Patents by Inventor JuHwan Rha

JuHwan Rha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Projection and distance segmentation algorithm for wafer defect detection
    Patent number: 11610296
    Abstract: A projection is determined in a semiconductor image, which can be an X projection and/or a Y projection. At least one threshold is applied to the projection thereby forming at least one segment within the region. A fine segment can be determined in the region using a distance value from the projection. Defect detection can be performed in one of the fine segments.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: March 21, 2023
    Assignee: KLA CORPORATION
    Inventors: Xuguang Jiang, Juhwan Rha
  • PROJECTION AND DISTANCE SEGMENTATION ALGORITHM FOR WAFER DEFECT DETECTION
    Publication number: 20210217159
    Abstract: A projection is determined in a semiconductor image, which can be an X projection and/or a Y projection. At least one threshold is applied to the projection thereby forming at least one segment within the region. A fine segment can be determined in the region using a distance value from the projection. Defect detection can be performed in one of the fine segments.
    Type: Application
    Filed: December 16, 2020
    Publication date: July 15, 2021
    Inventors: Xuguang Jiang, JuHwan Rha
  • Repeater defect detection
    Patent number: 10957033
    Abstract: Repeater defects on a wafer can be detected by fusing multiple die images. In an instance, multiple die images are statistically fused to form a die-fused image. Each of the die images can be of a different die on a wafer. A presence of a repeater defect is detected in the die-fused image. The die images can be generated using a laser-scanning system or other systems.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: March 23, 2021
    Assignee: KLA-Tencor Corporation
    Inventors: Premchandra M. Shankar, Ashok Varadarajan, JuHwan Rha
  • Repeater Defect Detection
    Publication number: 20190012778
    Abstract: Repeater defects on a wafer can be detected by fusing multiple die images. In an instance, multiple die images are statistically fused to form a die-fused image. Each of the die images can be of a different die on a wafer. A presence of a repeater defect is detected in the die-fused image. The die images can be generated using a laser-scanning system or other systems.
    Type: Application
    Filed: September 14, 2017
    Publication date: January 10, 2019
    Inventors: Premchandra M. Shankar, Ashok Varadarajan, JuHwan Rha