Patents by Inventor Ju Hyeon Kim

Ju Hyeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250084196
    Abstract: An aspect of the present invention is to provide a fluorine-based polymer showing a significantly low dielectric constant of less than 1.8 and a fluorine-based polymer composition including the same. The fluorine-based polymer provided in an aspect of the present invention shows a very low dielectric constant, wherein the polymer is not only a pollution-reducing material generating no harmful substance, but may also be utilized as a coating material in various fields due to high adhesiveness. Furthermore, a polymer film employing the polymer as a material has a volume resistance of about 5.8×1015 Ohmcm, showing an excellent resistance value as an insulating material.
    Type: Application
    Filed: July 4, 2022
    Publication date: March 13, 2025
    Inventors: Eun-Ho SOHN, Won Wook SO, In Joon PARK, Bong Jun CHANG, Hong Suk KANG, Ju Hyeon KIM, Ji Hoon BAIK, Sang Goo LEE, Hyeon Jun HEO, Shin Hong YOOK, Dong Je HAN, Ji Young LEE
  • Publication number: 20250042234
    Abstract: A storage system for a vehicle has a configuration capable of storing a plurality of high-voltage battery packs in a separably assembled state in a seat backboard of the vehicle through a coupling structure of a protrusion and a groove. Only a broken or failed high-voltage battery pack from among a plurality of high-voltage battery packs assembled to the seat backboard is separated from the seat backboard, and a new high-voltage battery pack can then replace the failed high-voltage battery pack through assembly thereof to the seat backboard at a position from which the failed high-voltage battery pack has been separated.
    Type: Application
    Filed: December 5, 2023
    Publication date: February 6, 2025
    Inventors: Suk Won Hong, Hyeong Jong Kim, Ju Yeol Kong, Byeong Kwang Kim, So Young Yoo, Han Su Yoo, Byung Yong Choi, Sang Do Park, Seong Hyeon Shin
  • Publication number: 20250046086
    Abstract: In an embodiment, an apparatus may include an image receiver configured to receive a thermal image from a thermal imaging camera, a worker detector configured to detect a worker from the received thermal image by using an artificial intelligence model, a hazard detector configured to detect a hazard based on whether the detected worker has entered a preset hazardous area in the thermal image, and a hazard controller configured to, in response to the hazard being detected, send a hazard notification and stop operation of a work machine in the hazardous area, where a position of the detected worker can be estimated in pixel units.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 6, 2025
    Inventors: Ju Heon Hwang, Deog Hyeon Kim, Jinwoo Park, Seungryul Baek, Junuk Cha, Jihyeon Kim
  • Publication number: 20250033568
    Abstract: A vehicle seat apparatus includes: a receiving device provided on a seat of a vehicle, where an auxiliary battery and a portable electronic device are received in the receiving device, and a controller that controls power transmission between the auxiliary battery received in the receiving device and a convenience device of the seat. The receiving device is provided on a back board of the seat, and the auxiliary battery and the portable electronic device may be received in the receiving device or taken from the receiving device. During charging, the auxiliary battery is charged with power of a vehicle power supply or the portable electronic device is wirelessly charged with power of the auxiliary battery in normal times, and the power of the auxiliary battery may be supplied to the convenience device of the seat in an emergency.
    Type: Application
    Filed: March 18, 2024
    Publication date: January 30, 2025
    Inventors: Suk Won Hong, Hyeong Jong Kim, Ju Yeol Kong, Byeong Kwang Kim, Seong Hyeon Shin, Han Su Yoo, Byung Yong Choi, Sang Do Park, So Young Yoo, Jeong Mi Seo
  • Publication number: 20240414928
    Abstract: A perovskite photoactive composite layer, a preparation method thereof, and a perovskite solar cell comprising the same are provided. The perovskite photoactive composite layer can induce smooth charge transport when applied to a solar cell by means of a two-dimensional perovskite photoactive layer grown by recrystallization in the vertical direction, and can passivate surface defects in two-dimensional perovskites and prevent the release of halogen atoms through effective passivation by means of a passivation layer consisting of an organic monomolecular compound containing zwitterions, thereby improving the photostability of the solar cell.
