Patents by Inventor Jui-Cheng Huang
Jui-Cheng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250130198Abstract: A method includes following steps. A beating pulse of a cardiac cell is monitored by using a biologically sensitive field-effect transistor (BioFET) disposed within a semiconductor substrate. A temperature around the cardiac cell is detected by using a temperature-sensing diode disposed within the semiconductor substrate. In response to the detected temperature falling below a predetermined threshold, the cardiac cell is heated by using a heater disposed within the semiconductor substrate. The cardiac cell is placed within a fluid containment region above the BioFET, and the temperature-sensing diode occupies a larger area within the fluid containment region than the heater.Type: ApplicationFiled: December 31, 2024Publication date: April 24, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tung-Tsun CHEN, Yi-Hsing HSIAO, Jui-Cheng HUANG, Yu-Jie HUANG
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Patent number: 12281998Abstract: Devices, methods for fabricating said devices, and methods for detecting an analyte within a bio-target are described herein. The device includes a top assembly and a bottom assembly. The Top assembly includes an electrode disposed on a top layer. The bottom assembly includes a bio-chip disposed on a bottom layer and a polymer body disposed between the bio-chip and the top assembly. The polymer body includes a channel. The electrode of the top assembly is positioned within the channel. The channel is configured to accommodate the bio-target containing the analyte.Type: GrantFiled: January 4, 2021Date of Patent: April 22, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Hsing Hsiao, Jui-Cheng Huang
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Publication number: 20250116629Abstract: A semiconductor biosensor includes a semiconductor layer having a first surface and a second surface opposite to the first surface, a FET device in the semiconductor layer, an isolation layer over the first surface of the semiconductor layer, a pair of first electrodes over the isolation layer, and a pair of second electrodes over the isolation layer. The FET device includes a gate structure disposed over the second surface of the semiconductor layer. The isolation layer includes a rectangular opening substantially aligned with the FET device. The pair of second electrodes is separated from the pair of first electrodes.Type: ApplicationFiled: December 18, 2024Publication date: April 10, 2025Inventors: YI-HSING HSIAO, JUI-CHENG HUANG, YU-JIE HUANG
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Publication number: 20250110079Abstract: A bio-field effect transistor (bioFET) system includes a bioFET configured to receive to a first voltage signal and output a current signal, where the current signal varies exponentially with respect to the first voltage signal. A logarithmic current-to-time converter is connected to the bioFET and is configured to receive the current signal and convert the current signal to a time domain signal. The time domain signal varies logarithmically with respect to the current signal, such that the time domain signal varies linearly with respect to the first voltage signal.Type: ApplicationFiled: November 5, 2024Publication date: April 3, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Jie Huang, Jui-Cheng Huang
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Publication number: 20250110172Abstract: A semiconductor package includes an array of through-substrate-via (TSV) structures comprising a number (O) of TSV structures, wherein the array comprises a number (M) of active TSV structures; a number (N) of contact structures, the contact structures comprising a plurality of pairs configured to receive an input test signal and provide an output test signal, respectively; and a plurality of binary-tree branches, each of the plurality of binary-tree branches electrically coupling a first one of the active TSV structures to a second one of the active TSV structures and a third one of the active TSV structures.Type: ApplicationFiled: October 2, 2023Publication date: April 3, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ying-Chih Hsu, Jui-Cheng Huang, Mu Wei Lee, Wei-Tao Shaw
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Patent number: 12222317Abstract: An IC structure includes a biologically sensitive field-effect transistor (BioBET) in a semiconductor substrate, and a dielectric layer over a backside surface of the semiconductor substrate. The dielectric layer has a sensing well extending through the dielectric layer to a channel region of the BioFET. The IC structure further includes a biosensing film, a plurality of fluid channel walls, and a first heater. The biosensing film lines the sensing well in the dielectric layer. The fluid channel walls are over the biosensing film and define a fluid containment region over the sensing well of the dielectric layer. The first heater is in the semiconductor substrate. The first heater has at least a portion overlapping with the fluid containment region.Type: GrantFiled: November 30, 2023Date of Patent: February 11, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tung-Tsun Chen, Yi-Hsing Hsiao, Jui-Cheng Huang, Yu-Jie Huang
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Publication number: 20250035623Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; and a cap structure attached to the buried oxide layer, the cap structure comprising a microneedle.Type: ApplicationFiled: July 30, 2024Publication date: January 30, 2025Inventors: Allen Timothy Chang, Jui-Cheng Huang, Wen-Chuan Tai, Yu-Jie Huang
