Patents by Inventor Juergen Steger

Juergen Steger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11804785
    Abstract: A power electronic arrangement has a plurality of single-phase power semiconductor modules and one multi-phase power semiconductor module, wherein each single-phase power semiconductor module has a first, at least frame-like housing, two first DC voltage terminal elements, a first AC voltage terminal element, first auxiliary terminal elements and a first switching device. The multi-phase power semiconductor module has a second, at least frame-like housing, two second DC voltage terminal elements, at least two second AC voltage terminal elements, second auxiliary terminal elements and a second switching device. The first and second DC voltage terminal elements each form a stack in a section of their length and on the terminal sections are designed identically. All the power semiconductor modules are arranged in a row in the direction of the normal vectors of the respective first longitudinal side.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: October 31, 2023
    Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: Jürgen Steger, Andreas Maul
  • Patent number: 11800644
    Abstract: A production method and a power electronic connecting device for a power semiconductor module, wherein the connecting device is designed as a flexible film stack of a first and a second electrically conductive film and an electrically insulating film arranged therebetween, wherein at least one of the electrically conductive films is structured in itself and thus forms a plurality of film conductor tracks, wherein a first one of these film conductor tracks has, in a first section, a first average thickness and, in a second section, a second average thickness which is at least 10%, preferably at least 20%, smaller than the first average thickness.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: October 24, 2023
    Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: Markus Düsel, Michael Schatz, Alexander Wehner, Ingo Bogen, Jürgen Steger
  • Patent number: 11791740
    Abstract: A power converter module has a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and having a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection, wherein the second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: October 17, 2023
    Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: Ingo Bogen, Florian Fink, Jürgen Steger, Harald Kobolla
  • Publication number: 20230197468
    Abstract: A method for manufacturing a power semiconductor module and a power semiconductor module having, in each case, a housing, a switchgear arranged in this housing and having a plurality of connection elements, has the following method steps: A) forming a housing with pre-fixed connection elements; B) arranging the switchgear in the housing and connecting the connection elements to connection surfaces of a substrate of the switchgear; C) arranging a positioning device for fixing the position of the connection elements with respect to one another; D) fixing the connection elements relative to one another and to the housing.
    Type: Application
    Filed: December 10, 2022
    Publication date: June 22, 2023
    Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: Stefan OEHLING, Jürgen STEGER
  • Publication number: 20230112316
    Abstract: A power semiconductor module has a substrate, with power semiconductor components, and a DC voltage connecting device, which has a first and a second flat conductor connecting element and at least one first metal layer connecting element and at least one second metal layer connecting element, wherein the second flat conductor connecting element is arranged spaced apart in the normal direction of the first flat conductor connecting element from the first flat conductor connecting element, the first flat conductor connecting element is electrically connected by the first metal layer connecting element and the second flat conductor connecting element is electrically connected by the second metal layer connecting element to the metal layer, the first flat conductor connecting element has a flat conductor end section and a flat conductor connection section arranged between the one first metal layer connecting element and the flat conductor end section.
    Type: Application
    Filed: September 21, 2022
    Publication date: April 13, 2023
    Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: Manuel NODERER, Alexander WEHNER, Jürgen STEGER
  • Patent number: 11395876
    Abstract: A pump module for an infusion pump includes a plunger-cylinder unit that can be coupled to the infusion pump in order to deliver fluid from a fluid feed line into a fluid drain line to a patient. The plunger-cylinder unit has a delivery chamber that is fluidically connected to the fluid feed line and the fluid drain line. The delivery chamber is delimited by the cylinder (14). The plunger can be moved linearly/back and forth in the axial direction. A plunger seal seals the plunger in relation to the cylinder. The section of the wall of the cylinder, over which the plunger seal passes during the back-and-forth motion of the plunger, is sealed in a sterile manner in relation to the surroundings.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: July 26, 2022
    Assignee: B. BRAUN MELSUNGEN AG
    Inventors: Jürgen Fuchs, Jürgen Hartung, Jürgen Steger
  • Publication number: 20220046798
    Abstract: A production method and a power electronic connecting device for a power semiconductor module, wherein the connecting device is designed as a flexible film stack of a first and a second electrically conductive film and an electrically insulating film arranged therebetween, wherein at least one of the electrically conductive films is structured in itself and thus forms a plurality of film conductor tracks, wherein a first one of these film conductor tracks has, in a first section, a first average thickness and, in a second section, a second average thickness which is at least 10%, preferably at least 20%, smaller than the first average thickness.
