Patents by Inventor Jui-Chin Chen
Jui-Chin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10983087Abstract: A structure of an electrochemical unit includes a substrate, a first metal layer disposed on the substrate, and an array of electrochemical cells disposed on the first metal layer. The array of the electrochemical cells includes a plurality of electrochemical cells. Each of the electrochemical cells includes the first metal layer disposed on the substrate, a first electrode disposed on the first metal layer, a polymer layer disposed on the substrate and adjacent to the first metal layer and the first electrode. A second metal layer is disposed on the polymer layer, and a second electrode is disposed on the second metal layer. A pore is constituted between the polymer layers of every the two electrochemical cells. A cavity located above the first electrode is defined between every the two electrochemical cells, wherein the cavity is communicated with the pore.Type: GrantFiled: August 7, 2019Date of Patent: April 20, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jui-Chin Chen, Pei-Jer Tzeng
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Patent number: 10908113Abstract: A liquid-sensing apparatus includes a substrate, partitions, and independent sensors. The partitions are disposed on the substrate for separating several housing spaces in order to respectively house a to-be-detected liquid, wherein each of the housing spaces has a bottom, a closed sidewall, and an open top, and thus the to-be-detected liquid may be dripped from the top of the housing space. The independent sensors are respectively formed at the bottom of different housing spaces, wherein the independent sensors respectively include different sensing material layers, and surfaces of the different sensing material layers have nanoholes.Type: GrantFiled: November 21, 2018Date of Patent: February 2, 2021Assignee: Industrial Technology Research InstituteInventors: Jui-Chin Chen, Wen Wang, Pei-Jer Tzeng
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Publication number: 20200103367Abstract: A liquid-sensing apparatus includes a substrate, partitions, and independent sensors. The partitions are disposed on the substrate for separating several housing spaces in order to respectively house a to-be-detected liquid, wherein each of the housing spaces has a bottom, a closed sidewall, and an open top, and thus the to-be-detected liquid may be dripped from the top of the housing space. The independent sensors are respectively formed at the bottom of different housing spaces, wherein the independent sensors respectively include different sensing material layers, and surfaces of the different sensing material layers have nanoholes.Type: ApplicationFiled: November 21, 2018Publication date: April 2, 2020Applicant: Industrial Technology Research InstituteInventors: Jui-Chin Chen, Wen Wang, Pei-Jer Tzeng
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Publication number: 20190369043Abstract: A structure of an electrochemical unit includes a substrate, a first metal layer disposed on the substrate, and an array of electrochemical cells disposed on the first metal layer. The array of the electrochemical cells includes a plurality of electrochemical cells. Each of the electrochemical cells includes the first metal layer disposed on the substrate, a first electrode disposed on the first metal layer, a polymer layer disposed on the substrate and adjacent to the first metal layer and the first electrode. A second metal layer is disposed on the polymer layer, and a second electrode is disposed on the second metal layer. A pore is constituted between the polymer layers of every the two electrochemical cells. A cavity located above the first electrode is defined between every the two electrochemical cells, wherein the cavity is communicated with the pore.Type: ApplicationFiled: August 7, 2019Publication date: December 5, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jui-Chin CHEN, Pei-Jer TZENG
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Patent number: 10416114Abstract: A structure of an electrochemical unit includes a substrate, a first metal layer disposed on the substrate, and an array of electrochemical cells disposed on the first metal layer. The array of the electrochemical cells includes a plurality of electrochemical cells. Each of the electrochemical cells includes the first metal layer disposed on the substrate, a first electrode disposed on the first metal layer, a polymer layer disposed on the substrate and adjacent to the first metal layer and the first electrode. A second metal layer is disposed on the polymer layer, and a second electrode is disposed on the second metal layer. A pore is constituted between the polymer layers of every the two electrochemical cells. A cavity located above the first electrode is defined between every the two electrochemical cells, wherein the cavity is communicated with the pore.Type: GrantFiled: November 15, 2016Date of Patent: September 17, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jui-Chin Chen, Pei-Jer Tzeng, Tzu-Kun Ku, Yu-Chen Hsin, Yiu-Hsiang Chang
