Patents by Inventor Juha T. Paavola

Juha T. Paavola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TOP SIDE FRAME STIFFENER STRUCTURE FOR A PRINTED CIRCUIT BOARD (PCB) STACK
    Publication number: 20220418083
    Abstract: A top side frame stiffener structure for a printed circuit board (PCB) stack. The structure is placed between a cooling component and a backing plate, in an area surrounding a substrate package. The structure does not cause the overall height of the PCB stack to increase.
    Type: Application
    Filed: September 2, 2022
    Publication date: December 29, 2022
    Applicants: Intel Corporation, Intel Corporation
    Inventors: Juha T. Paavola, Kari Pekka Johannes Mansukoski, Sami M. Heinisuo, Cody K. Hougnon
  • TECHNOLOGIES FOR PACKAGE LOADING MECHANISMS
    Publication number: 20220336322
    Abstract: Techniques for package loading mechanisms are disclosed. In the illustrative embodiment, a base portion of a laptop includes a circuit board on which an integrated circuit component is mounted. A heat sink is mated with the integrated circuit component. A spring presses against part of the chassis of the laptop, pressing the integrated circuit component and the heat sink together, providing strong thermal coupling between them.
    Type: Application
    Filed: June 27, 2022
    Publication date: October 20, 2022
    Applicant: Intel Corporation
    Inventors: Juha T. Paavola, Rob W. Sims, Alonso J. Rodriguez Chacon, Emery E. Frey, Monica Maria Conejo Herrera, Jerrod P. Peterson, Jose R. Diaz, Jose Guillermo Salazar Delgado