    Type: Application
    Filed: February 8, 2024
    Publication date: December 12, 2024
    Inventors: Kwang Hee LEE, Ju Hyeon KIM
  • Publication number: 20240318025
    Abstract: The present invention relates to a fluorine-based polymer coating film, an optical substrate comprising same, and a method for manufacturing the optical substrate, and provides a fluorine-based polymer coating film which is formed from fluorine-based polymer nanoparticles coming in contact and being bound to each other, and which is coated on a substrate to improve infrared transmittance. The fluorine-based polymer coating film according to the present invention has improved infrared transmittance, and since the size of the fluorine-based polymer nanoparticles is controlled to control the ultraviolet-infrared transmittance, transmission wavelength selectivity can be improved.
    Type: Application
    Filed: December 28, 2021
    Publication date: September 26, 2024
    Applicant: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Eun-Ho SOHN, Hyeon Jun HEO, Won Wook SO, In Joon PARK, Bong Jun CHANG, Sang Goo LEE, Myoung Sook LEE, Shin Hong YOOK, Ju Hyeon KIM, Ji Hoon BAIK, Myung Seok OH, Jong Min KIM
  • Publication number: 20240199780
    Abstract: The objective of the present invention is to provide a fluorine-based polymer having a low surface energy, a fluorine-based polymer composition comprising same, a fluorine-based polymer membrane comprising same, and a method for manufacturing same. The present invention provides an acrylate-based copolymer, and in particular, the present invention is characterized in that the number of fluorocarbons in the repeating unit is limited to 3 to 5, such that the surface energy of the polymer and the polymer membrane produced therefrom is significantly lowered. In addition, when the polymer of the present invention is coated on glass, etc., the polymer has the effect of remarkably improving light transmittance, and has excellent mechanical strength.
    Type: Application
    Filed: February 7, 2022
    Publication date: June 20, 2024
    Inventors: Eun-Ho SOHN, Won Wook SO, In Joon PARK, Bong Jun CHANG, Ju Hyeon KIM, Ji Hoon BAIK, Myung Seok OH, Jong Min KIM, Sang Goo LEE, Myoung Sook LEE, Hyeon Jun HEO, Shin Hong YOOK
  • Publication number: 20240194372
    Abstract: The present invention relates to an insulating gas used for electrical insulation or arc extinguishing of an electrical device, and an electrical device for insulating electricity using the same. The insulating gas of the present invention, which may replace SF6 gas, consists of a mixed gas of trifluoromethyl trifluorovinyl ether (CF3OCFCF2) and a carrier gas. The insulating gas of the present invention has the characteristics of a low boiling point, high dielectric strength, low toxicity, and a low global warming potential (GWP=1 or less), and thus may replace SF6, and the low global warming potential with no loss of high insulating capacity and arc extinguishing capability may reduce greenhouse gases.
    Type: Application
    Filed: October 25, 2021
    Publication date: June 13, 2024
    Applicants: KOREA ELECTRO TECHNOLOGY RESEARCH INSTITUTE, KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Ki Dong SONG, Yeon Ho OH, Hyun Jae JANG, In Joon PARK, Won Wook SO, Shin Hong YOOK, Sang Goo LEE, Hong suk KANG, Ju Hyeon KIM, Ji Hoon BAIK, Eun Ho SOHN, Myoung Sook LEE, Bong Jun CHANG
  • Patent number: 12006308
    Abstract: The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: June 11, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Youngsam Kim, Junghak Kim, Ju Hyeon Kim, Kwang Joo Lee
  • Patent number: 11993731
    Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: May 28, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Junghak Kim, You Jin Kyung, Kwang Joo Lee, Minsu Jeong, Ju Hyeon Kim, Youngsam Kim
  • Publication number: 20240124438
    Abstract: Provided are a phenanthroline-based compound, a method of preparing the same, and a perovskite solar cell including the same. The phenanthroline-based compound may be formed as a uniform layer even by a solution process due to its low average surface roughness (root mean square, RMS) and excellent processability. When a layer having the phenanthroline-based compound is provided as a polymer functional layer of the perovskite solar cell, the ionic defects on the surface between the perovskite and a metal oxide, may be passivated and charge transfer may be facilitated so that the energy efficiency and photostability of the solar cell are improved.
