Patents by Inventor Juha Erkki Antero Penttinen

Juha Erkki Antero Penttinen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal material within a device
    Patent number: 10264710
    Abstract: In an embodiment, thermal conductive material within a device having electrical component is described. In an embodiment, a device is disclosed comprising: a printed circuit board comprising electrical components; a housing of the device, wherein the housing substantially encloses the printed circuit board; a thermal conductive material coated on the printed circuit board, wherein the thermal conductive material is configured to coat an interface between an electrical component and the printed circuit board, and wherein the thermal conductive material is located between the printed circuit board and a portion of the housing according to both a three dimensional topography of the printed circuit board and a three dimensional shape of the portion of the housing.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: April 16, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: Juha Erkki Antero Penttinen
  • THERMAL MATERIAL WITHIN A DEVICE
    Publication number: 20170055374
    Abstract: In an embodiment, thermal conductive material within a device having electrical component is described. In an embodiment, a device is disclosed comprising: a printed circuit board comprising electrical components; a housing of the device, wherein the housing substantially encloses the printed circuit board; a thermal conductive material coated on the printed circuit board, wherein the thermal conductive material is configured to coat an interface between an electrical component and the printed circuit board, and wherein the thermal conductive material is located between the printed circuit board and a portion of the housing according to both a three dimensional topography of the printed circuit board and a three dimensional shape of the portion of the housing.
    Type: Application
    Filed: August 20, 2015
    Publication date: February 23, 2017
    Inventor: Juha Erkki Antero Penttinen