Patents by Inventor Jui Cheng Chuang
Jui Cheng Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11940737Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.Type: GrantFiled: May 7, 2021Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
-
Publication number: 20220140173Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.Type: ApplicationFiled: October 29, 2020Publication date: May 5, 2022Inventors: Chi-Chih SHEN, Kuo-Hsiung LI, Shang-Feng HSIEH, Jui-Cheng CHUANG, Yi-Chang CHANG
-
Patent number: 10340299Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.Type: GrantFiled: September 11, 2017Date of Patent: July 2, 2019Assignee: PIXART IMAGING INC.Inventors: Chi-Chih Shen, Kuo-Hsiung Li, Jui-Cheng Chuang
-
Patent number: 10274365Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).Type: GrantFiled: April 4, 2017Date of Patent: April 30, 2019Assignee: PIXART IMAGING INC.Inventors: Chi-Chih Shen, Kuo-Hsiung Li, Shang-Feng Hsieh, Jui-Cheng Chuang
-
Publication number: 20190081097Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.Type: ApplicationFiled: September 11, 2017Publication date: March 14, 2019Inventors: CHI-CHIH SHEN, KUO-HSIUNG LI, JUI-CHENG CHUANG
-
Patent number: 9976898Abstract: An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.Type: GrantFiled: July 24, 2016Date of Patent: May 22, 2018Assignee: PixArt Imaging Inc.Inventors: Chi-Chih Shen, Jen-Yu Chen, Yen-Hsin Chen, Kuo-Hsiung Li, Jui-Cheng Chuang
-
Publication number: 20180087958Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).Type: ApplicationFiled: April 4, 2017Publication date: March 29, 2018Inventors: CHI-CHIH SHEN, KUO-HSIUNG LI, SHANG-FENG HSIEH, JUI-CHENG CHUANG
-
Publication number: 20170167914Abstract: An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.Type: ApplicationFiled: July 24, 2016Publication date: June 15, 2017Inventors: Chi-Chih Shen, Jen-Yu Chen, Yen-Hsin Chen, Kuo-Hsiung Li, Jui-Cheng Chuang
-
Publication number: 20170133290Abstract: The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.Type: ApplicationFiled: July 6, 2016Publication date: May 11, 2017Inventors: Kuo-Hsiung Li, Chi-Chih Shen, Jui-Cheng Chuang, Jen-Yu Chen
-
Patent number: 9627286Abstract: The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.Type: GrantFiled: July 6, 2016Date of Patent: April 18, 2017Assignee: PIXART IMAGING INCORPORATIONInventors: Kuo-Hsiung Li, Chi-Chih Shen, Jui-Cheng Chuang, Jen-Yu Chen
-
Patent number: 8841593Abstract: An image sensor module is installed in a sensing device, and is used to detect a reflected light of an object. The image sensor module includes a carrier, a light sensing element, and a package body. The light sensing element is disposed on a substrate. The carrier is disposed on the substrate in the sensing device. The light sensing element is installed in the carrier, and is electrically connected with the substrate via multiple solder balls. The package body is installed on the carrier, and has a reflecting and diverting element, which is located between the light sensing element and the object and is used for reflecting reflected light of the object and diverting the reflected light towards a receiving direction of the light sensing element. The light sensing element receives the reflected light and generates a corresponding sensing signal.Type: GrantFiled: February 24, 2011Date of Patent: September 23, 2014Assignee: Pixart Imaging Inc.Inventors: Wei Chung Wang, Chi Chih Shen, Kuo Hsiung Li, Hui Hsuan Chen, Jui Cheng Chuang
-
Patent number: 8518722Abstract: A method for detecting the under-fill void of the flip chip ball grid array package structure is provided, which includes providing a substrate having an interconnect structure and a plurality of interposers therein; providing a chip having an active surface and a back side, and a plurality of first connecting elements on the active surface of the chip; mounting and electrically connecting the active surface of the chip on the substrate; performing at least once IR reflow to fix the plurality of first connecting elements on the substrate; filling an encapsulate material to cover the active surface of the chip and the plurality of first connecting elements; performing a detecting process to detect that void is not formed between the active surface of the chip and the plurality of first elements; and forming a plurality of second connecting elements on the back side of the substrate to obtain a flip chip ball grid array package structure.Type: GrantFiled: March 9, 2011Date of Patent: August 27, 2013Assignee: Global Unichip CorporationInventors: Chien-Wen Chen, Chia-Jen Kao, Jui-Cheng Chuang
-
Publication number: 20120052603Abstract: A method for detecting the under-fill void of the flip chip ball grid array package structure is provided, which includes providing a substrate having an interconnect structure and a plurality of interposers therein; providing a chip having an active surface and a back side, and a plurality of first connecting elements on the active surface of the chip; mounting and electrically connecting the active surface of the chip on the substrate; performing at least once IR reflow to fix the plurality of first connecting elements on the substrate; filling an encapsulate material to cover the active surface of the chip and the plurality of first connecting elements; performing a detecting process to detect that void is not formed between the active surface of the chip and the plurality of first elements; and forming a plurality of second connecting elements on the back side of the substrate to obtain a flip chip ball grid array package structure.Type: ApplicationFiled: March 9, 2011Publication date: March 1, 2012Applicant: Global Unichip CorporationInventors: Chien-Wen Chen, Chia-Jen Kao, Jui-Cheng Chuang
-
Publication number: 20120001054Abstract: An image sensor module is installed in a sensing device, and is used to detect a reflected light of an object. The image sensor module includes a carrier, a light sensing element, and a package body. The light sensing element is disposed on a substrate. The carrier is disposed on the substrate in the sensing device. The light sensing element is installed in the carrier, and is electrically connected with the substrate via multiple solder balls. The package body is installed on the carrier, and has a reflecting and diverting element, which is located between the light sensing element and the object and is used for reflecting reflected light of the object and diverting the reflected light towards a receiving direction of the light sensing element. The light sensing element receives the reflected light and generates a corresponding sensing signal.Type: ApplicationFiled: February 24, 2011Publication date: January 5, 2012Applicant: PIXART IMAGING INC.Inventors: Wei Chung Wang, Chi Chih Shen, Kuo Hsiung Li, Hui Hsuan Chen, Jui Cheng Chuang