Abstract: The invention relates to a centrifuge for separating a sample into at least two components, comprising a chamber for receiving a sample to be centrifuged. According to the invention, the centrifuge further comprises a means for controlling the progress of the sample separation is located at the chamber.

Abstract: A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in the cooling area.

Abstract: An electromagnetic hydraulic valve (1) is provided having a valve housing (2) with a pressurized hydraulic medium inlet channel (24), a pressurized hydraulic medium outlet channel (25), a magnet coil (3), and a valve seat (23), with a magnet armature (9) that can be excited by the magnet coil and a valve tappet (10, 10?) fixed on this armature. A valve-closing element (13) is activated by the valve tappet and that blocks the connection between the pressurized hydraulic medium channels for contact on the valve seat. The magnet armature with the valve tappet and the valve-closing element are guided so that they can move longitudinally in the valve housing and the valve tappet and the valve-closing element contact each other with facing longitudinal end sides (26, 27) in a way that is free from tensile forces.

Abstract: A heat sink designed as a heat pipe has an interior space in a body of the heat sink that is closed toward the outside. The interior space has at least one vapor channel and at least one fluid space connected with the vapor space and having a porous or capillary structure. The heat pipe is made using the DCB process to connect each end of posts within the interior space directly with one of the two opposing walls forming the interior space.

Abstract: In the case of a metal-ceramic substrate with a multilayered ceramic material in sheet form, and with at least one metallization that is provided on one surface side of the ceramic material and is joined to be ceramic material by direct bonding or active soldering, the ceramic material has at least one inner layer or base layer of a silicon nitride ceramic. The surface side of the ceramic material that is provided with the at least one metallization is formed by an intermediate layer of an oxidic ceramic applied to the base layer.

Abstract: The presently disclosed subject matter proposes an apparatus (42) and a method for transferring energy and/or a substance from a non-rotating means of an apparatus to a rotating device (43)—or vice versa—through the intermediary of a suitable means (1, 1?).

Abstract: The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer made up of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.

Abstract: The invention relates to a method for producing Peltier modules, each of which comprises several Peltier elements that are arranged between at least two substrates. The substrates are made of an electrically insulating material at least on the sides facing the Peltier elements while being provided with contact areas on said surfaces. The contact areas, to which the Peltier elements are connected by means of terminal sure during the production process, are formed by metallic areas.

Abstract: A device for carrying out chemical and/or biological reactions comprises a sample chamber (38) formed by a first portion (12) and a second portion (26) and designed for holding the sample. With the aid of a moving means (46,50) the sample can be moved in the sample chamber (38). The second portion (26) is connected via an intermediate element (27) with a heating and cooling-control element (29) for heating and cooling the sample. For ensuring good temperature conductivity and resistance to the sample of the second portion (26), in a preferred embodiment, the second portion (26) is made of ceramic.

Abstract: A circuit arrangement for generating oscillations with a defined frequency includes an oscillator circuit (30, 32) for generating the oscillations and a dedamping circuit (18, 20) connected to the oscillator circuit for compensating any damping of the oscillator circuit. The dedamping or damping compensation by the dedamping circuit is accomplished with the aid of a rectifier circuit (60, 62). The dedamping circuit is a bridge circuit of CMOS field effect transistors (22, 24; 26, 28) which are controlled in their operation in closed loop fashion by respective rectifier circuit branches which are in turn connected to the oscillator circuit to provide a proportional closed loop control of the damping compensation.

Abstract: At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module.

Abstract: A circuit arrangement for generating oscillations with a defined frequency includes an oscillator circuit (30, 32) for generating the oscillations and a dedamping circuit (18, 20) connected to the oscillator circuit for compensating any damping of the oscillator circuit. The dedamping or damping compensation by the dedamping circuit is accomplished with the aid of a rectifier circuit (60, 62). The dedamping circuit is a bridge circuit of CMOS field effect transistors (22, 24; 26, 28) which are controlled in their operation in closed loop fashion by respective rectifier circuit branches which are in turn connected to the oscillator circuit to provide a proportional closed loop control of the damping compensation.

Abstract: A housing for a telecommunications system is described. The housing contains a housing base for accommodating modules and module frames, and a covering shroud connected releasably to the housing base and, with the housing base, encloses the modules and the module frames. The covering shroud has a casing plate forming at least part of the covering shroud, and plastic moldings connected, in part, to the casing plate and/or the housing base. Some of the plastic moldings can be lined up in a row one beside another to form a wall surface of the covering shroud.

Abstract: Within the scope of the method for oil filling for transmissions, particularly for automatic transmission of a motor vehicle, by way of a filling device attached to an oil overflow orifice on the transmission, as a first step a first oil filling is effected with a basic amount, when the basic amount is filled up, a suction of excess oil is carried out during a simultaneous continuous subsequent dosing. Then follows a final oil adjustment by single subsequent dosing of a specific amount of oil while the suction is cut off.

Abstract: A mirror for laser application and a method for manufacturing the mirror is disclosed herein. The mirror comprises several layers including a top layer used as the mirror surface. A cooling structure including a plurality of cooler layers are providing between the top layer, several intermediate layers and a bottom layer. Connections are provided for allowing a coolant to flow within the mirror. The mirror is constructed by stacking the layers on top of one another and connecting adjacent layers together by direct copper bonding or active soldering.

Abstract: Disclosed is a nozzle arrangement for the coextrusion of a product with at least two layers, whereby a distributor portion 14 adjacent to the extruder is provided through which an extruding mass is delivered to the extruder and whereby a nozzle portion 12 for the extrusion of the extrusion mass is connected to the distributor portion, whereby in accordance with the invention a mounting and connecting base is provided between the distributor portion and the nozzle portion.

Abstract: The invention relates to a novel process for producing a ceramic-metal substrate for electrical circuits in which a first or second metal coating is applied to a ceramic layer on both sides, specifically first metal coating in the form of a copper foil using the DCB process.

Abstract: At the end of am accumulator discharge process, the accumulator has a raised internal temperature. In order to be able to recharge it again, it is necessary to wait until it has cooled. The charging time is consequently significantly determined by the cooling time. To shorten the charging time, the invention proposes the installation in the accumulator of a temperature sensor and disconnecting the accumulator on reaching a predetermined temperature. Although it is still not empty, it then supplies no further current. However, it can immediately be recharged, so that the cooling time is rendered superfluous. Despite the shorter discharge time, the accumulator is consequently available over a longer period of time.