Patents by Inventor Ju-hee Park

Ju-hee Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240102611
    Abstract: A low profile flat bombe for Liquefied Petroleum Gas (LPG) storage and method for manufacturing the same, may include a flat bombe body including an upper plate having a plurality of first piercing holes and a pump installation hole formed therethrough, a lower plate having a plurality of second piercing holes formed therethrough at positions vertically coinciding with the plurality of first piercing holes, and side plates integrally connecting first and second side end portions of the upper and lower plates, end plates mounted at front and rear openings in the flat bombe body, and support pipes, wherein upper end portions of the support pipes are welded to internal circumferential portions of the plurality of first piercing holes and lower end portions thereof are welded to internal circumferential portions of the plurality of second piercing holes to maintain a vertical distance between the upper and lower plates.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAE HUNG PRECISION IND'L CO., LTD.
    Inventors: Seong Cheol Cho, Sung Won Lee, Ju Tae Song, Seung Hyun Yeo, Duk Hee Park
  • Patent number: 11937455
    Abstract: A display device includes a substrate having a first main display area, a second main display area, and a sub-display area positioned between the first main display area and the second main display area; a first driving circuit positioned on the sub-display area of the substrate; a first sub-pixel circuit and a second sub-pixel circuit positioned on respective sides of the first driving circuit in the sub-display area of the substrate; a first sub-light-emitting device connected to the first sub-pixel circuit and overlapping the first driving circuit; and a second sub-light-emitting device connected to the second sub-pixel circuit and overlapping the first driving circuit.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: March 19, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hye Won Kim, Sun Hee Lee, Ju Chan Park, Gun Hee Kim, Ok-Kyung Park
  • Publication number: 20240088239
    Abstract: A semiconductor device includes a substrate. A first channel pattern is disposed on the substrate. The first channel pattern includes a first side and a second side opposite to each other in a first direction. A first gate electrode is disposed on the first side of the first channel pattern. A first source/drain electrode is disposed on the first side of the first channel pattern. A second source/drain electrode is disposed on the second side of the first channel pattern. The first gate electrode overlaps the second source/drain electrode in the first direction.
    Type: Application
    Filed: May 19, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Yong PARK, Jin-Hong Park, Ju-Hee Lee
  • Publication number: 20240084025
    Abstract: Provided is a method for purifying an anti-4-1BB/anti-HER2 bispecific antibody, the method of which includes carrying out affinity chromatography with a sodium acetate buffer containing a certain inorganic salt as an elution buffer. The purification method of the presently claimed subject matter increases the elution of an antibody in the intact form, thereby being able to provide an anti-4-1BB/anti-HER2 bispecific antibody in the intact form in high purity and high yield.
    Type: Application
    Filed: January 21, 2022
    Publication date: March 14, 2024
    Applicant: YUHAN CORPORATION
    Inventors: Ju-Young PARK, Sung-Hyun CHOI, Yun-Hee CHOI, Won-Tae KIM
  • Patent number: 11919999
    Abstract: Provided are a method for preparing a polyetherketoneketone and a polyetherketoneketone prepared thereby, wherein, at the time of a polymerization reaction, nitrogen gas is blown into a liquid reaction medium while stirring, thereby quickly removing hydrochloric acid, which is a by-product generated during the reaction, and preventing aggregation of resin particles, thus suppressing the generation of scales.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: March 5, 2024
    Assignee: HANWHA CHEMICAL CORPORATION
    Inventors: Kwang Seok Jeong, Min Sung Kim, Jae Heon Kim, Ju Young Park, Cho Hee Ahn, Byeong Hyeon Lee, Sang Hyun Cho
  • Publication number: 20220097606
    Abstract: A mount base for a rearview mirror includes: a base body including a first material; and an insert embedded in the base body and including a second material. The base body has a first surface and a second surface opposing the first surface, the insert has a first surface and a second surface opposing the first surface, the first material is softer than the second material, and the second material has higher stiffness than the first material.
    Type: Application
    Filed: June 16, 2021
    Publication date: March 31, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, JAE HWA INDUSTRY CO., LTD, HANKUK SEKURIT LTD.
    Inventors: Gi Heon Jeong, Tae Soo Jung, Ju Hee Park, Nam Sup Kim
  • Patent number: 10889707
    Abstract: Disclosed is a glass fiber composite material composition having further improved compatibility between glass fibers and polypropylene and thus maximized interfacial adhesion between the resin and the glass fibers in a glass fiber composite material. The present invention provides a glass fiber composite material composition comprising: (A) 60-93% by weight of polypropylene; (B) 1-30% by weight of glass fiber sized with a silane-based compound; and (C) 1-10% by weight of a polypropylene resin modified with maleic anhydride and a methacryloxysilane-based compound.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: January 12, 2021
    Assignee: LOTTE CHEMICAL CORPORATION
    Inventors: Ju Hee Park, Byung Kak Jang, Seung Ju Lee
  • Publication number: 20190336427
    Abstract: The present invention relates to a novel protein transduction domain (PTD), which is a peptide having an amino acid sequence represented by SEQ ID NO: 1, and a use thereof. When the peptide represented by SEQ ID NO: 1 of the present invention is used as a PTD, biological molecules (target materials) such as proteins, peptides, DNA and the like can be easily introduced into cells in a high yield.