    Type: Application
    Filed: July 26, 2021
    Publication date: February 10, 2022
    Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: Markus Düsel, Michael Schatz, Alexander Wehner, Ingo Bogen, Jürgen Steger
  • Publication number: 20210336553
    Abstract: A power electronic arrangement has a plurality of single-phase power semiconductor modules and one multi-phase power semiconductor module, wherein each single-phase power semiconductor module has a first, at least frame-like housing, two first DC voltage terminal elements, a first AC voltage terminal element, first auxiliary terminal elements and a first switching device. The multi-phase power semiconductor module has a second, at least frame-like housing, two second DC voltage terminal elements, at least two second AC voltage terminal elements, second auxiliary terminal elements and a second switching device. The first and second DC voltage terminal elements each form a stack in a section of their length and on the terminal sections are designed identically. All the power semiconductor modules are arranged in a row in the direction of the normal vectors of the respective first longitudinal side.
    Type: Application
    Filed: April 14, 2021
    Publication date: October 28, 2021
    Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: JÜRGEN STEGER, Andreas MAUL
  • Publication number: 20210336552
    Abstract: A power converter module has a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and having a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection, wherein the second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection.
    Type: Application
    Filed: March 31, 2021
    Publication date: October 28, 2021
    Applicant: SEMIKRON ELEKTRONIK GMBH & CO., KG
    Inventors: Ingo BOGEN, Florian FINK, Jürgen STEGER, Harald KOBOLLA
  • Publication number: 20210336357
    Abstract: A power electronic arrangement has a power converter module including a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and has a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection. The second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection. The second DC voltage terminal element or the second DC voltage connection element has a continuous welding cavity in the region of the first connection.
    Type: Application
    Filed: March 31, 2021
    Publication date: October 28, 2021
    Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventor: Jürgen STEGER
  • Publication number: 20210187192
    Abstract: An infusion system includes a pump and a replaceable pump module. The pump module can be arranged in a mount of the pump and includes a plunger-barrel unit operatively connectable to a drive mechanism of the pump. The pump module includes a plunger that can be coupled to the drive mechanism by a coupling structure operatively connected to the plunger and a counter-coupling structure for connecting engagement in the coupling structure and operatively connected to the drive mechanism. In a securing position, the infusion system includes a securing member which locks the coupling structure and the counter-coupling structure to each other. In addition or in the alternative, the infusion pump includes a control link operatively connected to the pump module.
    Type: Application
    Filed: July 26, 2019
    Publication date: June 24, 2021
    Inventors: Jürgen Fuchs, Jürgen Hartung, Jürgen Steger
  • Patent number: 10957560
    Abstract: The invention provides a pressure sintering method including: a) providing a sintered component arrangement with a workpiece carrier having recesses, with a substrate resting on a main surface of the workpiece carrier, wherein a sintering material to be sintered is arranged between the power semiconductor components and the substrate, a first power semiconductor component and a first region of the substrate arranged above the workpiece carrier in the normal direction of the first main side of the insulation layer flush with a first recess of the workpiece carrier, and a second power semiconductor component and a second region of the substrate are arranged above the workpiece carrier in the normal direction of the first main side of the insulation layer flush with a second recess of the workpiece carrier and a step of b) pressurizing the power semiconductor components and applying a temperature treatment.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: March 23, 2021
    Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: Alexander Wehner, Juergen Steger
  • Patent number: 10857291
    Abstract: A medical pump, in particular an infusion pump for conveying a medium, includes a seating for a hose clamp which is separate from the pump and arranged on the hose. Two clamping portions of the hose clamp which can be moved relative to each other can be transferred into a closed relative position in which they pinch off the hose arranged therebetween in such a manner that it is not possible for any medium to flow through the interior of the hose. Moreover, the clamping portions can be moved with respect to each other into an opened relative position in which the hose arranged between the clamping portions is not pinched off, so that the medium is able to flow through the interior of the hose. The pump is distinguished in that a sensor is provided thereon, in particular in the seating for the hose clamp, which sensor detects at least when the hose clamp is received in the seating—whether their clamping portions are in the closed or opened relative position.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: December 8, 2020