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Publication number: 20170343506Abstract: A structure of an electrochemical unit includes a substrate, a first metal layer disposed on the substrate, and an array of electrochemical cells disposed on the first metal layer. The array of the electrochemical cells includes a plurality of electrochemical cells. Each of the electrochemical cells includes the first metal layer disposed on the substrate, a first electrode disposed on the first metal layer, a polymer layer disposed on the substrate and adjacent to the first metal layer and the first electrode. A second metal layer is disposed on the polymer layer, and a second electrode is disposed on the second metal layer. A pore is constituted between the polymer layers of every the two electrochemical cells. A cavity located above the first electrode is defined between every the two electrochemical cells, wherein the cavity is communicated with the pore.Type: ApplicationFiled: November 15, 2016Publication date: November 30, 2017Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jui-Chin CHEN, Pei-Jer TZENG, Tzu-Kun KU, Yu-Chen HSIN, Yiu-Hsiang CHANG
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Publication number: 20140175655Abstract: A chip bonding structure at least includes a first substrate, a second substrate opposite to the first substrate, and a copper bonding structure sandwiched in between the first and the second substrates. A Cu—Cu bonding interface is within the copper bonding structure and is characterized with combinations of protrusions and recesses, and the copper crystallization orientation at one side of the Cu—Cu bonding interface is different from that at another side.Type: ApplicationFiled: June 6, 2013Publication date: June 26, 2014Inventors: Jui-Chin Chen, Cha-Hsin Lin, Tzu-Kun Ku
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Publication number: 20120322249Abstract: In a manufacturing method of a semiconductor structure, a substrate having a front surface and a back surface is provided. The front surface has a device layer thereon and conductive plugs electrically connected to the device layer. A thinning process is performed on the back surface of the substrate, such that the back surface of the substrate and surfaces of the conductive plugs have a distance therebetween. Holes are formed in the substrate from the back surface to the conductive plugs, so as to form a porous film. An oxidization process is performed, such that the porous film correspondingly is reacted to form an oxide material layer. A polishing process is performed on the oxide material layer to expose the surfaces of the conductive plugs.Type: ApplicationFiled: August 28, 2012Publication date: December 20, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jui-Chin Chen, Cha-Hsin Lin, John H. Lau, Tzu-Kun Ku
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Publication number: 20120119375Abstract: In a manufacturing method of a semiconductor structure, a substrate having a front surface and a back surface is provided. The front surface has a device layer thereon and conductive plugs electrically connected to the device layer. A thinning process is performed on the back surface of the substrate, such that the back surface of the substrate and surfaces of the conductive plugs have a distance therebetween. Holes are formed in the substrate from the back surface to the conductive plugs, so as to form a porous film. An oxidization process is performed, such that the porous film correspondingly is reacted to form an oxide material layer. A polishing process is performed on the oxide material layer to expose the surfaces of the conductive plugs.Type: ApplicationFiled: December 14, 2010Publication date: May 17, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jui-Chin Chen, Cha-Hsin Lin, John H. Lau, Tzu-Kun Ku
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Patent number: 6431428Abstract: A pneumatic nail gun has a body, a handle extending from one end of the body, a barrel mounted on the other end of the body, a magazine pivotally connected to the barrel and assembly for positioning the magazine arranged in the body. With such a pneumatic nail gun, the magazine can be rotated and positioned to a desired angle relative to the barrel. Consequently, the pneumatic nail gun can accommodate different types of nails without changing to a different magazine.Type: GrantFiled: October 16, 2000Date of Patent: August 13, 2002Inventor: Jui-Chin Chen
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Patent number: 4949780Abstract: An air circulating apparatus includes a housing which is separated into a front room and a rear room. A heat exchanging wheel is rotatably disposed in one side of the housing between the front room and the rear room. An induced draft fan and an exhaust fan are disposed in another side of the housing and respectively located within the front room and the rear room. Indoor air is drawn through a lower portion of the heat exchanging wheel by the exhaust fan, and flows out of a building. Outdoor air is drawn through an upper portion of the heat exchanging wheel by the induced draft fan and flows into the building.Type: GrantFiled: January 12, 1990Date of Patent: August 21, 1990Assignee: Rexon Industrial Corp. Ltd.Inventor: Jui-Chin Chen