Abstract: The present disclosure provides an electrodeposited copper foil having a puncture strength value and a tear strength value. A ratio of the puncture strength value to the tear strength value is from 14 to 64. The present disclosure also provides a lithium-ion secondary battery. The lithium-ion secondary battery is manufactured by using the electrodeposited copper foil and has excellent charge-discharge cycle life.

Abstract: Electrodeposited copper foils having properties suitable for use as negative electrode current collectors in lithium-ion secondary batteries are disclosed. The copper foil has a yield strength in the range of 11 to 45 kg/mm2, and a difference in residual stress between the drum side and the deposited side of at most 95 MPa. Negative electrode current collectors for lithium-ion secondary battery, a lithium-ion secondary battery incorporating the negative electrode, and batteries containing the negative electrode current collector are also disclosed.

Abstract: An electrodeposited copper foil of high toughness having a lightness L* value of the deposit side in the range of 36 to 74, the copper foil having a tensile strength in the range of 40 to 70 kg/mm2, and a weight deviation of less than 3%. The electrodeposited copper foils are particularly useful as current collectors for anode components of rechargeable secondary batteries and tend not to form wrinkles during charge-discharge cycles of the battery and are resistant to fracture during pressing of the anode active materials onto the copper foil. Secondary batteries and methods of manufacture are also described.

Abstract: Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

Abstract: Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

Abstract: Electrodeposited copper foils having adequate puncture strength to withstand both pressure application during consolidation with negative electrode active materials during manufacture, as well as expansion/contraction during repeated charge/discharging cycles when used in a rechargeable secondary battery are described. These copper foils find specific utility as current collectors in rechargeable secondary batteries, particularly in lithium secondary battery with high capacity. Methods of making the copper foils, methods of producing negative electrode for use in lithium secondary battery and lithium secondary battery of high capacity are also described.

Abstract: An electrodeposited copper foil of high toughness having a lightness L* value of the deposit side in the range of 36 to 74, the copper foil having a tensile strength in the range of 40 to 70 kg/mm2, and a weight deviation of less than 3%. The electrodeposited copper foils are particularly useful as current collectors for anode components of rechargeable secondary batteries and tend not to form wrinkles during charge-discharge cycles of the battery and are resistant to fracture during pressing of the anode active materials onto the copper foil. Secondary batteries and methods of manufacture are also described.

Abstract: Electrodeposited copper foils having adequate puncture strength to withstand both pressure application during consolidation with negative electrode active materials during manufacture, as well as expansion/contraction during repeated charge/discharging cycles when used in a rechargeable secondary battery are described. These copper foils find specific utility as current collectors in rechargeable secondary batteries, particularly in lithium secondary battery with high capacity. Methods of making the copper foils, methods of producing negative electrode for use in lithium secondary battery and lithium secondary battery of high capacity are also described.

Abstract: A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminated to a polymer layer to form the printed circuit board, with the step of separating the thin copper foil from the composite copper foil is performed subsequent to said laminating step.

Abstract: A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminated to a polymer layer to form the printed circuit board, with the step of separating the thin copper foil from the composite copper foil is performed subsequent to said laminating step.

Abstract: The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.

Abstract: The present disclosure relates to an improved electrodeposited copper foil having uniform thickness and methods for manufacturing the electrodeposited copper foil. The electrodeposited copper foil typically has one to four interfacial lines through the cross-sectional area of the foil and a weight deviation less than 2.0%. The disclosure also relates to a process for making the electrodeposited copper foil that includes the addition of one or more insulative masks to the surface of a dimensionally stable anode. The insulative mask is cut to correspond to areas of variation in electrodeposited copper foil, such that the mask causes interferences with the electrodeposition process to even out the variation.

Abstract: An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.

Abstract: The present disclosure relates to a copper foil which exhibits surprising anti-deformation properties (e.g., it is resistant to swelling, sagging, and wrinkling). Typically, the copper foil has (a) a shiny side with a surface roughness (Rz) in the range of 0.6 to 1.9 ?m; (b) a matte side with a surface roughness (Rz) in the range of 0.6 to 1.9 ?m; and (c) a lightness L* value of the matte side, based on the L*a*b* color system, in the range of 12 to 35. The disclosure further relates to an anode comprising an anode active material on an anode current collector, wherein the anode current collector includes the above-mentioned copper foil. The anodes are used in, for example, lithium ion secondary batteries.

Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.

Abstract: The present invention provides a method for producing a porous copper foil. The method of the present invention includes the steps of forming an oxide film by providing a chromium-containing compound to a metal surface of a cathode; forming a copper foil on the oxide film by performing electrolysis of copper; and removing the copper foil from the metal surface of the cathode. The method of the present invention is simple and time-saving, and the porous copper foil of the present invention has reduced roughness difference between both sides of the porous copper foil.

Abstract: The present disclosure relates to an improved coated copper foil that exhibits anti-curl and anti-wrinkle properties; and to methods for manufacturing the foil. Typically, the copper foil of the instant disclosure has: (a) a shiny side; (b) a matte side, wherein the matte side has an MD gloss in the range of 330 to 620; (c) a difference in surface roughness (Rz) between the shiny side and the matte side in the range of 0.3 to 0.59 ?m; and (d) a difference in tensile strength in the transverse direction of 1.2 kgf/mm2 or less.

Abstract: An electrolytic copper foil, which is particularly suitable for the application of a lithium ion secondary battery, has a shiny side and a matte side with a roughness of less than 2 ?m. Based on the total sum of the texture coefficients of a (111) surface, a (200) surface, a (220) surface and a (311) surface of the electrolytic copper foil, the sum of the texture coefficients of the (220) surface and the (311) surface of the electrolytic copper foil is greater than 60%.

Abstract: An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.

Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.