Patents by Inventor Jui-Feng Chen

Jui-Feng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package and method for fabricating the same
    Patent number: 10431535
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: October 1, 2019
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Jui-Feng Chen, Chia-Cheng Hsu, Wen-Jung Tsai, Chia-Cheng Chen, Cheng Kai Chang
  • ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20180331027
    Abstract: An electronic package and a method for fabricating the same are provide. An antenna substrate is stacked on a carrier structure stacking assembly. Since no additional layout area is required to be added to the carrier structure stacking assembly, the length of an antenna can be designed as required, and the antenna can thus meet its operational requirement.
    Type: Application
    Filed: July 31, 2017
    Publication date: November 15, 2018
    Inventors: Jui-Feng Chen, Kai-Chang Cheng
  • ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20180316083
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.
    Type: Application
    Filed: August 18, 2017
    Publication date: November 1, 2018
    Inventors: Jui-Feng Chen, Chia-Cheng Hsu, Wen-Jung Tsai, Chia-Cheng Chen, Cheng Kai Chang