Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: A semiconductor device includes a logic circuit region having at least one core device and at least one input/output (I/O) device. The at least one core device has a first accumulative antenna ratio, and the at least one I/O device has a second accumulative antenna ratio. The first accumulative antenna ratio is greater than the second accumulative antenna ratio.

Abstract: A rotary seat including a base includes an outer surface, and a composite material layer attached to at least a part of the outer surface. The base also includes a recess for accommodating a turntable and including a first opening on the outer surface. The material of the composite material layer includes fibers and a resin. Therefore, the rotary seat may be more lightweight. A rotary table is also provided and includes the rotary seat, a driving device which drives the rotary seat to rotate, and a turntable which is rotatably disposed in the recess of the base.

Abstract: An electronic device manufacturing system configured to receive, by a processor, input data reflecting a feature related to a manufacturing process of a substrate. The manufacturing system is further configured to generate a characteristic sequence defining a relationship between at least two manufacturing parameters, and determine a relationship between one or more variables related to the feature and the characteristic sequence. The manufacturing system is further configured to determine a weight based on the determined relationship and apply the weight to the feature. The manufacturing system is further configured to train a machine-learning model in view of the weighted feature.

Abstract: An electronic device manufacturing system configured to receive, by a processor, input data reflecting a feature related to a manufacturing process of a substrate. The manufacturing system is further configured to train a machine-learning model based on the input data reflecting the feature. The manufacturing system is further configured to modify the machine-learning model in view of the virtual knob for the feature.

Abstract: An electronic device manufacturing system configured to obtain sensor data associated with a deposition process performed in a process chamber to deposit a film stack on a surface of a substrate. The film stack can include a known film pattern and an unknown film pattern. The manufacturing system is further configured to input the sensor data into a first trained machine-learning model to obtain a first output value of the first trained machine-learning model. The first output value can be associated with the known film pattern. The manufacturing system is further configured to input the first output value into a second trained machine-learning model to obtain a second output value of the second trained machine-learning model. The second output value can be indicative of metrology data of the known film pattern.

Abstract: A rotary seat including a base includes an outer surface, and a composite material layer attached to at least a part of the outer surface. The base also includes a recess for accommodating a turntable and including a first opening on the outer surface. The material of the composite material layer includes fibers and a resin. Therefore, the rotary seat may be more lightweight. A rotary table is also provided and includes the rotary seat, a driving device which drives the rotary seat to rotate, and a turntable which is rotatably disposed in the recess of the base.

Abstract: A fingerprint sensing system has a fingerprint sensing device and a power supply circuit. The fingerprint sensing device has a high-voltage input terminal and a low-voltage input terminal. During scan phases of the fingerprint sensing device, the power supply circuit provides a first voltage to the high voltage input terminal and provides a second voltage to the low voltage input terminal. During the read phases of the fingerprint sensing device, the power supply circuit provides a third voltage to the high voltage input terminal and provides a fourth voltage to the low voltage input terminal. A first voltage difference is between the first voltage and the second voltage. A second voltage difference is between the third voltage and the fourth voltage. The first voltage difference is greater than the second voltage difference.

Abstract: A fingerprint sensing system has a fingerprint sensing device and a power supply circuit. The fingerprint sensing device has a high-voltage input terminal and a low-voltage input terminal. During scan phases of the fingerprint sensing device, the power supply circuit provides a first voltage to the high voltage input terminal and provides a second voltage to the low voltage input terminal. During the read phases of the fingerprint sensing device, the power supply circuit provides a third voltage to the high voltage input terminal and provides a fourth voltage to the low voltage input terminal. A first voltage difference is between the first voltage and the second voltage. A second voltage difference is between the third voltage and the fourth voltage. The first voltage difference is greater than the second voltage difference.

Abstract: A sensing method of a fingerprint sensor includes the following steps: (a) applying a first voltage, a second voltage and a third voltage to a first node connected to an electrode plate to be measured, a second node disconnected from the first node, and a conductor adjacent to the electrode plate to be measured, respectively; (b) providing a first finger drive voltage for a finger; (c) stopping applying the first, second and third voltages to the first node, the second node and the conductor, respectively; (d) after step (c), applying a fourth voltage to the conductor, and connecting the first node to the second node; (e) after steps (b) and (c), providing a second finger drive voltage for the finger; and (f) after steps (d) and (e), obtaining a measurement result of the electrode plate to be measured according to a signal on the second node.

Abstract: A sensing method of a fingerprint sensor includes the following steps: (a) applying a first voltage, a second voltage and a third voltage to a first node connected to an electrode plate to be measured, a second node disconnected from the first node, and a conductor adjacent to the electrode plate to be measured, respectively; (b) providing a first finger drive voltage for a finger; (c) stopping applying the first, second and third voltages to the first node, the second node and the conductor, respectively; (d) after step (c), applying a fourth voltage to the conductor, and connecting the first node to the second node; (e) after steps (b) and (c), providing a second finger drive voltage for the finger; and (f) after steps (d) and (e), obtaining a measurement result of the electrode plate to be measured according to a signal on the second node.