Patents by Inventor Jui-Chang Chuang

Jui-Chang Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11296605
    Abstract: A synchronous rectifier controller controls a rectification power switch connected in series with a secondary winding between two power lines. The synchronous rectifier has a gate driver and a slew-rate detector. The gate driver drives the rectification power switch. The slew-rate detector detects a channel voltage of the rectification power switch, checks if a slew rate of the channel voltage exceeds a slope threshold. If the slew rate exceeds the slope threshold, the slew-rate detector turns the rectification power switch ON through the gate driver. If the slew rate is less than the slope threshold, the slew-rate detector reduces the slope threshold.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: April 5, 2022
    Inventors: Chih-Chiao Tsai, Jui-Chang Chuang
  • Patent number: 11262482
    Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: March 1, 2022
    Assignees: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Jui-Chang Chuang, Chen-Chu Tsai, Kai-Ming Chang, Chih-Chia Chang, Ting-Hsun Cheng
  • Patent number: 11007751
    Abstract: An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 ?m, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: May 18, 2021
    Assignees: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Jui-Chang Chuang, Chen-Chu Tsai, Kai-Ming Chang, Chih-Chia Chang, Ting-Hsun Cheng
  • Patent number: 10964912
    Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: March 30, 2021
    Assignees: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Yung-Hui Yeh, Jui-Chang Chuang, Li-Ching Wang, Cheng-Yueh Chang, Chyi-Ming Leu, Shih-Ming Chen
  • Publication number: 20210067026
    Abstract: A synchronous rectifier controller controls a rectification power switch connected in series with a secondary winding between two power lines. The synchronous rectifier has a gate driver and a slew-rate detector. The gate driver drives the rectification power switch. The slew-rate detector detects a channel voltage of the rectification power switch, checks if a slew rate of the channel voltage exceeds a slope threshold. If the slew rate exceeds the slope threshold, the slew-rate detector turns the rectification power switch ON through the gate driver. If the slew rate is less than the slope threshold, the slew-rate detector reduces the slope threshold.
    Type: Application
    Filed: May 13, 2020
    Publication date: March 4, 2021
    Inventors: Chih-Chiao TSAI, Jui-Chang CHUANG
  • Publication number: 20200211984
    Abstract: An electronic device package structure and a manufacturing method thereof are provided. The electronic device package structure includes a first electronic device layer, a second electronic device layer, and a filling layer disposed between the first electronic device layer and the second electronic device layer, wherein the Young's modulus of the second electronic device layer is less than or equal to the Young's modulus of the first electronic device layer, and the Young's modulus of the filling layer is less than the Young's modulus of the second electronic device layer, and the ratio of the Young's modulus of the first electronic device layer to the Young's modulus of the filling layer is 10 to 1900 and the ratio of the Young's modulus of the second electronic device layer to the Young's modulus of the filling layer is 7.6 to 1300.
    Type: Application
    Filed: May 7, 2019
    Publication date: July 2, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Jui-Chang Chuang, Chen-Tsai Yang, Wei-Yuan Cheng
  • Publication number: 20200130324
    Abstract: An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 ?m, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 30, 2020
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Jui-Chang Chuang, Chen-Chu Tsai, Kai-Ming Chang, Chih-Chia Chang, Ting-Hsun Cheng
  • Patent number: 10622326
    Abstract: A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: April 14, 2020
    Assignees: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Chen-Tsai Yang, Ko-Chin Yang, Jui-Chang Chuang, Yen-Ting Wu, Chia-Hua Lu
  • Publication number: 20200052243
    Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.
    Type: Application
    Filed: April 10, 2019
    Publication date: February 13, 2020
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Yung-Hui Yeh, Jui-Chang Chuang, Li-Ching Wang, Cheng-Yueh Chang, Chyi-Ming Leu, Shih-Ming Chen
  • Patent number: 10494466
    Abstract: Family of non-homopolymers synthesized from N-vinyl lactam, (meth)acrylic acid, hydrophobic (meth)acrylic ester of a straightchain or branched-chain alkyl alcohol and monomer selected from the group consisting of functionalized and unfunctionalized: dialkyl maleates, dialkyl fumarates, and combinations thereof. The non-homopolymers may exhibit solubility in one or more lower molecular weight alcohols and/or a glass transition temperature greater than 80° C.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: December 3, 2019
    Assignee: ISP INVESTMENTS LLC
    Inventors: Jui-Chang Chuang, Xuejun Liu, Osama M. Musa, David C. Streuli
  • Publication number: 20190246987
    Abstract: A physiological sensor device and system, and a correction method are provided. The physiological sensor device includes a physiological signal sensor, a first compensation sensor, and a signal processing device. The physiological signal sensor is attached to an object to be detected to sense a physiological signal value. The first compensation sensor is disposed on the physiological signal sensor. The signal processing device is coupled to the physiological signal sensor and the first compensation sensor. The signal processing device obtains through the first compensation sensor a failure region of the physiological signal sensor partially detached from the object to be detected and obtains a first failure compensation value according to the failure region, so as to compensate the physiological signal value sensed by the physiological signal sensor.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 15, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Ming-Huan Yang, Kuang-Ching Fan, Yen-Ting Wu, Yi-Cheng Lu, Jui-Chang Chuang
  • Publication number: 20190140210
    Abstract: A protective structure includes a substrate, a hard coating layer and an auxiliary layer. The auxiliary layer is disposed on the substrate. The hard coating layer is disposed on the auxiliary layer. The auxiliary layer is disposed between the substrate and the hard coating layer. The Young's modulus of the auxiliary layer is greater than the Young's modulus of the hard coating layer, and the Young's modulus of the hard coating layer is greater than the Young's modulus of the substrate.