    Type: Application
    Filed: October 26, 2017
    Publication date: November 7, 2019
    Applicant: BIOCELTRAN CO., LTD.
    Inventors: Sang Ho JANG, Gil Whoan LEE, Jung Soon HWANG, Jun Ho PARK, Ju Hee PARK
  • Publication number: 20190203024
    Abstract: Disclosed is a glass fiber composite material composition having further improved compatibility between glass fibers and polypropylene and thus maximized interfacial adhesion between the resin and the glass fibers in a glass fiber composite material. The present invention provides a glass fiber composite material composition comprising: (A) 60-93% by weight of polypropylene; (B) 1-30% by weight of glass fiber sized with a silane-based compound; and (C) 1-10% by weight of a polypropylene resin modified with maleic anhydride and a methacryloxysilane-based compound.
    Type: Application
    Filed: September 18, 2017
    Publication date: July 4, 2019
    Inventors: Ju Hee PARK, Byung Kak JANG, Seung Ju LEE
  • Patent number: 9721113
    Abstract: A host controller that controls a storage device includes an encryption unit that is selectively configured in response to file encryption information and disk encryption information to encrypt data. The encryption unit encrypts the data using a file encryption operation based on the file encryption information and/or a disk encryption operation based on the disk encryption information.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: August 1, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ju-Hee Park, Seok-Min Park, Dong-Jin Park, Heon-Soo Lee, Hong-Mook Choi, Sang-Hyun Park
  • Publication number: 20170209605
    Abstract: Carbohydrate functionalized catanionic vesicles that include a glycoconjugate and/or peptidoconjugate for vaccination or drug delivery, methods for forming these, and methods of using these.
    Type: Application
    Filed: April 5, 2017
    Publication date: July 27, 2017
    Applicant: University of Maryland, College Park
    Inventors: Douglas S English, Philip R DeShong, Daniel C Stein, Sara Lioi, Ju-Hee Park, Emily J Danoff, Glen B Thomas
  • Patent number: 9420709
    Abstract: Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package includes: a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: August 16, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Kwan Lee, Myung Sam Kang, Joo Hwan Jung, Ju Hee Park, Seung Yeop Kook
  • Publication number: 20150371055
    Abstract: A host controller that controls a storage device includes an encryption unit that is selectively configured in response to file encryption information and disk encryption information to encrypt data. The encryption unit encrypts the data using a file encryption operation based on the file encryption information and/or a disk encryption operation based on the disk encryption information.
    Type: Application
    Filed: March 13, 2015
    Publication date: December 24, 2015
    Inventors: JU-HEE PARK, SEOK-MIN PARK, DONG-JIN PARK, HEON-SOO LEE, HONG-MOOK CHOI, SANG-HYUN PARK
  • Publication number: 20150351228
    Abstract: There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, a package board includes: a first insulating layer; a second insulating layer formed beneath the first insulating layer; a capacitor embedded in the first insulating layer and including a first electrode, a second electrode, and a dielectric layer formed between the first electrode and the second electrode; circuit layers formed on the first insulating layer and the second insulating layer; and a via formed between the capacitor and the circuit layers or between the circuit layers formed on the first insulating layer and the second insulating layer to electrically connect thererbetween, wherein an upper surface of the first electrode is formed to be exposed from the first insulating layer.
    Type: Application
    Filed: August 19, 2014
    Publication date: December 3, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seon PARK, Myung Sam Kang, Seung Eun Lee, Seung Yeop Kook, Ki Jung Sung, Ju Hee Park, Je Gwang Yoo
  • Publication number: 20150351247
    Abstract: There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, the package board includes: a first insulating layer formed with a penetrating cavity; a capacitor disposed in the cavity and including a first electrode, a second electrode formed on the first electrode, and a dielectric layer formed between the first electrode and the second electrode; a second insulating layer formed on the first insulating layer and in the cavity to embed the capacitor; circuit layers formed on the first insulating layer and the second insulating layer; and a via penetrating through the second insulating layer to electrically connect the circuit layer to the capacitor.
    Type: Application
    Filed: May 4, 2015
    Publication date: December 3, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Hee KWON, Myung Sam KANG, Seung Eun LEE, Ju Hee PARK, Seung Yeop KOOK, Je Gwang YOO, Jin Seon PARK
  • Patent number: D842893
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: March 12, 2019
    Assignee: Hancom, Inc.
    Inventors: So Hee Kim, Ju Hee Park, Ye Seung Cheon, Bo Ram Kim
  • Patent number: D842894
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: March 12, 2019
    Assignee: Hancom, Inc.
    Inventors: So Hee Kim, Ju Hee Park, Ye Seung Cheon, Bo Ram Kim
  • Patent number: D843410
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: March 19, 2019
    Assignee: Hancom Inc.
    Inventors: So Hee Kim, Ju Hee Park, Ye Seung Cheon, Bo Ram Kim
  • Patent number: D844024
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: March 26, 2019
    Assignee: Hancom, Inc.
    Inventors: So Hee Kim, Ju Hee Park, Ye Seung Cheon, Bo Ram Kim
  • Patent number: D845965
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 16, 2019
    Assignee: Hancom, Inc.
    Inventors: So Hee Kim, Ju Hee Park, Ye Seung Cheon, Bo Ram Kim