Patents by Inventor Juergen Portmann
Juergen Portmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11948853Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer. The plurality of heat sink interconnects is located adjacent the high-power die in a horizontal direction.Type: GrantFiled: May 6, 2021Date of Patent: April 2, 2024Assignees: QUALCOMM TECHNOLOGIES INCORPORATED, RF360 EUROPE GMBHInventors: Jose Moreira, Markus Valtere, Juergen Portmann, Jeroen Bielen
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Publication number: 20230090842Abstract: A multi-level stacked AW filter package including a first acoustic wave (AW) filter stacked on a second AW filter employs semiconductor fabrication methods and structures, including a metallization layer comprising interconnects to couple a contact surface to the second AW filter. Each AW filter includes an AW filter circuit on a semiconductor substrate. A second substrate disposed on a frame on the substrate protects the AW filter circuit. In a multi-level AW filter package, the second substrate of the first AW filter comprises a glass substrate with a similar expansion rate as the semiconductor substrate. The interconnects coupling the second AW filter to the contact surface are disposed on insulators on the side wall surfaces of the semiconductor substrates of the first AW filter for isolation. In a stacked AW filter package comprising a single AW filter, the interconnects couple the contact surface to the AW filter.Type: ApplicationFiled: September 22, 2021Publication date: March 23, 2023Inventors: Manuel Hofer, Xavier Perois, Michael Wick, Jeroen Bielen, Stefan Leopold Hatzl, Juergen Portmann
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Publication number: 20220359337Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In one aspect, an apparatus includes a high-power die mounted on a backside of a package substrate. A heat transfer layer is disposed on the backside of the high-power die. A plurality of heat sink interconnects is coupled to the heat transfer layer. The plurality of heat sink interconnects is located adjacent the high-power die in a horizontal direction.Type: ApplicationFiled: May 6, 2021Publication date: November 10, 2022Inventors: Jose MOREIRA, Markus VALTERE, Juergen PORTMANN, Jeroen BIELEN
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Patent number: 11245977Abstract: The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.Type: GrantFiled: October 19, 2015Date of Patent: February 8, 2022Assignee: Snaptrack, Inc.Inventors: Christian Bauer, Hans Krüger, Jürgen Portmann, Alois Stelzl, Wolfgang Pahl
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Patent number: 11239170Abstract: The present invention relates to a module that has a lower component of a module (1) having a material (3) in which at least one first structural element (4) is embedded, and an upper component of a module (2) having a material (3) in which at least a second component (16) is embedded. The upper component of the module (2) and the lower component of the module (1) are stacked, with the lower and the upper component of the module (2) being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.Type: GrantFiled: December 2, 2016Date of Patent: February 1, 2022Assignee: SnapTrack, Inc.Inventors: Andreas Franz, Jürgen Portmann, Claus Reitlinger, Stefan Kiefl, Oliver Freudenberg, Karl Weidner
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Patent number: 10680159Abstract: A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.Type: GrantFiled: December 18, 2015Date of Patent: June 9, 2020Assignee: SnapTrack, Inc.Inventors: Thomas Metzger, Jürgen Portmann
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Publication number: 20190164892Abstract: The present invention relates to a module that has a lower component of a module (1) having a material (3) in which at least one first structural element (4) is embedded, and an upper component of a module (2) having a material (3) in which at least a second component (16) is embedded. The upper component of the module (2) and the lower component of the module (1) are stacked, with the lower and the upper component of the module (2) being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.Type: ApplicationFiled: December 2, 2016Publication date: May 30, 2019Applicant: SNAPTRACK, INC.Inventors: Andreas FRANZ, Jürgen PORTMANN, Claus REITLINGER, Stefan KIEFL, Oliver FREUDENBERG, Karl WEIDNER
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Patent number: 10164166Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.Type: GrantFiled: November 22, 2017Date of Patent: December 25, 2018Assignee: SnapTrack, Inc.Inventors: Hans Krüger, Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl
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Patent number: 10154582Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.Type: GrantFiled: October 27, 2017Date of Patent: December 11, 2018Assignee: SnapTrack, Inc.Inventors: Wolfgang Pahl, Jürgen Portmann
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Patent number: 10136226Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.Type: GrantFiled: December 18, 2012Date of Patent: November 20, 2018Assignee: TDK CORPORATIONInventors: Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach, Wolfgang Pahl, Anton Leidl, Armin Schober, Jürgen Portmann
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Publication number: 20180097172Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.Type: ApplicationFiled: November 22, 2017Publication date: April 5, 2018Inventors: Hans KRÜGER, Alois STELZL, Christian BAUER, Jürgen PORTMANN, Wolfgang PAHL
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Publication number: 20180054886Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.Type: ApplicationFiled: October 27, 2017Publication date: February 22, 2018Inventors: Wolfgang PAHL, Jürgen PORTMANN
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Publication number: 20180013055Abstract: A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.Type: ApplicationFiled: December 18, 2015Publication date: January 11, 2018Inventors: Thomas METZGER, Jürgen PORTMANN
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Patent number: 9853204Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.Type: GrantFiled: October 14, 2013Date of Patent: December 26, 2017Assignee: SnapTrack, Inc.Inventors: Hans Krüger, Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl
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Patent number: 9844128Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.Type: GrantFiled: November 22, 2011Date of Patent: December 12, 2017Assignee: SnapTrack, Inc.Inventors: Wolfgang Pahl, Jürgen Portmann
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Publication number: 20170272855Abstract: The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.Type: ApplicationFiled: October 19, 2015Publication date: September 21, 2017Inventors: Christian BAUER, Hans KRÜEGER, Jürgen PORTMANN, Alois STELZL, Wolfgang PAHL
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Patent number: 9647196Abstract: A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.Type: GrantFiled: March 28, 2012Date of Patent: May 9, 2017Assignee: SNAPTRACK, INC.Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl, Wolfgang Pahl, Robert Koch
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Patent number: 9382110Abstract: A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.Type: GrantFiled: July 29, 2011Date of Patent: July 5, 2016Assignee: EPCOS AGInventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl
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Patent number: 9278854Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.Type: GrantFiled: February 8, 2013Date of Patent: March 8, 2016Assignee: Epcos AGInventors: Wolfgang Pahl, Anton Leidl, Jürgen Portmann, Robert Eichinger, Christian Siegel, Karl Nicolaus, Thomas Wassner, Thomas Sedlmeier
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Publication number: 20150326979Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.Type: ApplicationFiled: December 18, 2012Publication date: November 12, 2015Inventors: Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach, Wolfgang Pahl, Anton Leidl, Armin Schober, Jürgen Portmann