    Type: Application
    Filed: December 28, 2017
    Publication date: May 9, 2019
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Ting-Hsun Cheng, Chih-Chia Chang, Kai-Ming Chang, Jui-Chang Chuang
  • Publication number: 20190057948
    Abstract: A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.
    Type: Application
    Filed: March 5, 2018
    Publication date: February 21, 2019
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Chen-Tsai Yang, Ko-Chin Yang, Jui-Chang Chuang, Yen-Ting Wu, Chia-Hua Lu
  • Publication number: 20190049630
    Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.
    Type: Application
    Filed: July 19, 2018
    Publication date: February 14, 2019
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Jui-Chang Chuang, Chen-Chu Tsai, Kai-Ming Chang, Chih-Chia Chang, Ting-Hsun Cheng
  • Patent number: 10087273
    Abstract: Described herein are multifunctional polymers comprising a first repeating unit having at least one pseudo-cationic moiety, a second repeating unit having at least a hydrophobic moiety, and a third repeating unit, where the weight-average molecular weight is less than about 10,000 Da. In one embodiment the polymers exhibit antimicrobial activity. Also provided are compositions formulated with the multifunctional polymers, and a method of providing antimicrobial activity.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 2, 2018
    Assignee: ISP INVESTMENTS LLC
    Inventors: Jui-Chang Chuang, Xuejun Liu, Osama M. Musa, Karen Winkowski
  • Publication number: 20180237568
    Abstract: Described herein are multifunctional polymers comprising a first repeating unit having at least one pseudo-cationic moiety, a second repeating unit having at least a hydrophobic moiety, and a third repeating unit, where the weight-average molecular weight is less than about 10,000 Da. In one embodiment the polymers exhibit antimicrobial activity. Also provided are compositions formulated with the multifunctional polymers, and a method of providing antimicrobial activity.
    Type: Application
    Filed: April 6, 2018
    Publication date: August 23, 2018
    Inventors: Jui-Chang Chuang, Xuejun Liu, Osama M. Musa, Karen Winkowski
  • Patent number: 9860976
    Abstract: According to an embodiment of the present disclosure, a flexible electronic device may include a unit structure including a substrate unit and a wiring structure. The substrate unit has slits to divide connecting portions between respective ends of two slits and wiring regions arranged outwardly from at least one unit center sequentially. The wiring structure is disposed on the substrate unit and includes wirings distributed in the wiring regions. Each wiring includes circumferential portions and radial portions connected between the circumferential portions. The radial portion connected to a first end of each circumferential portion extends toward the unit center from the first end. Each circumferential portion includes a first section and a second section. The first section is closer to the first end and has greater anti-stretching ability than the second section.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: January 2, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Sheng-Po Wang, Chih-Chia Chang, Chao-Jen Wang, Jui-Chang Chuang
  • Patent number: 9837635
    Abstract: A protective structure includes an impact resistant structure and an anti-scratch structure. The impact resistant structure includes a plurality of buffer structures and a plurality of filling structures located around the buffer structures. The anti-scratch structure is located over the impact resistant structure. The anti-scratch structure includes a hard coat layer which covers the impact resistant structure, and a surface anti-scratch layer which covers the hard coat layer.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: December 5, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Chia Chang, Cheng-Chung Lee, Kuang-Jung Chen, Kai-Ming Chang, Jui-Chang Chuang
  • Publication number: 20170179434
    Abstract: A protective structure includes an impact resistant structure and an anti-scratch structure. The impact resistant structure includes a plurality of buffer structures and a plurality of filling structures located around the buffer structures. The anti-scratch structure is located over the impact resistant structure. The anti-scratch structure includes a hard coat layer which covers the impact resistant structure, and a surface anti-scratch layer which covers the hard coat layer.
    Type: Application
    Filed: December 13, 2016
    Publication date: June 22, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Chia Chang, Cheng-Chung Lee, Kuang-Jung Chen, Kai-Ming Chang, Jui-Chang Chuang
  • Publication number: 20170121466
    Abstract: Provided are multifunctional polymers comprising at least one anhydride repeating unit with at least one pseudo-cationic moiety graft and at least one hydrophobic graft. The grafting functionalizations can occur before, during, or after polymerizing the monomer(s). The anhydride employed may be partially or fully opened to provide amic acids, carboxylic acids, carboxylic acidic salts, imides, esters, and mixtures thereof. The polymers also may comprise other repeating units, including, but not limited to, alpha-olefins. In one embodiment the polymers exhibit antimicrobial activity, and can be employed in a wide variety of compositions, including those where antimicrobial activity is useful. A method of providing microbial activity also is provided.
    Type: Application
    Filed: January 11, 2017
    Publication date: May 4, 2017
    Inventors: Osama M. Musa, Xuejun Liu, Jui-Chang Chuang, Karen Winkowski