Abstract: A circuit board for radar sensors including a substrate having a topside and a lower surface. The circuit board has at least one antenna device, which is situated on the topside of the substrate and is developed out of a metal layer. In addition, the circuit board has a fill structure situated on the topside of the substrate, which is developed out of the metal layer. The fill structure is situated at a distance from the antenna device in a surface region of the topside of the substrate, the surface region not being taken up by the antenna device. The fill structure has no electrical connection to the antenna device. The surface utilization of the fill structure amounts to between 50% and 300% of that of a surface utilization of the antenna device.

Abstract: An electronic component for high-frequency applications, in which an integrated circuit with a chip for processing high-frequency signals are arranged together with at least one signal coupling element or launcher for coupling and/or decoupling high-frequency signals in a common housing substrate. A land grid array (LGA) structure is provided on an outside of the housing substrate. An electrically conductive border is provided around the respective launcher on the surface of the housing substrate.

Abstract: A circuit board for radar sensors including a substrate having a topside and a lower surface. The circuit board has at least one antenna device, which is situated on the topside of the substrate and is developed out of a metal layer. In addition, the circuit board has a fill structure situated on the topside of the substrate, which is developed out of the metal layer. The fill structure is situated at a distance from the antenna device in a surface region of the topside of the substrate, the surface region not being taken up by the antenna device. The fill structure has no electrical connection to the antenna device. The surface utilization of the fill structure amounts to between 50% and 300% of that of a surface utilization of the antenna device.

Abstract: An antenna system and a method for manufacturing same. The antenna system includes a substrate having a first outer side on which a first antenna structure is mounted; a radome spaced apart from the substrate on the first outer side of the substrate; a carrier device situated between the substrate and the radome which includes an insulating material; and at least one second antenna structure mounted on the carrier device which is spaced apart from the substrate and the radome.

Abstract: An antenna system and a method for manufacturing same. The antenna system includes a substrate having a first outer side on which a first antenna structure is mounted; a radome spaced apart from the substrate on the first outer side of the substrate; a carrier device situated between the substrate and the radome which includes an insulating material; and at least one second antenna structure mounted on the carrier device which is spaced apart from the substrate and the radome.

Abstract: Radar sensor having a mixer for mixing a received signal with a reference signal and having a device for compensating interference signals which would overload the mixer, wherein the device for compensating the interference signals has an adjustable reflection point at the reference input of the mixer.

Abstract: In a multibeam radar sensor apparatus having at least two transmission/reception channels, whose signal paths each include an antenna and a mixer, at least one first mixer is configured bidirectionally as a transfer mixer, and at least one second mixer is switchable from a first into a second operating state; in the first operating state, the mixer is bidirectionally configured as a transfer mixer, and in the second operating state, the mixer being configured in an at least approximately isolating manner as a receiving mixer.

Abstract: Radar sensor having a mixer for mixing a received signal with a reference signal and having a device for compensating interference signals which would overload the mixer, wherein the device for compensating the interference signals has an adjustable reflection point at the reference input of the mixer.

Abstract: A radar sensor having a transmission module and a signal stabilizer, which are situated on a shared circuit board, a casing, which accommodates the signal stabilizer and forms a shield against high frequency radiation of the signal stabilizer together with a conductive layer of the circuit board, and having a connection line, which crosses through the shield, to connect the signal stabilizer to the transmission module, in which the connection line is embedded in the circuit board in insulated fashion.

Abstract: In a multibeam radar sensor apparatus having at least two transmission/reception channels, whose signal paths each include an antenna and a mixer, at least one first mixer is configured bidirectionally as a transfer mixer, and at least one second mixer is switchable from a first into a second operating state; in the first operating state, the mixer is bidirectionally configured as a transfer mixer, and in the second operating state, the mixer being configured in an at least approximately isolating manner as a receiving mixer.

Abstract: A sensor device, in particular a radar sensor device for a motor vehicle, in whose beam path at least one antenna exciter and at least one lens are situated, in which at least one diaphragm having a variable azimuthal opening width for realizing a variable azimuthal detection range of the radar sensor device is situated in the beam path between the at least one antenna exciter and the at least one lens.

Abstract: A radar sensor having a transmission module and a signal stabilizer, which are situated on a shared circuit board, a casing, which accommodates the signal stabilizer and forms a shield against high frequency radiation of the signal stabilizer together with a conductive layer of the circuit board, and having a connection line, which crosses through the shield, to connect the signal stabilizer to the transmission module, in which the connection line is embedded in the circuit board in insulated fashion.

Abstract: A microwave oscillator having a hollow conductor, an oscillation generator which is mounted on a heatsink and projects into the hollow conductor, and a printed circuit board having electronic components for supplying direct voltage to the oscillation generator. The printed circuit board or a metallic coating on, in, or under this printed circuit board forms one wall of the hollow conductor, and the oscillator including its heatsink is located in the printed circuit board.

Abstract: A device for generating electromagnetic oscillations in the HF range, in particular in the gigahertz range, using at least one Gunn element, in particular at least one Gunn diode. The device is designed to be attached to at least one printed-board-like electric or electronic circuit configuration, in particular an electric or electronic HF circuit configuration, having a generally planar expansion.

Abstract: The circuit device has a contact element, which electrically connects a wave guide (1) with a conductor strip (2). To avoid mechanical stresses due to thermal expansion the contact element is a pre-stressed prefabricated leaf spring having reproducible properties, which is bonded at one contacting area to the wave guide (1) or the conductor strip (2) by electrically conducting adhesive or glue, while a sliding contact is provided on the conductor strip (2) or the wave guide (1) at the other contacting area. The prefabricated leaf spring is preferably a MIGA leaf spring precisely made by UV depth lithography and multiplayer galvanic methods in a batch production process.

Abstract: A microwave oscillator having a hollow conductor, an oscillation generator which is mounted on a heatsink and projects into the hollow conductor, and a printed circuit board having electronic components for supplying direct voltage to the oscillation generator. The printed circuit board or a metallic coating on, in, or under this printed circuit board forms one wall of the hollow conductor, and the oscillator including its heatsink is located in the printed circuit board.

Abstract: A device for generating electromagnetic oscillations in the HF range, in particular in the gigahertz range, using at least one Gunn element, in particular at least one Gunn diode. The device is designed to be attached to at least one printed-board-like electric or electronic circuit configuration, in particular an electric or electronic HF circuit configuration, having a generally planar expansion.

Abstract: The arrangement for producing electrical oscillations in a Giga hertz region has a Gunn element, a housing in which the Gunn element is accommodated and which has an electrically conductive housing cover, the Gunn element being in electrical contact with the electrically conductive housing cover, and an elastic, electrical contact element clamped between a contact surface of the Gunn element and the housing cover.

Abstract: A housing for an electronic component has a bottom part, a wall part, a cover part which together are adapted to cover the electronic component, a contact spring provided on the cover part for producing an electrical connection with a terminal of the component, the cover part and the contact spring being formed as a one-piece integral element.