Patents by Inventor Jui-Chin Peng

Jui-Chin Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Piezoelectric transducer
    Patent number: 10536780
    Abstract: A piezoelectric transducer including a substrate, a piezoelectric layer and a stiffening structure is provided. The substrate has a chamber. The piezoelectric layer has a displacement zone, a plurality of sensing zones, a plurality of gaps, a plurality of top electrodes, and a plurality of bottom electrodes. The displacement zone is located over the chamber. The sensing zones are surroundingly connected to an outer edge of the displacement zone and are located over the chamber. The gaps are each formed between any adjacent two of the plurality of sensing zones, and each of the gaps communicates with the chamber. The top electrodes are each disposed on a top surface of each of the sensing zones. The bottom electrodes are each disposed on a bottom surface of each of the sensing zones. The stiffening structure is disposed on a bottom of the displacement zone.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: January 14, 2020
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Jui-Chin Peng
  • PIEZOELECTRIC TRANSDUCER
    Publication number: 20190222940
    Abstract: A piezoelectric transducer including a substrate, a piezoelectric layer and a stiffening structure is provided. The substrate has a chamber. The piezoelectric layer has a displacement zone, a plurality of sensing zones, a plurality of gaps, a plurality of top electrodes, and a plurality of bottom electrodes. The displacement zone is located over the chamber. The sensing zones are surroundingly connected to an outer edge of the displacement zone and are located over the chamber. The gaps are each formed between any adjacent two of the plurality of sensing zones, and each of the gaps communicates with the chamber. The top electrodes are each disposed on a top surface of each of the sensing zones. The bottom electrodes are each disposed on a bottom surface of each of the sensing zones. The stiffening structure is disposed on a bottom of the displacement zone.
    Type: Application
    Filed: March 7, 2018
    Publication date: July 18, 2019
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Jui-Chin Peng
  • MANUFACTURING METHOD OF ELECTRONIC PACKAGING
    Publication number: 20140007425
    Abstract: A manufacturing method of electronic packaging includes the steps of preparing a metallic plate having an array of cover portions, soldering the metallic plate to a circuit board having encapsulated areas corresponding to the cover portions and employing a cutting process to obtain multiple electronic packages.
    Type: Application
    Filed: July 5, 2012
    Publication date: January 9, 2014
    Applicant: MERRY ELECTRONICS CO., LD
    Inventors: Ju-Mei LU, Yao-Min Huang, Jui-Chin Peng, Shih-Ting Yang, Chao-Ching Huang