Patents by Inventor Juha Ikonen

Juha Ikonen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11928536
    Abstract: The present invention relates to an RFID label comprising an RFID tag which tag comprises an RFID antenna and an IC, which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate with a first surface and a second surface, wherein the first surface is siliconized, and the second surface is carrying the RFID tag, and a sticky adhesive layer which is arranged onto the second surface of the substrate and over the RFID tag.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: March 12, 2024
    Assignee: DIGITAL TAGS FINLAND OY
    Inventors: Lauri Huhtasalo, Juha Ikonen
  • Publication number: 20220414412
    Abstract: The present invention relates to an RFID label comprising an RFID tag which tag comprises an RFID antenna and an IC, which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate with a first surface and a second surface, wherein the first surface is siliconized, and the second surface is carrying the RFID tag, and a sticky adhesive layer which is arranged onto the second surface of the substrate and over the RFID tag.
    Type: Application
    Filed: November 4, 2020
    Publication date: December 29, 2022
    Applicant: DIGITAL TAGS FINLAND OY
    Inventors: Lauri HUHTASALO, Juha IKONEN
  • Patent number: 11244220
    Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: February 8, 2022
    Assignee: Digital Tags Finland, OY
    Inventors: Lauri Huhtasalo, Eerik Halonen, Juha Ikonen
  • Publication number: 20200311508
    Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.
    Type: Application
    Filed: October 31, 2018
    Publication date: October 1, 2020
    Applicant: Stora Enso OYJ
    Inventors: Lauri Huhtasalo, Eerik Halonen, Juha Ikonen
  • Patent number: 7971336
    Abstract: The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: July 5, 2011
    Assignee: Confidex OY
    Inventors: Marko Hanhikorpi, Lari Kytola, Jarkko Miettinen, Matti Ritamaki, Juha Ikonen, Heikki Ahokas
  • Publication number: 20090249611
    Abstract: The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.
    Type: Application
    Filed: May 12, 2006
    Publication date: October 8, 2009
    Inventors: Marko Hanhikorpi, Lari Kytola, Jarkko Miettinen, Matti Ritamaki, Juha Ikonen, Heikki Ahokas