Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Abstract: An electronic device including a panel, a Chip on Film and a flexible circuit board is disclosed. The panel includes a first gate driver, a switch transistor and a driving transistor. An output terminal of the switch transistor is coupled to a control terminal of the driving transistor. The first gate driver is used for receiving an AC signal and a DC signal and outputting a control signal to a control terminal of the switch transistor. The Chip on Film is electrically connected to the panel and used for transmitting a data signal to an input terminal of the switch transistor and transmitting the AC signal to the first gate driver. The flexible circuit board is electrically connected to the panel and used for transmitting a power signal to an input terminal of the driving transistor and transmitting the DC signal to the first gate driver.

Abstract: An electronic device including a panel, a Chip on Film and a flexible circuit board is disclosed. The panel includes a first gate driver, a switch transistor and a driving transistor. An output terminal of the switch transistor is coupled to a control terminal of the driving transistor. The first gate driver is used for receiving an AC signal and a DC signal and outputting a control signal to a control terminal of the switch transistor. The Chip on Film is electrically connected to the panel and used for transmitting a data signal to an input terminal of the switch transistor and transmitting the AC signal to the first gate driver. The flexible circuit board is electrically connected to the panel and used for transmitting a power signal to an input terminal of the driving transistor and transmitting the DC signal to the first gate driver.

Abstract: A drainage switch that can be used to extract and clean impurities is provided, which is mainly equipped with a set of elastic water stop plugs. The elastic water stop plug is composed of a main body around with elastic blocks, a pressure positioning piece, a lifting piece, and springs that are arranged inside the shaft tube of the main body, and a plug cap that is locked in the pressure positioning piece. The elastic blocks can be elastically against with a water pipe, so that the elastic water stop plug can be elastically clamped in a water pipe, which is easy to install and replace, and easy to take out and clean dirt.

Abstract: An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.

Abstract: A display panel including a first current source and a first pixel unit is provided. The first pixel unit includes a first switch and a first light-emitting diode. The first switch is coupled to the first current source and receives a first scan signal. When the first scan signal is enabled, the first switch is turned on and receives a first current provided by the first current source. The first light-emitting diode is coupled to the first switch. When the first switch is turned on, the first current passes through the first light-emitting diode to turn on the first light-emitting diode.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.

Abstract: A semiconductor device includes a first display unit and a second display unit. The first display unit includes a first substrate, first light-emitting units, and a first gate driver circuit. The first substrate includes a first display region. The first substrate has a first side and a second side. The first light-emitting units are disposed in the first display region. The first gate driver circuit is disposed in the first display region. The second display unit is adjacent to the first display unit. The second display unit includes a second substrate. The second substrate includes a second display region, second light-emitting units, and a second gate driver circuit. The second substrate has a third side and a fourth side. The second light-emitting units are disposed in the second display region. A second gate driver circuit is disposed in the second display region.

Abstract: A driving circuit includes a driving unit, a light-emitting element, and a detection unit. The driving unit has a first terminal coupled to a first voltage source, a second terminal coupled to a data line to receive a plurality of display data, and a third terminal coupled to a first node. The driving unit provides a driving signal to the first node according to the plurality of display data. The light-emitting element has a first terminal coupled to the first node and a second terminal coupled to a second voltage source. The detection unit is coupled to the first node and a detection node. In a test mode, when the driving unit provides the driving signal, the detection unit detects a potential of the first node to generate a detection signal which is used to indicate a state of the light-emitting element or the detection unit.

Abstract: A fabricating method for a display apparatus is provided. The fabricating method for the display apparatus includes the following steps. An array substrate having a first electrode and a second electrode is provided. A first light emitting diode is heated to soften a first bump between the first electrode and the first light emitting diode, the first light emitting diode is bonded onto the first electrode by the first bump. The first light emitting diode and a second light emitting diode are heated to soften the first bump and a second bump between the second electrode and the second light emitting diode, the second light emitting diode is bonded onto the second electrode by the second bump, and the first light emitting diode and the second light emitting diode are pressed.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: A display device is provided. The display device includes a plurality of pixels. At least one of the pixels includes a semiconductor device having a light-emitting area, a first light conversion layer disposed on the semiconductor device and a first scattering layer disposed on the semiconductor device. The first scattering layer is disposed on the first light conversion layer.

Abstract: A fabricating method for a display apparatus is provided. The fabricating method for the display apparatus includes the following steps. An array substrate having a first electrode and a second electrode is provided. A first light emitting diode is heated to soften a first bump between the first electrode and the first light emitting diode, the first light emitting diode is bonded onto the first electrode by the first bump. The first light emitting diode and a second light emitting diode are heated to soften the first bump and a second bump between the second electrode and the second light emitting diode, the second light emitting diode is bonded onto the second electrode by the second bump, and the first light emitting diode and the second light emitting diode are pressed.

Abstract: A light-emitting diode display device is provided, including: a substrate, including a plurality of grooves, wherein an electrical contact is disposed in each of the grooves; and a plurality of light-emitting diodes, configured to be installed in the grooves, wherein each of the light-emitting diodes includes: a main body; and a first contact and a second contact, disposed on the main body, wherein the first contact and the second contact are respectively electrically connected to the substrate through the corresponding electrical contacts.