    Type: Application
    Filed: August 29, 2023
    Publication date: April 18, 2024
    Inventors: Kwang Hee LEE, Hee Joo KIM, Yong Ryun KIM, Ju Hyeon KIM
  • Patent number: 11834415
    Abstract: The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: December 5, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Ju Hyeon Kim, Junghak Kim, Seunghee Nam, Kwang Joo Lee
  • Publication number: 20230174834
    Abstract: The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.
    Type: Application
    Filed: October 20, 2020
    Publication date: June 8, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Eun Bum KIM, Kwang Joo LEE, Jung Hak KIM, Ju Hyeon KIM, Yoon Sun JANG
  • Publication number: 20230051048
    Abstract: Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.
    Type: Application
    Filed: February 4, 2021
    Publication date: February 16, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Eun Bum KIM, Ju Hyeon KIM, Kwang Joo LEE, Jung Hak KIM, Yoon Sun JANG
  • Publication number: 20210292616
    Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 23, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Junghak KIM, You Jin KYUNG, Kwang Joo LEE, Minsu JEONG, Ju Hyeon KIM, Youngsam KIM
  • Publication number: 20210292618
    Abstract: The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.
    Type: Application
    Filed: May 8, 2020
    Publication date: September 23, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Youngsam KIM, You Jin KYUNG, Kwang Joo LEE, Minsu JEONG, Junghak KIM, Ju Hyeon KIM
  • Publication number: 20210277246
    Abstract: The present disclosure relates to a compound represented by Chemical Formula 1, a probe for detecting antibiotic-resistant bacteria, which includes the compound, a composition containing the compound, a kit including the compound and a method for detecting antibiotic-resistant bacteria. A compound probe having a carbapenem structure and including a linker and a fluorophore can detect beta-lactamase or carbapenemase at high sensitivity and, therefore, can be applied to various biochemical researches. In addition, the compound probe can clinically detect carbapenemase-producing antibiotic-resistant bacteria and allows molecular diagnosis of antibiotic-resistant bacterial infectious diseases and analysis of antibiotic-resistant bacteria from a target sample at high sensitivity. Therefore, it can be effectively used for medicinal uses such as in-vitro diagnosis.
    Type: Application
    Filed: July 30, 2019
    Publication date: September 9, 2021
    Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Sun Joon MIN, Yeon Joon PARK, Ju Hyeon KIM
  • Publication number: 20210115021
    Abstract: The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.
    Type: Application
    Filed: October 22, 2019
    Publication date: April 22, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Youngsam KIM, Junghak KIM, Ju Hyeon KIM, Kwang Joo LEE
  • Publication number: 20200308121
    Abstract: The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.
    Type: Application
    Filed: April 17, 2019
    Publication date: October 1, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Ju Hyeon KIM, Junghak KIM, Seunghee NAM, Kwang Joo LEE
  • Patent number: 10332855
    Abstract: A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the semiconductor chip. A second connection member is on the first connection member and the semiconductor chip. The first connection member and the second connection member each include a redistribution layer electrically connected to a connection pad of the semiconductor chip. The interface between the second connection member and the encapsulant is located on a different level from the level of the interface between the second connection member and a redistribution layer of the first connection member or the level of the interface between the second connection member and a connection pad of the semiconductor chip.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Doo Hwan Lee, Ju Hyeon Kim, Dae Kyu Ahn, Sung Won Jeong