Abstract: A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.

Abstract: A radiator module system for automatic test equipment, wherein the automatic test equipment comprises at least one test arm, with the front end of the test arm being configured with a test head, and a closed-loop circulating cooling device is installed on the test arm. The closed-loop circulating cooling device includes a conduit which is in contact with the cooling device, internally contains an working fluid and is connected to the test head, a cooling device, a set of fans and a driving source for driving the working fluid. The closed-loop circulating cooling device can operate to circulate and exchange heat energy generated by a device under test (DUT) tightly stressed by downward pressure applied with the test arm, and brings up airflows by means of the fans to perform heat exchange on the cooling device thereby dissipating the generated heat energy.

Abstract: A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.

Abstract: A radiator module system for automatic test equipment, wherein the automatic test equipment comprises at least one test arm, with the front end of the test arm being configured with a test head, and a closed-loop circulating cooling device is installed on the test arm. The closed-loop circulating cooling device includes a conduit which is in contact with the cooling device, internally contains an working fluid and is connected to the test head, a cooling device, a set of fans and a driving source for driving the working fluid. The closed-loop circulating cooling device can operate to circulate and exchange heat energy generated by a device under test (DUT) tightly stressed by downward pressure applied with the test arm, and brings up airflows by means of the fans to perform heat exchange on the cooling device thereby dissipating the generated heat energy.

Abstract: A temperature control system for IC tester, comprising: a test socket; a compressing device including a heat exchanger and a thermoelectric cooler (TEC); and a test head having a temperature sensor. The test head is configured at the front end of the compressing device such that, upon placing at least one device under test (DUT) onto the test socket, the test head coerces tightly one of the DUTs through downward pressure from the compressing device thereby allowing the temperature sensor to detect the surface temperature of the DUT to obtain a temperature signal, and then feed such a temperature signal back to a control processing unit for operations to generate a linear control signal thus that, through the control of the linear control signal, the heat absorption and heat discharge functions of the TEC are enabled to further control the temperature of the DUT within a determined range.