Abstract: The invention relates to an aqueous cleaning composition for use in a cleaning process during or after a chemical mechanical planarization for a copper integrated circuit processing, comprising 0.05 to 20 wt % of a nitrogen-containing heterocyclic organic base, 0.05 to 50 wt % of an alcohol amine, 0.01-10 wt % of a quaternary ammonium hydroxide, and water. When used during or after the planarization process, the inventive cleaning composition of the invention can effectively remove residual contaminants from the surfaces of the wafers and simultaneously maintain a good surface roughness of the wafers.

Abstract: The invention relates to an aqueous cleaning composition for use in a cleaning process during or after a chemical mechanical planarization for a copper integrated circuit processing, comprising 0.05 to 20 wt % of a nitrogen-containing heterocyclic organic base, 0.05 to 50 wt % of an alcohol amine, 0.01-10 wt % of a quaternary ammonium hydroxide, and water. When used during or after the planarization process, the inventive cleaning composition of the invention can effectively remove residual contaminants from the surfaces of the wafers and simultaneously maintain a good surface roughness of the wafers.

Abstract: A valve device includes a housing including a peripheral valve seat extended into a chamber, to separate the chamber into two separated spaces. A valve member includes an outer peripheral groove to receive a sealing ring for engaging with the peripheral valve seat of the housing, to make a seal between the valve member and the peripheral valve seat, and a casing is secured to the valve member. A spring member may bias the casing away from the peripheral valve seat, to force the sealing ring of the valve member against the peripheral valve seat, and to make a fluid tight seal between the valve member and the peripheral valve seat.