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Patent number: 12209987Abstract: A biosensor includes a semiconductor layer having a first surface and a second surface opposite to the first surface, a FET device in the semiconductor layer, an isolation layer over the first surface of the semiconductor layer, a dielectric layer over the isolation layer and the first surface of the semiconductor layer, and a pair of first electrodes and a pair of second electrodes over the dielectric layer and separated from each other. The isolation layer has a rectangular opening substantially aligned with the FET device. The rectangular opening has pair of first sides and a pair of second sides. An extending direction of the pair of first sides is perpendicular to an extending direction of the pair of second sides. The pair of first electrodes is disposed over the pair of first sides, and the pair of second electrodes is disposed over the pair of second sides.Type: GrantFiled: August 8, 2022Date of Patent: January 28, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yi-Hsing Hsiao, Jui-Cheng Huang, Yu-Jie Huang
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Publication number: 20240410855Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; a carrier substrate on the MLI structure; a first through substrate via (TSV) structure extending though the carrier substrate and configured to provide an electrical connection between the MLI structure and a separate die; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; and a microfluidic channel cap structure attached to the buried oxide layer.Type: ApplicationFiled: July 23, 2024Publication date: December 12, 2024Inventors: Allen Timothy Chang, Jui-Cheng Huang, Wen-Chuan Tai, Yu-Jie Huang
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Patent number: 12163916Abstract: A bio-field effect transistor (bioFET) system includes a bioFET configured to receive to a first voltage signal and output a current signal, where the current signal varies exponentially with respect to the first voltage signal. A logarithmic current-to-time converter is connected to the bioFET and is configured to receive the current signal and convert the current signal to a time domain signal. The time domain signal varies logarithmically with respect to the current signal, such that the time domain signal varies linearly with respect to the first voltage signal.Type: GrantFiled: January 3, 2024Date of Patent: December 10, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Jie Huang, Jui-Cheng Huang
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Publication number: 20240385136Abstract: An apparatus including an integrated reference electrode and a fluid dispenser is described. The reference electrode includes a body and a tip. The fluid dispenser at least partially surrounds the tip of the reference electrode and includes an inlet, a chamber, and an outlet. The fluid dispenser is configured to receive a fluid sample from the inlet to the chamber and form a droplet of the fluid sample through the outlet so that the droplet is in fluidic contact with the tip of the reference electrode and associated with a known potential determined by the reference electrode.Type: ApplicationFiled: July 31, 2024Publication date: November 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chin-Hua Wen, Jui-Cheng HUANG
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Publication number: 20240377352Abstract: Various embodiments of the present application are directed towards an ion-sensitive field-effect transistor for enhanced sensitivity. In some embodiments, a substrate comprises a pair of first source/drain regions and a pair of second source/drain regions. Further, a first gate electrode and a second gate electrode underlie the substrate. The first gate electrode is laterally between the first source/drain regions, and the second gate electrode is laterally between the second source/drain regions. An interconnect structure underlies the substrate and defines conductive paths electrically shorting the second source/drain regions and the second gate electrode together. A passivation layer is over the substrate and defines a first well and a second well. The first and second wells respectively overlie the first and second gate electrodes, and a sensing layer lines the substrate in the first and second wells. In some embodiments, sensing probes are in the first well, but not the second well.Type: ApplicationFiled: July 23, 2024Publication date: November 14, 2024Inventors: Katherine H. Chiang, Jui-Cheng Huang, Ke-Wei Su, Tung-Tsun Chen, Wei Lee, Pei-Wen Liu
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Patent number: 12123846Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; a carrier substrate on the MLI structure; a first through substrate via (TSV) structure extending though the carrier substrate and configured to provide an electrical connection between the MLI structure and a separate die; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; and a microfluidic channel cap structure attached to the buried oxide layer.Type: GrantFiled: August 17, 2023Date of Patent: October 22, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Allen Timothy Chang, Jui-Cheng Huang, Wen-Chuan Tai, Yu-Jie Huang
