrical conductors and the insulation may be picked up by a tool and the contact areas may be connected to a circuit board by machine.

Abstract: A micromechanical component includes a substrate and a movable structure situated on the surface of the substrate. The movable structure is movable parallel to the surface of the substrate. The structure is surrounded by a frame having a cap attached to it. In the area of the movable element, the cap has a stop limiting the movement of the movable element in a direction perpendicular to the surface of the substrate.

Abstract: The proposal relates to an electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board.

Abstract: In a sensor and a method for manufacturing a sensor, a movable element is patterned out of a silicon layer and is secured to a substrate. The conducting layer is subdivided into various regions, which are electrically insulated from one another. The electrical connection between the various regions of the silicon layer is established by a conducting layer, which is arranged between a first and a second insulating layer.

Abstract: In a sensor and a method for manufacturing a sensor, a movable element is patterned out of a silicon layer and is secured to a substrate. The conducting layer is subdivided into various regions, which are electrically insulated from one another. The electrical connection between the various regions of the silicon layer is established by a conducting layer, which is arranged between a first and a second insulating layer.

Abstract: In an angular velocity sensor, an acceleration sensor is arranged on a resonator formed of a multilayer substrate and attached to a resonating bar. The multilayer substrate includes a top silicon layer, an insulating sacrificial layer arranged below the top silicon layer, and a bottom silicon layer arranged below the insulating sacrificial layer. An excitor causes the resonator to vibrate while a limit stop, configured out of the multilayer substrate, limits the movement of the resonator.

Abstract: In a method for dicing multi-layer composite wafers, proceeding from an upper side of the wafer, cuts are introduced into an upper layer of the wafer and, proceeding from a lower side of the wafer, cuts are introduced into a lower layer of the wafer.