Abstract: Provided are an electrolytic copper foil, an electrode and a lithium-ion cell comprising the same. The electrolytic copper foil has a first surface and a second surface opposite the first surface. An absolute difference of the FWHM of the characteristic peaks of (111) planes of the first surface and the second surface analyzed by GIXRD is less than 0.14, the first and the second surfaces each have a nanoindentation hardness of 0.3 GPa to 3.0 GPa, and the yield strength of the electrolytic copper foil is more than 230 MPa. By controlling the absolute difference of the FWHM of the characteristic peaks of (111) plane of these two surfaces, the nanoindentation hardness of these two surfaces and the yield strength, the electrolytic copper foil can have improved tolerance to the repeated charging and discharging and reduced warpage, thereby improving the yield rate and value of the lithium-ion cell.

Abstract: A film deformation element includes a first stack and a second stack. The first stack includes a first passivation layer, a first substrate, a first metal layer and a first dielectric layer. The first substrate is disposed on the first passivation layer. The first metal layer is disposed on the first substrate. The first dielectric layer is disposed on the first metal layer. The second stack is bonded to the first stack, to form a sealing space. The second stack includes a second passivation layer, a second substrate, a second metal layer and a second dielectric layer. The second dielectric layer is disposed on and faces the first dielectric layer. The second metal layer is disposed on the second dielectric layer. The second substrate is disposed on the second metal layer. The second passivation layer is disposed on the second substrate.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.

Abstract: A physiological sensor device and system, and a correction method are provided. The physiological sensor device includes a physiological signal sensor, a first compensation sensor, and a signal processing device. The physiological signal sensor is attached to an object to be detected to sense a physiological signal value. The first compensation sensor is disposed on the physiological signal sensor. The signal processing device is coupled to the physiological signal sensor and the first compensation sensor. The signal processing device obtains through the first compensation sensor a failure region of the physiological signal sensor partially detached from the object to be detected and obtains a first failure compensation value according to the failure region, so as to compensate the physiological signal value sensed by the physiological signal sensor.

Abstract: A synchronous rectifier controller controls a rectification power switch connected in series with a secondary winding between two power lines. The synchronous rectifier has a gate driver and a slew-rate detector. The gate driver drives the rectification power switch. The slew-rate detector detects a channel voltage of the rectification power switch, checks if a slew rate of the channel voltage exceeds a slope threshold. If the slew rate exceeds the slope threshold, the slew-rate detector turns the rectification power switch ON through the gate driver. If the slew rate is less than the slope threshold, the slew-rate detector reduces the slope threshold.

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 ?m, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

Abstract: A synchronous rectifier controller controls a rectification power switch connected in series with a secondary winding between two power lines. The synchronous rectifier has a gate driver and a slew-rate detector. The gate driver drives the rectification power switch. The slew-rate detector detects a channel voltage of the rectification power switch, checks if a slew rate of the channel voltage exceeds a slope threshold. If the slew rate exceeds the slope threshold, the slew-rate detector turns the rectification power switch ON through the gate driver. If the slew rate is less than the slope threshold, the slew-rate detector reduces the slope threshold.

Abstract: An electronic device package structure and a manufacturing method thereof are provided. The electronic device package structure includes a first electronic device layer, a second electronic device layer, and a filling layer disposed between the first electronic device layer and the second electronic device layer, wherein the Young's modulus of the second electronic device layer is less than or equal to the Young's modulus of the first electronic device layer, and the Young's modulus of the filling layer is less than the Young's modulus of the second electronic device layer, and the ratio of the Young's modulus of the first electronic device layer to the Young's modulus of the filling layer is 10 to 1900 and the ratio of the Young's modulus of the second electronic device layer to the Young's modulus of the filling layer is 7.6 to 1300.

Abstract: An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 ?m, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

Abstract: Family of non-homopolymers synthesized from N-vinyl lactam, (meth)acrylic acid, hydrophobic (meth)acrylic ester of a straightchain or branched-chain alkyl alcohol and monomer selected from the group consisting of functionalized and unfunctionalized: dialkyl maleates, dialkyl fumarates, and combinations thereof. The non-homopolymers may exhibit solubility in one or more lower molecular weight alcohols and/or a glass transition temperature greater than 80° C.

Abstract: A physiological sensor device and system, and a correction method are provided. The physiological sensor device includes a physiological signal sensor, a first compensation sensor, and a signal processing device. The physiological signal sensor is attached to an object to be detected to sense a physiological signal value. The first compensation sensor is disposed on the physiological signal sensor. The signal processing device is coupled to the physiological signal sensor and the first compensation sensor. The signal processing device obtains through the first compensation sensor a failure region of the physiological signal sensor partially detached from the object to be detected and obtains a first failure compensation value according to the failure region, so as to compensate the physiological signal value sensed by the physiological signal sensor.

Abstract: A protective structure includes a substrate, a hard coating layer and an auxiliary layer. The auxiliary layer is disposed on the substrate. The hard coating layer is disposed on the auxiliary layer. The auxiliary layer is disposed between the substrate and the hard coating layer. The Young's modulus of the auxiliary layer is greater than the Young's modulus of the hard coating layer, and the Young's modulus of the hard coating layer is greater than the Young's modulus of the substrate.

Abstract: A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: Described herein are multifunctional polymers comprising a first repeating unit having at least one pseudo-cationic moiety, a second repeating unit having at least a hydrophobic moiety, and a third repeating unit, where the weight-average molecular weight is less than about 10,000 Da. In one embodiment the polymers exhibit antimicrobial activity. Also provided are compositions formulated with the multifunctional polymers, and a method of providing antimicrobial activity.

Abstract: Described herein are multifunctional polymers comprising a first repeating unit having at least one pseudo-cationic moiety, a second repeating unit having at least a hydrophobic moiety, and a third repeating unit, where the weight-average molecular weight is less than about 10,000 Da. In one embodiment the polymers exhibit antimicrobial activity. Also provided are compositions formulated with the multifunctional polymers, and a method of providing antimicrobial activity.