Patents by Inventor Juha Sakari Ellae

Juha Sakari Ellae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Filter device and method for fabricating filter devices
    Patent number: 7291547
    Abstract: A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate eliminates the need for a conventional package to protect the sensitive filters, which reduces both product size and product costs significantly. Even though additional packaging is possible (i.e. in plastic molded packages, or in glob-top packages), it is not required for the reliability of the filters.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: November 6, 2007
    Assignees: Infineon Technologies A.G., Nokia Corporation
    Inventors: Hans-Jörg Timme, Robert Aigner, Lüder Elbrecht, Juha Sakari Ellä, Katri Helena Pohjonen, Pasi Tikka
  • Filter circuit with a filter stage and balun on a single substrate
    Patent number: 7199684
    Abstract: A filter circuit comprises a balanced port, an unbalanced port and a substrate. A series circuit of a filter stage and a balun is disposed between the balanced port and the unbalanced port. The balun and the filter stage are formed on the substrate.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: April 3, 2007
    Assignee: Infineon Technologies AG
    Inventors: Robert Aigner, Juha Sakari Ellae, Stephan Marksteiner, Hans-Jörg Timme
  • Filter circuit
    Publication number: 20050212619
    Abstract: A filter circuit comprises a balanced port, an unbalanced port and a substrate. A series circuit of a filter stage and a balun is disposed between the balanced port and the unbalanced port. The balun and the filter stage are formed on the substrate.
    Type: Application
    Filed: January 28, 2005
    Publication date: September 29, 2005
    Applicants: Infineon Technologies AG, Nokia Corporation
    Inventors: Robert Aigner, Juha Sakari Ellae, Stephan Marksteiner, Hans-Jorg Timme