Abstract: A fiber or plastic based package includes: an interface adapted to attach and connect, in a detachable manner, a module to a fiber or plastic based package, the module including a wireless transmitter, and the interface including conductors for transferring package data from the fiber or plastic based package to the module. A module, system and software are also implemented in connection with the fiber or plastic based package. A smart package, its management and various applications thereof are provided.

Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

Abstract: A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract: The invention concerns a method for forming an electrically conductive pattern on an insulating substrate. In the method, particle-type electrically conductive matter is transferred onto a surface of the substrate and the particle-type electrically conductive matter is at least partially sintered at elevated temperature and pressure in order to convert the particle-type electrically conductive matter into a continuously electrically conductive pattern affixed to the substrate. According to the invention, the electrically conductive matter is transferred in the form of a predefined pattern, and the sintering is carried out by using a nip comprising two opposing nip members between which the substrate is fed. The method provides an efficient way of making high-resolution conductor structures at low temperatures.

Abstract: A smart package backing (100) for pills removable from the backing, wherein the backing is adapted to record a removal of said pills by means of detection elements (103, 401a, 501a). The detection elements comprise electrical components (401a, 501a), wherein said electrical components are pressed onto the backing (100) with methods of printing technology. The removal of a pill from the backing is adapted to bring about a structural change in at least one printed component, and the structural change of said component is adapted to bring about an electrically measurable change in an electric circuit comprising said component. In addition, at least one of said electrical components (401a, 501a) deviates in terms of its specific electrical value from the specific electrical value of at least one other electrical component (401a, 501a).

Abstract: A monitoring system for monitoring smart package content use, wherein the system comprises a smart package. The smart package in turn comprises removable content units, such as pill type or tablet type or other singly packed objects, as well as most preferably wireless communication elements. The system comprises also database elements with which the smart package can be in communication. In addition, the smart package is adapted to detect said removal of a content unit and to deliver information to said database elements by way of said communication elements, regarding a removal of said content unit. The smart package is identifiable by the database elements on the basis of information delivered by way of said communication elements.

Abstract: An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.

Abstract: A chip is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip.

Abstract: In accordance with an embodiment of the invention there is provided a fiber or plastic based package comprising: an interface adapted to attach and connect, in a detachable manner, a module to a fiber or plastic based package, the module comprising a wireless transmitter, and the interface comprising conductors for transferring package data from the fiber or plastic based package to the module. An embodiment of the invention also comprises a module, system and software. An embodiment of the invention is related to a smart package, its management and various applications thereof.

Abstract: An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.

Abstract: The invention concerns a method for forming a conductive pattern on an insulating substrate and a related apparatus. In the method, particle-type conductive matter is transferred onto a surface of the substrate and the particle-type conductive matter is at least partially sintered at elevated temperature and pressure in order to convert the particle-formed pattern into a continuously conducting pattern affixed to the substrate. According to the invention, the conductive matter is transferred in the form of a predefined pattern, and the sintering is carried out by using a nip comprising two opposing nip members between which the substrate is fed. The method provides an efficient way of making high-resolution conductor structures at low temperatures.

Abstract: A film is formed on a planar surface by applying a granular layer on the planar surface by using electrostatic forces, and then finishing the granular layer to form the film. A converting line may be rebuilt to have devices employing this method. A multilayer sheet-like product comprising a film layer may be produced.

Abstract: A method for preliminary treatment of particles of a powder in a dry surface treatment process before applying the powder particles on a surface of a substrate by utilizing an electric field created by electrodes. The Electrodes are located at opposite sides of the substrate in such a way that at least one first electrode is located at the side of the substrate to be coated, and at least one second electrode is located at the opposites side of the substrate. The particles of the powder are pre-charged before bringing them into the electric field.

Abstract: A powdery layer is formed on a first side of a web (W) which serves as a substrate by applying electrically charged particles on the web while a rotating grounding electrode is located at a second side of the web.

Abstract: A continuous web having a first surface and a second surface is coated with a coating powder by allowing the web to move between a first and a second electrode, which are in different potentials and are located on the opposite sides of the web, applying the coating powder on the surface of the web by utilizing the difference in the electric potential, and finishing the coated surface of the web. Both surfaces of the web are coated essentially simultaneously by using oppositely charged electrodes.

Abstract: The surface of a web is coated with a dry coating powder. The coating powder has inorganic material and polymeric binder material. The polymeric binder material is selected in such a manner that when increasing the temperature above the glass transition temperature the ratio G?/G? is at the most equal to the ratio G?/G? in the glass transition temperature.

Abstract: A powdery layer is formed on a first side of a web (W) which serves as a substrate by applying electrically charged particles on the web while a rotating grounding electrode is located at a second side of the web.

Abstract: A film is formed on a planar surface by applying a granular layer on the planar surface by using electrostatic forces, and then finishing the granular layer to form the film. A converting line may be rebuilt to have devices employing this method. A multilayer sheet-like product comprising a film layer may be produced.

Abstract: A method for preliminary treatment of particles of a powder in a dry surface treatment process before applying the powder particles on a surface of a substrate by utilizing an electric field created by electrodes. The Electrodes are located at opposite sides of the substrate in such a way that at least one first electrode is located at the side of the substrate to be coated, and at least one second electrode is located at the opposites side of the substrate. The particles of the powder are pre-charged before bringing them into the electric field.