    Assignee: B. BRAUN MELSUNGEN AG
    Inventors: Jürgen Steger, Rolf Heitmeier, Andreas Katerkamp, Christoph Erlen, Matthias Kramer
  • Patent number: 10842987
    Abstract: A medical tube clamp for clamping a flexible medical tube comprising: a tube receiving area which is adapted to receive the medical tube, a first clamping portion including a first clamping jaw which is movable relative to a second clamping portion including a second clamping jaw, and a closure system for safely positioning the two clamping portions in more than one snap-fit position relative to each other so that, when the closure system is unlocked, the medical tube can be inserted in and removed from the tube clamp, in an open snap-fit position the inserted medical tube cannot be removed and is not clamped and in a clamping snap-fit position the medical tube is clamped between the first clamping jaw and the second clamping jaw, with the first clamping jaw being configured to be elastically movable relative to the first clamping portion via a connecting member and/or the second clamping jaw being configured to be elastically movable relative to the second clamping portion via a connecting member.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: November 24, 2020
    Assignee: B. BRAUN MELSUNGEN AG
    Inventors: Matthias Kramer, Sarah Jacobskötter, Jürgen Steger, Helmut Freigang, Christian Schrödl, Stefan Batzdorf
  • Publication number: 20200164199
    Abstract: A device for opening and closing an infusion tube clamp includes a slide link which is axially arranged to be movable on a flap and includes at least one projecting locking element for closing an infusion tube clamp. An infusion tube clamp includes a first clamping leg and a second clamping leg pivotally connected to each other at one end, and a keeper plate which is arranged on the first clamping leg. At the locking element, the slide link includes a slide link ramp at which a switching cam of the keeper plate is adapted to slide into a stress-free final closing position.
    Type: Application
    Filed: July 18, 2018
    Publication date: May 28, 2020
    Inventors: HANS-JOSEF GERLACH, JÜRGEN STEGER
  • Publication number: 20200086041
    Abstract: A pump module for an infusion pump includes a plunger-cylinder unit that can be coupled to the infusion pump in order to deliver fluid from a fluid feed line into a fluid drain line to a patient. The plunger-cylinder unit has a delivery chamber that is fluidically connected to the fluid feed line and the fluid drain line. The delivery chamber is delimited by the cylinder (14). The plunger can be moved linearly/back and forth in the axial direction. A plunger seal seals the plunger in relation to the cylinder. The section of the wall of the cylinder, over which the plunger seal passes during the back-and-forth motion of the plunger, is sealed in a sterile manner in relation to the surroundings.
    Type: Application
    Filed: May 23, 2018
    Publication date: March 19, 2020
    Inventors: JÜRGEN FUCHS, JÜRGEN HARTUNG, JÜRGEN STEGER
  • Publication number: 20190333781
    Abstract: The invention provides a pressure sintering method including: a)providing a sintered component arrangement with a workpiece carrier having recesses, with a substrate resting on a main surface of the workpiece carrier, wherein a sintering material to be sintered is arranged between the power semiconductor components and the substrate, a first power semiconductor component and a first region of the substrate arranged above the workpiece carrier in the normal direction of the first main side of the insulation layer flush with a first recess of the workpiece carrier, and a second power semiconductor component and a second region of the substrate are arranged above the workpiece carrier in the normal direction of the first main side of the insulation layer flush with a second recess of the workpiece carrier and a step of b) pressurizing the power semiconductor components and applying a temperature treatment.
    Type: Application
    Filed: March 26, 2019
    Publication date: October 31, 2019
    Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventors: ALEXANDER WEHNER, Juergen Steger
  • Patent number: D883241
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 5, 2020
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventors: Peter Beckedahl, Juergen Steger, Ingo Bogen, Sandro Bulovic
  • Patent number: D889423
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: July 7, 2020
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventors: Peter Beckedahl, Juergen Steger, Ingo Bogen, Sandro Bulovic
  • Patent number: D892754
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: August 11, 2020
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventors: Peter Beckedahl, Juergen Steger, Ingo Bogen, Sandro Bulovic