Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Abstract: A Universal Serial Bus (USB) keyboard-video-mouse (KVM) switch for connection between at least one host and at least one USB device is disclosed. The USB KVM switch includes a first virtual USB hub, a first virtual USB device, a microprocessor and a first multi-address USB device control module. The first virtual USB hub is configured to communicate with a first host. The first virtual USB device is configured to communicate with the first host via the first virtual USB hub, and is provided with endpoint setting data identical with that of a first USB device. The microprocessor is configured to generate the first virtual USB hub, and enumerate the first USB device in response to electrical connection of the first USB device to the USB KVM switch.

Abstract: A method for making a hollow box includes a step of cutting a plate into identification members; a step of sucking the plate to be attached on a fixed area of a female mold by a suction device; a step of squeezing melting and semi-solidified thermo-plastic material and sealing a lower end of the melting and semi-solidified thermo-plastic material, the melting and semi-solidified thermo-plastic material being expanded by the air introduced therein; a step of clamping the melting and semi-solidified thermo-plastic material by a female mold and a male mold; a step of expanding the melting and semi-solidified thermo-plastic material until the melting and semi-solidified thermo-plastic material contacts against insides of the female and male molds; a step of melting the surface of the identification member which is connected to the hollow box; a step of cooling obtaining the product by separating the female and male molds.