Patents by Inventor Jui Chien HUNG

Jui Chien HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250105613
    Abstract: A hybrid circuit breaker and a pre-charge control method are provided. The hybrid circuit breaker includes an outer branch, a first branch, a first mechanical switch module, a second branch, an electronic switch and a current commutation circuit. The first branch is connected with the outer branch in series. The first mechanical switch module is located on the first branch. The second branch is connected with the first branch in parallel. The electronic switch is located on the second branch. The current commutation circuit includes a voltage source module and an inductor. The voltage source module is located on the second branch. The inductor is located on one of the first branch or the second branch.
    Type: Application
    Filed: September 22, 2023
    Publication date: March 27, 2025
    Inventors: Ruxi Wang, Boxue Hu, Jui-Chien Hung, Chi Zhang, Anup Anurag, Peter Mantovanelli Barbosa
  • Publication number: 20250089153
    Abstract: This disclosure is directed to a solid state transformer and a printed circuit board stack-up structure, the printed circuit board stack-up structure has a plate, a power device, a thermally conductive insulating layer, a heat diffusion layer and a thermal conductor. The plate has a first surface and a second surface respectively disposed at two sides. The power device is arranged on the first surface. The thermally conductive insulating layer is pressed to combine with the second surface and cover the second surface. The heat diffusion layer is pressed to combine with the thermally conductive insulating layer and cover the thermally conductive insulating layer. The thermal conductor is embedded in the plate and respectively connected to the power device and the thermally conductive insulating layer.
    Type: Application
    Filed: August 1, 2024
    Publication date: March 13, 2025
    Inventors: Jui-Chien HUNG, Wen-Lung HUANG, Sheng-Hua LI
  • Patent number: 12096582
    Abstract: A bearing structure for a high-low-voltage conversion circuit is disclosed and includes an insulation carrier, a first conductor layer, a second conductor layer, a first trench and a first insulation material. The first conductor layer and the second conductor layer are coated on the first surface and the second surface of the insulation carrier, respectively. A voltage difference is formed between the first conductor layer and the second conductor layer. The first trench is disposed on the first surface and surrounds an outer peripheral edge of the first conductor layer. The first conductor layer is extended from the first surface into the first trench, and the outer peripheral edge of the first conductor layer is located at a bottom of the first trench. The first insulation material covers the outer peripheral edge of the first conductor layer and is filled in the first trench.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: September 17, 2024
    Assignee: Delta Electronics, Inc.
    Inventors: Jui-Chien Hung, Wen-Lung Huang, Chun-Han Lin, Sheng-Hua Li
  • Publication number: 20230371194
    Abstract: A bearing structure for a high-low-voltage conversion circuit is disclosed and includes an insulation carrier, a first conductor layer, a second conductor layer, a first trench and a first insulation material. The first conductor layer and the second conductor layer are coated on the first surface and the second surface of the insulation carrier, respectively. A voltage difference is formed between the first conductor layer and the second conductor layer. The first trench is disposed on the first surface and surrounds an outer peripheral edge of the first conductor layer. The first conductor layer is extended from the first surface into the first trench, and the outer peripheral edge of the first conductor layer is located at a bottom of the first trench. The first insulation material covers the outer peripheral edge of the first conductor layer and is filled in the first trench.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 16, 2023
    Inventors: Jui-Chien Hung, Wen-Lung Huang, Chun-Han Lin, Sheng-Hua Li
  • Publication number: 20220096655
    Abstract: The present disclosure relates to the field of nanoparticles, conjugates thereof and their use in methods of treatment or prevention of vascular inflammation. The present disclosure also relates to methods of delivering an agent to a region of a blood vessel in a patient, comprising: a) conjugating the agent to a nanoparticle to produce a conjugate; and b) delivering the conjugate to the region of the blood vessel.
    Type: Application
    Filed: February 11, 2020
    Publication date: March 31, 2022
    Inventors: Steven Garry WISE, Miguel CORREIA DOS SANTOS, Richard Philip TAN, Jui Chien HUNG