Abstract: A vehicle seat apparatus includes: a receiving device provided on a seat of a vehicle, where an auxiliary battery and a portable electronic device are received in the receiving device, and a controller that controls power transmission between the auxiliary battery received in the receiving device and a convenience device of the seat. The receiving device is provided on a back board of the seat, and the auxiliary battery and the portable electronic device may be received in the receiving device or taken from the receiving device. During charging, the auxiliary battery is charged with power of a vehicle power supply or the portable electronic device is wirelessly charged with power of the auxiliary battery in normal times, and the power of the auxiliary battery may be supplied to the convenience device of the seat in an emergency.

Abstract: A perovskite photoactive composite layer, a preparation method thereof, and a perovskite solar cell comprising the same are provided. The perovskite photoactive composite layer can induce smooth charge transport when applied to a solar cell by means of a two-dimensional perovskite photoactive layer grown by recrystallization in the vertical direction, and can passivate surface defects in two-dimensional perovskites and prevent the release of halogen atoms through effective passivation by means of a passivation layer consisting of an organic monomolecular compound containing zwitterions, thereby improving the photostability of the solar cell.

Abstract: The present invention relates to a fluorine-based polymer coating film, an optical substrate comprising same, and a method for manufacturing the optical substrate, and provides a fluorine-based polymer coating film which is formed from fluorine-based polymer nanoparticles coming in contact and being bound to each other, and which is coated on a substrate to improve infrared transmittance. The fluorine-based polymer coating film according to the present invention has improved infrared transmittance, and since the size of the fluorine-based polymer nanoparticles is controlled to control the ultraviolet-infrared transmittance, transmission wavelength selectivity can be improved.

Abstract: The objective of the present invention is to provide a fluorine-based polymer having a low surface energy, a fluorine-based polymer composition comprising same, a fluorine-based polymer membrane comprising same, and a method for manufacturing same. The present invention provides an acrylate-based copolymer, and in particular, the present invention is characterized in that the number of fluorocarbons in the repeating unit is limited to 3 to 5, such that the surface energy of the polymer and the polymer membrane produced therefrom is significantly lowered. In addition, when the polymer of the present invention is coated on glass, etc., the polymer has the effect of remarkably improving light transmittance, and has excellent mechanical strength.

Abstract: The present invention relates to an insulating gas used for electrical insulation or arc extinguishing of an electrical device, and an electrical device for insulating electricity using the same. The insulating gas of the present invention, which may replace SF6 gas, consists of a mixed gas of trifluoromethyl trifluorovinyl ether (CF3OCFCF2) and a carrier gas. The insulating gas of the present invention has the characteristics of a low boiling point, high dielectric strength, low toxicity, and a low global warming potential (GWP=1 or less), and thus may replace SF6, and the low global warming potential with no loss of high insulating capacity and arc extinguishing capability may reduce greenhouse gases.

Abstract: The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.

Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

Abstract: Provided are a phenanthroline-based compound, a method of preparing the same, and a perovskite solar cell including the same. The phenanthroline-based compound may be formed as a uniform layer even by a solution process due to its low average surface roughness (root mean square, RMS) and excellent processability. When a layer having the phenanthroline-based compound is provided as a polymer functional layer of the perovskite solar cell, the ionic defects on the surface between the perovskite and a metal oxide, may be passivated and charge transfer may be facilitated so that the energy efficiency and photostability of the solar cell are improved.

Abstract: The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.

Abstract: The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.

Abstract: Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

Abstract: The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.

Abstract: The present disclosure relates to a compound represented by Chemical Formula 1, a probe for detecting antibiotic-resistant bacteria, which includes the compound, a composition containing the compound, a kit including the compound and a method for detecting antibiotic-resistant bacteria. A compound probe having a carbapenem structure and including a linker and a fluorophore can detect beta-lactamase or carbapenemase at high sensitivity and, therefore, can be applied to various biochemical researches. In addition, the compound probe can clinically detect carbapenemase-producing antibiotic-resistant bacteria and allows molecular diagnosis of antibiotic-resistant bacterial infectious diseases and analysis of antibiotic-resistant bacteria from a target sample at high sensitivity. Therefore, it can be effectively used for medicinal uses such as in-vitro diagnosis.

Abstract: The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.

Abstract: The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.

Abstract: A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the semiconductor chip. A second connection member is on the first connection member and the semiconductor chip. The first connection member and the second connection member each include a redistribution layer electrically connected to a connection pad of the semiconductor chip. The interface between the second connection member and the encapsulant is located on a different level from the level of the interface between the second connection member and a redistribution layer of the first connection member or the level of the interface between the second connection member and a connection pad of the semiconductor chip.

Abstract: A semiconductor package includes: a core member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip. A wall of the through-hole has an uneven portion.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip.

Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip.