Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (A1) or formula (A2): Zr12O8(OH)14(RCO2)18 ??Formula (A1); or Hf6O4(OH)6(RCO2)10 ??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.

Abstract: A power module adapted to a computer system is provided in the disclosure. The power module includes three batteries, a first voltage output terminal, a second voltage output terminal, a third voltage output terminal, and a charging/discharging control unit. The charging/discharging control unit determines a quantity of serially connected batteries based on a load signal of the computer system, to supply a first voltage to the first voltage output terminal, a second voltage to the second voltage output terminal, or a third voltage to the third voltage output terminal. The first voltage, the second voltage, and the third voltage correspond to different quantities of batteries. The disclosure further provides a power supply method.

Abstract: A charging device connected to a power source for charging a plurality of electronic devices is provided. Each of the electronic devices has a predetermined charging power. The charging device comprises a power input end, a plurality of power output ends, a plurality of charging units, and a controller. The power input end is connected to the power source. The power output ends are utilized to connect the electronic devices. The charging units are electrically connected to the power output ends respectively. The controller is electrically connected to the power input end, the power output ends and the charging units for accessing an output power of the power source via the power input and each of the predetermined charging powers via the power output ends, and controlling the charging units according to the output power and the predetermined charging powers.

Abstract: An accessory device, and an electronic system and an operation method thereof are provided. The accessory device includes a functional module, a first connection interface, a second connection interface, a switch module, and a microcontroller. The first connection interface is configured to be coupled to an external first electronic device. The second connection interface is configured to be coupled to an external second electronic device. The switch module is disposed between the first connection interface and the second connection interface, and between the first connection interface and the functional module. The microcontroller controls the switch module, so that at least one of the first electronic device, the second electronic device, and the functional module supplies power to at least another one of the first electronic device, the second electronic device, and the functional module.

Abstract: An electronic system includes a first device and a second device is provided. The first device includes a power connector, a first connector, a first battery, and a charging controller. The second device includes a second connector and a second battery. The power connector is configured to receive an external voltage. The first battery is electrically connected to the power connector and the first connector. The charging controller is electrically connected to the power connector and the first battery. The second connector is utilized for connecting the first connector. The second battery is electrically connected to the second connector. When the first connector is connected to the second connector, the charging controller selectively connects the first battery and the second battery in a series via the first connector and the second connector according to the level of the first battery and the second battery.

Abstract: An authentication system for a wireless network is disclosed. The authentication system includes a card, a card reader, an end-user device, and a wireless access device. The card reader is coupled to the wireless access device. The card records a data, and the card reader reads the data recorded in the card. The wireless access device receives the data read by the card reader and performs authentication between the wireless access device and the end-user device according to the data.

Abstract: An authentication system for a wireless network is disclosed. The authentication system includes a card, a card reader, an end-user device, and a wireless access device. The card reader is coupled to the wireless access device. The card records a data, and the card reader reads the data recorded in the card. The wireless access device receives the data read by the card reader and performs authentication between the wireless access device and the end-user device according to the data.

Abstract: A system and method are provided for scheduling a monitor job for a tool in a semiconductor manufacturing environment and for optimizing the scheduling of jobs in such an environment. In one example, the method includes receiving a monitor job and monitoring a status of the tool to determine when a predefined event occurs. A position in a buffer in which to place the monitor job may be identified in response to the event occurring, where placing the monitor job in the identified position will cause the monitor job to be executed at a correct time.

Abstract: A system for manufacturing semiconductor integrated circuit (IC) devices, including an operating control system, a process intermediate station in communication with the operating control system, and a gas purge device, wherein the gas purge device is included in the process intermediate station.

Abstract: A system for manufacturing semiconductor integrated circuit (IC) devices, including an operating control system, a process intermediate station in communication with the operating control system, and a gas purge device, wherein the gas purge device is included in the process intermediate station.

Abstract: A system and method are provided for scheduling a monitor job for a tool in a semiconductor manufacturing environment and for optimizing the scheduling of jobs in such an environment. In one example, the method includes receiving a monitor job and monitoring a status of the tool to determine when a predefined event occurs. A position in a buffer in which to place the monitor job may be identified in response to the event occurring, where placing the monitor job in the identified position will cause the monitor job to be executed at a correct time.