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Patent number: 12123871Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; and a cap structure attached to the buried oxide layer, the cap structure comprising a microneedle.Type: GrantFiled: November 25, 2020Date of Patent: October 22, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Allen Timothy Chang, Jui-Cheng Huang, Wen-Chuan Tai, Yu-Jie Huang
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Publication number: 20240240131Abstract: Cell monitoring apparatus includes sensing chip and channel module. Sensing chip includes channel region, source and drain regions, and sensing film. The channel region includes first semiconductor material. The source and drain regions are disposed at opposite sides of the channel region, and include a second semiconductor material. Sensing film is disposed on the channel region at a sensing surface of the sensing chip. Channel module is disposed on the sensing surface of sensing chip. A microfluidic channel is formed between the sensing surface of the sensing chip and a proximal surface of the channel module. The microfluidic channel includes a culture chamber and a micro-well. The culture chamber is concave into the proximal surface of the channel module, and overlies the channel region. The micro-well is concave into a side of the culture chamber, and directly faces the sensing film.Type: ApplicationFiled: March 28, 2024Publication date: July 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Hsing Hsiao, Jui-Cheng Huang
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Publication number: 20240234526Abstract: A semiconductor device includes: a first arrangement including first and second silicide layers correspondingly electrically coupled to opposing first and second sides of a doped first portion of an active region; and a second arrangement including a third silicide layer electrically coupled to a first or second side of a doped second portion of the active region.Type: ApplicationFiled: March 25, 2024Publication date: July 11, 2024Inventors: Chung-Hui CHEN, Tung-Tsun CHEN, Jui-Cheng HUANG
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Publication number: 20240192744Abstract: In an embodiment, a circuit includes: an error amplifier; a temperature sensor, wherein the temperature sensor is coupled to the error amplifier; a discrete time controller coupled to the error amplifier, wherein the discrete time controller comprises digital circuitry; a multiple bits quantizer coupled to the discrete time controller, wherein the multiple bits quantizer produces a digital code output; and a heating array coupled to the multiple bits quantizer, wherein the heating array is configured to generate heat based on the digital code output.Type: ApplicationFiled: February 20, 2024Publication date: June 13, 2024Inventors: Jui-Cheng HUANG, Yi-Hsing HSIAO, Yu-Jie HUANG, Tsung-Tsun CHEN, Allen Timothy CHANG
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Patent number: 11980864Abstract: A method of operating an integrated circuit includes using a first switching device to couple a bio-sensing device to a first signal path, generating, using the bio-sensing device, a bio-sensing signal on the first signal path in response to an electrical characteristic of a sensing film, using a second switching device to couple a temperature-sensing device to a second signal path, and generating, using the temperature-sensing device, a temperature-sensing signal on the second signal path in response to a temperature of the sensing film. The first and second switching devices, the bio-sensing device, the temperature-sensing device, and the sensing film are components of a sensing pixel of a plurality of sensing pixels of the integrated circuit.Type: GrantFiled: August 10, 2022Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTDInventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
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Patent number: 11970688Abstract: Cell monitoring apparatus includes sensing chip and channel module. Sensing chip includes channel region, source and drain regions, and sensing film. The channel region includes first semiconductor material. The source and drain regions are disposed at opposite sides of the channel region, and include a second semiconductor material. Sensing film is disposed on the channel region at a sensing surface of the sensing chip. Channel module is disposed on the sensing surface of sensing chip. A microfluidic channel is formed between the sensing surface of the sensing chip and a proximal surface of the channel module. The microfluidic channel includes a culture chamber and a micro-well. The culture chamber is concave into the proximal surface of the channel module, and overlies the channel region. The micro-well is concave into a side of the culture chamber, and directly faces the sensing film.Type: GrantFiled: July 30, 2020Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Hsing Hsiao, Jui-Cheng Huang
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Publication number: 20240133841Abstract: A bio-field effect transistor (bioFET) system includes a bioFET configured to receive to a first voltage signal and output a current signal, where the current signal varies exponentially with respect to the first voltage signal. A logarithmic current-to-time converter is connected to the bioFET and is configured to receive the current signal and convert the current signal to a time domain signal. The time domain signal varies logarithmically with respect to the current signal, such that the time domain signal varies linearly with respect to the first voltage signal.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Jie Huang, Jui-Cheng Huang