Abstract: A transport system within a fabrication system. The fabrication system contains a plurality of tool bays, each of which has a plurality of processing tools for processing articles. The transport system contains a plurality of intrabay transport subsystems, an interbay transport subsystem, a plurality of stockers, and at least one linking subsystem. Each intrabay transport subsystem is dedicated to transporting articles within a particular tool bay. The interbay transport subsystem, linking the tool bays, transports articles between the tool bays. The stockers, located between the intrabay and interbay transport subsystems, store articles between processing and transfer articles between the intrabay and interbay transport subsystems. The linking subsystem, located between two adjacent intrabay transport subsystems, provides direct transport between the two corresponding tool bays.

Abstract: A transport system within a fabrication system. The fabrication system contains a plurality of tool bays, each of which has a plurality of processing tools for processing articles. The transport system contains a plurality of intrabay transport subsystems, an interbay transport subsystem, a plurality of stockers, and at least one linking subsystem. Each intrabay transport subsystem is dedicated to transporting articles within a particular tool bay. The interbay transport subsystem, linking the tool bays, transports articles between the tool bays. The stockers, located between the intrabay and interbay transport subsystems, store articles between processing and transfer articles between the intrabay and interbay transport subsystems. The linking subsystem, located between two adjacent intrabay transport subsystems, provides direct transport between the two corresponding tool bays.

Abstract: The present invention provides an automated material handling system (AMHS) having: a FOUP management system, for managing a plurality of multiple lot FOUPs; a real time dispatch system for controlling dispatching of wafer lot orders within a wafer fabrication system; an automatic material handling integration system having a stocker for storing and sequencing a plurality of FOUPs, the stocker having an embedded sorter disposed there within for sorting wafers within a plurality of multiple lot FOUPs, and a FOUP transportation system for transporting FOUPs within a wafer fabrication facility; a manufacture execution system in operative communication with the real time dispatch system for controlling recipe processing and for controlling flow of FOUPs within the FAB; and a computer integrated manufacturing system for automating equipment within the AMHS. Additionally provided is a methodology for using the embedded sorter to sort FOUPs and a plurality of wafers within the AMHS.

Abstract: The present invention provides an automated material handling system (AMHS) having: a FOUP management system, for managing a plurality of multiple lot FOUPs; a real time dispatch system for controlling dispatching of wafer lot orders within a wafer fabrication system; an automatic material handling integration system having a stocker for storing and sequencing a plurality of FOUPs, the stocker having an embedded sorter disposed there within for sorting wafers within a plurality of multiple lot FOUPs, and a FOUP transportation system for transporting FOUPs within a wafer fabrication facility; a manufacture execution system in operative communication with the real time dispatch system for controlling recipe processing and for controlling flow of FOUPs within the FAB; and a computer integrated manufacturing system for automating equipment within the AMHS. Additionally provided is a methodology for using the embedded sorter to sort FOUPs and a plurality of wafers within the AMHS.

Abstract: A type of relief engraved doorplate, comprising an inside plate that is composed of a first Bakelite layer and a second Bakelite layer, said first Bakelite layer and second Bakelite layer being composed of coarse wood dust and fine wood powder respectively, the second Bakelite layer enveloping the exterior of the first Bakelite layer before they are subjected to heated compression molding to obtain the relief engraved pattern on the top and bottom panels of the inside plate; and, at least one pair of outside decorative plates, including at least a layer of thin wood plate and a layer of water-resistant paper, the water-resistant paper being glued onto the thin wood plate and put in a compression mold with a pattern that is opposite to that of the inside plate, to obtain a depressed pattern on one side of the outside decorative plate, which is opposite to the relief engraved pattern on the inside plate, and then it is fitted to the top and bottom panels of the inside plate and subjected to compression molding

Abstract: A type of relief engraved doorplate, comprising an inside plate that is composed of a first Bakelite layer and a second Bakelite layer, said first Bakelite layer and second Bakelite layer being composed of coarse wood dust and fine wood powder respectively, the second Bakelite layer enveloping the exterior of the first Bakelite layer before they are subjected to heated compression molding to obtain the relief engraved pattern on the top and bottom panels of the inside plate; and, at least one pair of outside decorative plates, including at least a layer of thin wood plate and a layer of water-resistant paper, the water-resistant paper being glued onto the thin wood plate and put in a compression mold with a pattern that is opposite to that of the inside plate, to obtain a depressed pattern on one side of the outside decorative plate, which is opposite to the relief engraved pattern on the inside plate, and then it is fitted to the top and bottom panels of the inside plate and subjected to compression molding